Multi-channel dome camera system

Abstract

The utility model discloses a multi-channel dome camera system, and relates to the technical field of optical imaging devices. The spherical camera is rotatably mounted on the bracket; the dome camera comprises a first image sensor used for imaging based on visible light and short wave infrared light; the second image sensor is used for imaging based on the medium-wave infrared light; the third image sensor is used for imaging based on long-wave infrared light; the fourth image sensor is used for imaging based on terahertz light; and the fifth image sensor is used for imaging based on solar blind ultraviolet light. The dome camera is based on five image sensors, can perform imaging in different wavebands based on multiple channels, can fully utilize the advantages of the photoelectric sensing technology of each waveband, can obtain comprehensive and accurate air target information, improves the target recognition capability of an air detection system, and achieves the all-weather and high-resolution imaging effect.

Description

Technical Field

[0001] The present application relates to the technical field of optical imaging devices, and in particular to a multi-channel ball camera system. Background Art

[0002] With the continuous development of aerospace technology, radio technology, radar technology, infrared technology, acoustic detection technology, laser technology, sensor technology and early warning technology have been widely used in air detection systems. At the same time, air targets have gradually become more complex and diverse, resulting in greater challenges for air detection technology. Therefore, it is necessary to improve the identification capability of air detection technology for complex and diverse air targets, so as to achieve all-weather, high-resolution imaging and obtain more comprehensive and accurate air target information. In order to obtain comprehensive and accurate air target information, it is necessary to provide a full-spectrum air target ball camera system. Utility Model Content

[0003] In view of the above problems, this application provides a multi-channel ball camera system to achieve full-spectrum air detection and all-weather, high-resolution imaging. The specific solution is as follows:

[0004] A multi-channel ball machine system, comprising:

[0005] Bracket;

[0006] Dome camera, the dome camera is rotatably mounted on a bracket;

[0007] Among them, the dome camera includes:

[0008] A first image sensor, configured to image based on visible light and short-wave infrared light;

[0009] a second image sensor for imaging based on mid-wave infrared light;

[0010] a third image sensor for imaging based on long-wave infrared light;

[0011] A fourth image sensor for imaging based on terahertz light;

[0012] The fifth image sensor is used for imaging based on solar-blind ultraviolet light.

[0013] Optionally, in the above multi-channel ball camera system, the first image sensor includes a photosensitive chip capable of simultaneously sensing visible light and short-wave infrared light; or, the first image sensor includes two photosensitive chips, and the two photosensitive chips are capable of respectively sensing visible light and short-wave infrared light;

[0014] The second image sensor includes a photosensitive chip capable of sensing mid-wave infrared light;

[0015] The third image sensor includes a photosensitive chip capable of sensing long-wave infrared light;

[0016] The fourth image sensor includes a photosensitive chip capable of sensing terahertz light;

[0017] The fifth image sensor includes a photosensitive chip capable of sensing solar-blind ultraviolet light.

[0018] Optionally, in the above multi-channel ball camera system, the ball camera includes:

[0019] The housing has a cavity, and each photosensitive chip is fixedly arranged in the cavity in a coplanar manner, and the photosensitive sides of the photosensitive chips are all facing the top of the cavity; the top of the cavity has a plurality of light entrance windows arranged one by one corresponding to the photosensitive chips;

[0020] A telescope module covering the light entrance window is arranged on the top outer side of the cavity, and the telescope module is at least used to converge the light and then incident on the relative photosensitive chip, and filter out stray light other than the light that can be sensed by the relative photosensitive chip.

[0021] Optionally, in the above-mentioned multi-channel ball camera system, the telescope module includes: at least one lens for converging light; and a filter film for filtering out stray light other than the light that can be sensed by the corresponding photosensitive chip.

[0022] Optionally, in the above multi-channel ball camera system, the ball camera further includes:

[0023] A circuit board assembly, wherein the photosensitive chip is fixed on one side surface of the circuit board assembly;

[0024] A battery assembly, the battery assembly is located on a side of the circuit board assembly away from the photosensitive chip, and is used to supply power to the photosensitive chip through the circuit board assembly;

[0025] The refrigeration assembly is located on the side of the battery assembly away from the circuit board assembly and is used to reduce the temperature inside the dome camera.

[0026] Optionally, in the above multi-channel ball camera system, the circuit board assembly is an integrated printed circuit board, and the photosensitive chips are respectively fixedly connected to different areas on the same side surface of the printed circuit board;

[0027] Alternatively, the circuit board assembly includes sub-boards corresponding to the photosensitive chips one by one, the sub-boards are arranged in the same plane, and the same side surface of the sub-boards is respectively fixedly connected to a corresponding photosensitive chip.

[0028] Optionally, in the above-mentioned multi-channel ball camera system, the battery assembly includes a battery, and the battery supplies power to each photosensitive chip simultaneously through the circuit board assembly;

[0029] Alternatively, the battery assembly includes a plurality of batteries corresponding one to one with the photosensitive chips, and the batteries supply power to the corresponding photosensitive chips through the circuit board assembly.

[0030] Optionally, in the above multi-channel ball camera system, the refrigeration component includes a refrigeration module, and the refrigeration component dissipates heat for each photosensitive chip through the same refrigeration module;

[0031] Alternatively, the refrigeration component includes a plurality of refrigeration modules corresponding one to one with the photosensitive chips, and the photosensitive chips dissipate heat based on the corresponding refrigeration modules respectively.

[0032] Optionally, in the above-mentioned multi-channel ball camera system, the ball camera further includes: a fan assembly for accelerating the gas flow rate in the ball camera.

[0033] Optionally, in the above multi-channel ball camera system, the ball camera includes: at least one of a communication module, an image processor, a network interface, and a wire connection port;

[0034] The communication module is used to connect the multi-channel ball camera system to the Internet and other intelligent hardware;

[0035] The image processor is at least used for fusing images formed by different image sensors;

[0036] The network interface is used for data exchange between the multi-channel ball camera system and other devices, equipment expansion, and connection to solar cell power supply;

[0037] The power supply port is used to connect the multi-channel ball camera system to an external power supply.

[0038] By means of the above technical solution, the multi-channel ball camera system provided by the present application includes a bracket and a spherical camera rotatably mounted on the bracket. The spherical design camera includes: a first image sensor for imaging based on visible light and short-wave infrared light; a second image sensor for imaging based on medium-wave infrared light; a third image sensor for imaging based on long-wave infrared light; a fourth image sensor for imaging based on terahertz light; and a fifth image sensor for imaging based on day-blind ultraviolet light. The ball camera is based on five image sensors and can perform imaging in different bands based on multiple channels. It can make full use of the advantages of photoelectric sensing technology in each band (full-spectrum air ball camera system), obtain comprehensive and accurate information on aerial targets, enhance the target recognition capability of the air detection system, and achieve all-weather, high-resolution imaging effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related technologies, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0040] The structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with this technology. They are not used to limit the conditions under which this application can be implemented, and therefore have no substantive technical significance. Any structural modification, change in proportion or adjustment of size, without affecting the effects and purposes that can be achieved by this application, should still fall within the scope of the technical contents disclosed in this application.

[0041] Figure 1 A schematic diagram of the structure of a multi-channel ball camera system provided in an embodiment of the present application;

[0042] Figure 2 for Figure 1 The cross-sectional view of the dome camera in the multi-channel dome camera system along the A-A' direction is shown;

[0043] Figure 3 A schematic diagram of the structure of another multi-channel ball camera system provided in an embodiment of the present application;

[0044] Figure 4 for Figure 3 The cross-sectional view of the dome camera in the multi-channel dome camera system along the BB' direction is shown;

[0045] Figure 5 A schematic diagram of the structure of another multi-channel ball camera system provided in an embodiment of the present application;

[0046] Figure 6 for Figure 5 The cross-sectional view of the dome camera in the multi-channel dome camera system along the A-A' direction is shown;

[0047] Figure 7 A schematic diagram of the structure of another multi-channel ball camera system provided in an embodiment of the present application;

[0048] Figure 8 for Figure 7 The cross-sectional view of the dome camera in the multi-channel dome camera system along the BB' direction is shown;

[0049] Fig. 9 A cross-sectional view of a dome camera in a multi-channel dome camera system provided in an embodiment of the present application;

[0050] Fig.10A cross-sectional view of another dome camera system in a multi-channel dome camera system provided in an embodiment of the present application;

[0051] Fig.11 A cross-sectional view of a dome camera in another multi-channel dome camera system provided in an embodiment of the present application;

[0052] Fig.12 A cross-sectional view of a dome camera in another multi-channel dome camera system provided in an embodiment of the present application;

[0053] Fig.13 A cross-sectional view of a dome camera in another multi-channel dome camera system provided in an embodiment of the present application;

[0054] Fig.14 A cross-sectional view of a dome camera in another multi-channel dome camera system provided in an embodiment of the present application.

[0055] Reference numerals:

[0056] 11- bracket; 12- photosensitive chip; 13- telescope module; 131- lens; 132- filter film; 14- shell; 141- cavity; 15- circuit board assembly; 151- daughter board; 152- printed circuit board; 16- battery assembly; 161- battery; 17- refrigeration assembly; 171- refrigeration module; 18- fan assembly; 19- wiring port; 20- spherical camera; 21- first image sensor; 22- second image sensor; 23- third image sensor; 24- fourth image sensor; 25- fifth image sensor; 26- communication module; 27- image processor; 28 network interface. DETAILED DESCRIPTION

[0057] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the embodiments of the present application. It is known to those skilled in the art that with the development of technology and the emergence of new scenarios, the technical solutions provided in the embodiments of the present application are also applicable to similar technical problems.

[0058] Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application. The terms used in the embodiments of the present application are only used to explain the specific embodiments of the present application, and are not intended to limit the present application.

[0059] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the present application is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0060] refer to Figure 1 and Figure 2 , Figure 1 A schematic diagram of the structure of a multi-channel ball camera system provided in an embodiment of the present application is shown in FIG. Figure 2 for Figure 1 The sectional view of the ball camera in the multi-channel ball camera system along the A-A' direction is shown. The multi-channel ball camera system includes:

[0061] Bracket 11;

[0062] A ball camera 20, which is rotatably mounted on the bracket 11;

[0063] Wherein, the ball camera 20 comprises:

[0064] A first image sensor 21, the first image sensor 21 is used for imaging based on visible light and short-wave infrared light;

[0065] A second image sensor 22, the second image sensor 22 is used for imaging based on medium-wave infrared light;

[0066] A third image sensor 23, the third image sensor 23 is used for imaging based on long-wave infrared light;

[0067] A fourth image sensor 24, the fourth image sensor 24 is used for imaging based on terahertz light;

[0068] The fifth image sensor 25 is used for imaging based on solar-blind ultraviolet light.

[0069] In the multi-channel ball camera system provided in the embodiment of the present application, the ball camera 20 is based on five image sensors and can perform imaging in different bands based on multiple channels. It can fully utilize the advantages of photoelectric sensing technology in each band (full-spectrum air-to-air ball camera system), obtain comprehensive and accurate information on aerial targets, enhance the target recognition capability of the air-to-air detection system, and achieve all-weather, high-resolution imaging effects.

[0070] The multi-channel ball camera system provided in the embodiment of the present application can perform full-spectrum imaging in day-blind ultraviolet light, visible light, short-wave infrared, medium-wave infrared light, long-wave infrared light and terahertz light. The imaging spectrum range is 200nm~3mm. Among them, the spectrum range of day-blind ultraviolet light that can be sensed by the fifth image sensor 25 can be 200nm~280nm. The spectrum range of visible light that can be sensed by the first image sensor 21 is 390nm~780nm, and the spectrum range of short-wave infrared light that can be sensed is 0.9μm~3μm. The spectrum range of medium-wave infrared light that can be sensed by the second image sensor 22 is 3μm~5μm. The spectrum range of long-wave infrared light that can be sensed by the third image sensor 23 is 8μm~12.5μm. The spectrum range of terahertz light that can be sensed by the fourth image sensor 24 is 30μm~3mm.

[0071] Compared with conventional imaging technology, the full-spectrum multi-channel ball camera system provided by the present application integrates a fifth image sensor 25 capable of imaging based on solar-blind ultraviolet light and a fourth image sensor 24 capable of imaging based on terahertz light. Based on the solar-blind ultraviolet image collected by the fifth image sensor 25, the interference of sunlight background (solar radiation) on the identification of aerial targets can be eliminated, thereby improving the comprehensiveness and accuracy of the full-spectrum multi-channel ball camera system in capturing aerial target information.

[0072] In addition, based on the terahertz image collected by the fourth image sensor 24, the imaging resolution of the full-spectrum multi-channel ball camera system can be improved, so that the multi-channel ball camera system can detect small targets, and the positioning accuracy of aerial targets is high. It can be used for early warning of aerial targets. The tail flame molecules of aerial targets can absorb energy in the terahertz frequency band and form absorption lines in a specific frequency range on the spectrum. Through spectral analysis, the missile tail flame can be identified, and close tracking and monitoring of aerial targets can be achieved. The shutdown time of the aerial target engine can be accurately determined to defend the aerial target. Therefore, the multi-channel ball camera system has a large broadband range and can transmit multiple frequency signals, which breaks the existing stealth technology and has the ability to identify aerial stealth targets.

[0073] In one implementation of the present application, Figure 1 and Figure 2 As shown, the first image sensor 21 includes two photosensitive chips 12, which can sense visible light and short-wave infrared light respectively, that is, one photosensitive chip 12 in the first image sensor 21 can sense visible light, and the other photosensitive chip can sense short-wave infrared light; the second image sensor 22 includes a photosensitive chip 12 that can sense medium-wave infrared light; the third image sensor 23 includes a photosensitive chip 12 that can sense long-wave infrared light; the fourth image sensor 24 includes a photosensitive chip 12 that can sense terahertz light; and the fifth image sensor 25 includes a photosensitive chip 12 that can sense day-blind ultraviolet light. In this method, the first image sensor 21 is provided with two photosensitive chips 12, and the second image sensor 22 to the fifth image sensor 25 each have one photosensitive chip 12.

[0074] exist Figure 1 and Figure 2In the illustrated method, there are a total of 6 photosensitive chips 12, which can be used to detect visible light, short-wave infrared light, medium-wave infrared light, long-wave infrared light, terahertz light and day-blind ultraviolet light respectively. One photosensitive chip 12 corresponds to one photosensitive channel, so this method can have 6 photosensitive channels, which can significantly improve the target recognition capability of the full-spectrum multi-channel ball camera system in the field of air detection, obtain comprehensive and accurate air target information, and achieve all-weather, high-resolution imaging effects.

[0075] refer to Figure 3 and Figure 4 , Figure 3 A schematic diagram of the structure of another multi-channel ball camera system provided in an embodiment of the present application, Figure 4 for Figure 3 The cross-sectional view of the ball camera in the multi-channel ball camera system along the B-B' direction is shown, based on Figure 1 and Figure 2 The difference between the illustrated method and the illustrated method is that the first image sensor 21 includes a photosensitive chip 12 that can sense both visible light and short-wave infrared light. Figure 1 and Figure 2 In the same manner, the second image sensor 22 includes a photosensitive chip 12 capable of sensing mid-wave infrared light; the third image sensor 23 includes a photosensitive chip 12 capable of sensing long-wave infrared light; the fourth image sensor 24 includes a photosensitive chip 12 capable of sensing terahertz light; and the fifth image sensor 25 includes a photosensitive chip 12 capable of sensing day-blind ultraviolet light. In this manner, the first image sensor 21 to the fifth image sensor 25 are each provided with a photosensitive chip 12.

[0076] exist Figure 3 and Figure 4 In the illustrated method, there are a total of 5 photosensitive chips 12, one of the 5 photosensitive chips 12 is used to detect visible light and short-wave infrared light at the same time, and the other 4 photosensitive chips 12 are used to detect medium-wave infrared light, long-wave infrared light, terahertz light and day-blind ultraviolet light respectively. One photosensitive chip 12 corresponds to one photosensitive channel, so this method can have 5 photosensitive channels, which can significantly improve the target recognition capability of the full-spectrum multi-channel ball camera system in the field of air detection, obtain comprehensive and accurate air target information, and achieve all-weather, high-resolution imaging effects.

[0077] In the embodiment of the present application, the photosensitive chip 12 can be a CCD chip or a CMOS chip, which can make the multi-channel ball-type machine system have the advantages of strong portability, easy operation, high human eye recognition rate and strong concealment, and can be used for high-definition imaging of aerial targets.

[0078] Optionally, the photosensitive chips 12 are coplanarly arranged inside the dome camera 20 to facilitate installation of the photosensitive chips 12 inside the dome camera 20 .

[0079] The photosensitive chips 12 may be arranged on the same circle and evenly distributed on the circle. In other embodiments, the photosensitive chips 12 may be arranged in sequence on the same straight line or in a dot matrix arrangement.

[0080] The first image sensor 21 includes a photosensitive chip 12 capable of sensing short-wave infrared light. This type of photosensitive chip 12 has strong weather adaptability, stronger ability to penetrate fog, haze, smoke, and dust, higher recognition, clearer target details, and longer effective detection distance. It is often used for high-definition imaging of aerial targets in complex environments.

[0081] The second image sensor 22 includes a photosensitive chip 12 capable of sensing medium-wave infrared light. This type of photosensitive chip 12 has the advantages of strong environmental adaptability, long detection distance, and high spatial resolution.

[0082] The third image sensor 23 includes a photosensitive chip 12 capable of sensing long-wave infrared light. This type of photosensitive chip 12 can provide accurate temperature information of aerial targets, has strong environmental adaptability, long detection distance, strong penetration ability, and other advantages, providing strong support for the detection of aerial targets.

[0083] Based on any of the above implementations, Figure 5-Figure 8 As shown, the dome camera 20 includes: a shell 14, the shell 14 has a cavity 141, and each photosensitive chip 12 is fixedly arranged in the cavity 141 on the same plane, and the photosensitive sides of the photosensitive chips 12 are all facing the top of the cavity 141; the top of the cavity 141 has a plurality of light entrance windows arranged one by one corresponding to the photosensitive chips 12; a telescope module 13 covering the light entrance window is arranged on the outer side of the top of the cavity 141, and the telescope module 13 is at least used to make the light converge and then be incident on the relative photosensitive chip 12, and filter out stray light other than the light that can be sensed by the relative photosensitive chip 12.

[0084] refer to Figure 5 and Figure 6 , Figure 5 A schematic diagram of the structure of another multi-channel ball camera system provided in an embodiment of the present application is shown in FIG. Figure 6 for Figure 5 The cross-sectional view of the dome camera in the multi-channel dome camera system along the A-A' direction is shown in FIG. Figure 1 and Figure 2 Based on the method shown, Figure 5 and Figure 6 In the illustrated embodiment, six telescope modules 13 corresponding to the six photosensitive chips 12 are disposed on the top outer side of the housing 14 .

[0085] refer to Figure 7 and Figure 8 , Figure 7 A schematic diagram of the structure of another multi-channel ball camera system provided in an embodiment of the present application is shown in FIG. Figure 8 for Figure 7 The cross-sectional view of the dome camera in the multi-channel dome camera system along the B-B' direction is shown in FIG. Figure 3 and Figure 4 Based on the method shown, Figure 5 and Figure 6 In the illustrated embodiment, five telescope modules 13 corresponding to the five photosensitive chips 12 are disposed on the top outer side of the housing 14 .

[0086] The size and position of each telescope module 13 can be adjusted based on the size and position of the corresponding photosensitive chip 12 below. The shape of the telescope module 13 is preferably circular, but can also be polygonal or other graphic structures. The embodiment of the present application does not limit the shape of the telescope module 13.

[0087] Regarding the photosensitive chip 12 in the first image sensor 21 , if the first image sensor 21 has one photosensitive chip 12 , the photosensitive chip 12 can sense visible light and short-wave infrared light, and the stray light other than the light that the photosensitive chip 12 can sense is light other than visible light and short-wave infrared light.

[0088] If the first image sensor 21 has a photosensitive chip 12, the photosensitive chip 12 can be any one of an InGaAs photosensitive chip, an InP photosensitive chip and a germanium on insulator (GOI) photosensitive chip. These photosensitive chips 12 can sense visible light and short-wave infrared light at the same time. Such photosensitive chips can not only provide clear images of visible light, but also cover the short-wave infrared wavelength range of 0.9μm to 1.7μm, and can obtain a wider range of spectral information and provide data in more dimensions.

[0089] As for the photosensitive chip 12 in the second image sensor 22 , the photosensitive chip 12 can sense medium-wave infrared light, and the stray light other than the light that the photosensitive chip 12 can sense is light other than the medium-wave infrared light.

[0090] As for the photosensitive chip 12 in the third image sensor 23 , the photosensitive chip 12 can sense long-wave infrared light, and the stray light other than the light that can be sensed by the photosensitive chip 12 is light other than the long-wave infrared light.

[0091] Regarding the photosensitive chip 12 in the fourth image sensor 24 , the photosensitive chip 12 can sense terahertz light, and the stray light other than the light that can be sensed by the photosensitive chip 12 is light other than terahertz light.

[0092] As for the photosensitive chip 12 in the fifth image sensor 25 , the photosensitive chip 12 can be day-blind to ultraviolet light, and the stray light other than the light that can be sensed by the photosensitive chip 12 is light other than the day-blind ultraviolet light.

[0093] like Figure 5-Figure 8 As shown, the telescope module 13 includes: at least one lens 131, the lens 131 is used to converge light; and a filter film 132, the filter film 132 is used to filter out stray light other than the light that can be sensed by the corresponding photosensitive chip 12.

[0094] The telescope module 13 can converge light through the lens 131, and can also adjust the imaging focal length based on the lens 131 to achieve a magnified imaging effect, so that the imaging quality is clearer.

[0095] In addition, the telescope module 13 can also reduce aberrations, such as chromatic aberration and spherical aberration, which usually appear in a simple lens system and affect the image quality through the material and parameter design of the lens 131. At the same time, the telescope module 13 can also integrate optical stabilization technology to reduce image blur caused by camera shake. The telescope module 13 can also be used in conjunction with image processing software to achieve automatic optimization of the image.

[0096] refer to Fig. 9 , Fig. 9 A cross-sectional view of a dome camera in a multi-channel dome camera system provided in an embodiment of the present application, based on any of the above implementations, Fig. 9 In the illustrated embodiment, the dome camera 20 further includes: a circuit board assembly 15, on which the photosensitive chip 12 is fixed; a battery assembly 16, which is located on the side of the circuit board assembly 15 away from the photosensitive chip 12, and is used to supply power to the photosensitive chip through the circuit board assembly; and a cooling assembly 17, which is located on the side of the battery assembly 16 away from the circuit board assembly 15, and is used to reduce the temperature inside the dome camera 20. The circuit board assembly 15 can realize circuit interconnection and data transmission in the dome camera 20.

[0097] The refrigeration component 17 can effectively dissipate heat for the dome camera 20, and the operating temperature of the internal image sensor can be increased by at least 80°C, thereby improving the ability of the multi-channel dome camera system to identify aerial targets in a high temperature environment, ensuring the comprehensiveness and accuracy of the acquired aerial target information and all-weather high-resolution imaging.

[0098] For ease of illustration, Fig. 9 FIG. 2 shows only one photosensitive chip 12 in the dome camera 20. As described above, the dome camera 20 may have five or six photosensitive chips 12.

[0099] The refrigeration component 17 may include a liquid nitrogen refrigeration device and / or a thermoelectric refrigeration device, which can provide a low-temperature environment, thereby improving the heat dissipation efficiency of the photosensitive chip 12 .

[0100] In the embodiment of the present application, the thermoelectric cooling device may include a TEC1 module and / or a TEC2 module, and both the TEC1 module and the TEC2 module realize cooling based on the Peltier effect of semiconductor materials. As two major components of the cooling module, the TEC1 module and the TEC2 module are based on the same semiconductor cooling technology. The TEC1 module is used for a wide range of temperature control applications, and the TEC2 module is used specifically for special needs in the field of optical communications.

[0101] Alternatively, if Fig. 9 As shown, the dome camera 20 further includes: a fan assembly 18, which is used to accelerate the gas flow rate in the dome camera 20 so that the high-temperature gas inside the dome camera 20 can be quickly dissipated into the external atmospheric environment to improve the heat dissipation efficiency of the photosensitive chip 12.

[0102] refer to Fig.10 , Fig.10 A cross-sectional view of another dome camera in a multi-channel dome camera system provided in an embodiment of the present application, based on any of the above implementations, Fig.10 In the illustrated embodiment, the circuit board assembly 15 includes sub-boards 151 corresponding one to one with the photosensitive chips 12 , the sub-boards 151 are arranged in the same plane, and the same side surface of the sub-boards 151 is respectively fixedly connected to a corresponding photosensitive chip 12 .

[0103] Alternatively, if Fig.10 As shown, the battery assembly 16 includes a plurality of batteries 161 corresponding one to one with the photosensitive chips 12 , and the batteries 161 supply power to the corresponding photosensitive chips 12 through the circuit board assembly 15 .

[0104] Alternatively, if Fig.10 As shown, the refrigeration assembly 17 includes a plurality of refrigeration modules 171 corresponding to the photosensitive chips 12 one by one, and the photosensitive chips 12 dissipate heat based on the corresponding refrigeration modules 171. Each refrigeration module 171 may include a liquid nitrogen refrigeration device and / or a thermoelectric refrigeration device.

[0105] refer to Fig.11 , Fig.11 A cross-sectional view of a dome camera in a multi-channel dome camera system provided in an embodiment of the present application, based on any of the above implementations, Fig.11 In the illustrated embodiment, the circuit board assembly 15 is an integrated printed circuit board 152 , and the photosensitive chips 12 are fixedly connected to different areas of the same side surface of the printed circuit board 152 .

[0106] Alternatively, if Fig.11 As shown, the battery assembly 16 includes a battery 161 , and the battery 161 supplies power to each photosensitive chip 12 simultaneously through the circuit board assembly 15 .

[0107] Alternatively, if Fig.11 As shown, the cooling component 17 includes a cooling module 171 , and the cooling component 17 dissipates heat for each photosensitive chip 12 through the same cooling module 171 .

[0108] refer to Fig.12 , Fig.12 A cross-sectional view of a dome camera in a multi-channel dome camera system provided in an embodiment of the present application, Fig.10 The difference between the methods shown is that Fig.12 In the illustrated embodiment, the first image sensor 21 is a structure of a single photosensitive chip 12 .

[0109] refer to Fig.13 , Fig.13 A cross-sectional view of a dome camera in a multi-channel dome camera system provided in an embodiment of the present application, Fig.11 The difference between the methods shown is that Fig.13 In the illustrated embodiment, the first image sensor 21 is a structure of a single photosensitive chip 12 .

[0110] In the multi-channel ball machine system provided in the embodiment of the present application, the layout of the circuit board assembly 15, the battery assembly 16, the cooling assembly 17 and the fan assembly 18 is not limited to Figure 10-13 In the manner shown, any one of the circuit board assembly 15 , the battery assembly 16 , the cooling assembly 17 and the fan assembly 18 can be individually arranged corresponding to each photosensitive chip 12 , or any one of the circuit board assembly 15 , the battery assembly 16 , the cooling assembly 17 and the fan assembly 18 can be shared by all the photosensitive chips 12 .

[0111] In any implementation of the embodiments of the present application, the circuit board assembly 15 includes a sub-board 151 corresponding to the photosensitive chip 12, the sub-board 151 is arranged in a coplanar manner, and the same side surface of the sub-board 151 is fixedly connected to a corresponding photosensitive chip 12, or the circuit board assembly 15 is an integrated printed circuit board 152, and the photosensitive chips 12 are fixedly connected to different areas on the same side surface of the printed circuit board 152.

[0112] In any implementation of the embodiments of the present application, the battery assembly 16 includes a plurality of batteries 161 corresponding one to one with the photosensitive chips 12, and the battery 161 supplies power to the corresponding photosensitive chips 12 through the circuit board assembly 15, or the battery assembly 16 includes one battery 161, and the battery 161 supplies power to each photosensitive chip 12 at the same time through the circuit board assembly 15.

[0113] In any implementation of the embodiments of the present application, the cooling component 17 includes a plurality of cooling modules 171 corresponding one to one with the photosensitive chips 12, and the photosensitive chips 12 dissipate heat based on the corresponding cooling modules 171, or the cooling component 17 includes one cooling module 171, and the cooling component 17 dissipates heat for each photosensitive chip 12 through the same cooling module 171.

[0114] Optionally, one fan assembly 18 or a plurality of fan assemblies 18 may be provided in the dome camera 20 .

[0115] refer to Fig.14 , Fig.14 A cross-sectional view of a dome camera in a multi-channel dome camera system provided in an embodiment of the present application, based on any of the above implementations, Fig.14 In the illustrated embodiment, the dome camera 20 includes at least one of a communication module 26 , an image processor 27 , a network interface 28 and a wiring port 19 .

[0116] Among them, the communication module 26 is used to connect the multi-channel ball camera system to the Internet and other intelligent hardware to expand the application of the full-spectrum six-channel ball camera system in the Internet of Things.

[0117] The image processor 27 is at least used for fusing images formed by different image sensors.

[0118] The network interface 28 is used to connect the multi-channel ball camera system to a network device, so that the multi-channel ball camera system and the network device can exchange data.

[0119] The power connection port 19 is used to connect the multi-channel ball camera system to an external power supply.

[0120] Optionally, the multi-channel ball camera system also includes a USB interface to facilitate data exchange between the channel ball camera system and other devices.

[0121] Based on the multi-channel ball camera system provided in the embodiment of the present application, after the full spectrum (day-blind ultraviolet light, visible light, short-wave infrared light, medium-wave infrared light, long-wave infrared light and terahertz light) radiation enters the telescope module 13, the first image sensor 21 to the fifth image sensor detect the aerial target respectively, and the image processor 27 processes the day-blind ultraviolet image, visible light image, short-wave infrared image, medium-wave infrared image, long-wave infrared image and terahertz image formed by each image sensor, and finally obtains a full-spectrum imaging picture.

[0122] Infrared image sensors of visible light-short-wave infrared light-medium-wave infrared light-long-wave infrared light play an important role in air detection systems. The radiation background of the earth's sky has the characteristics of relatively weak intensity and uniform spatial distribution in the solar-blind ultraviolet light band, which makes the characteristic radiation of aerial targets in the band outside the solar-blind ultraviolet light very rich. Therefore, solar-blind ultraviolet sensors have gradually developed into a new type of air detection technology, but the use of this technology alone will cause the problem of untimely discovery of air targets. The multi-channel ball camera system provided in the embodiment of the present application is a full-band air detection system that can integrate solar-blind ultraviolet light-visible light-short-wave infrared light-medium-wave infrared light-long-wave infrared light, which can significantly improve the ability of the full-spectrum ball camera system to discover air targets in air detection scenarios.

[0123] Based on the above description, it can be seen that the embodiment of the present application provides a new full-band multi-channel ball camera system, which significantly improves the target recognition capability of the multi-channel ball camera system in the field of air detection, can comprehensively and accurately obtain information on aerial targets, and achieves all-weather, high-resolution imaging effects.

[0124] As described above, each image sensor senses light and forms an image through a photosensitive chip 12 capable of sensing a corresponding light band. The photosensitive chip 12 includes an intrinsic photosensitive semiconductor layer capable of sensing light of a corresponding waveband.

[0125] For the first image sensor 21, if there are two photosensitive chips 12, the intrinsic photosensitive semiconductor layer in the photosensitive chip 12 for sensing visible light can be Si; the intrinsic photosensitive semiconductor layer in the photosensitive chip 12 for sensing short-wave infrared light can be any one of germanium on silicon-based insulator, germanium-tin on silicon-based insulator, germanium-lead on silicon-based insulator, indium-gallium-arsenic on silicon-based insulator, lead sulfide colloidal quantum dots on silicon-based insulator, mercury-cadmium-telluride on silicon-based insulator, etc.

[0126] The photosensitive chip 12 capable of sensing short-wave infrared light in the first image sensor 21 includes: a Si substrate; a SiO2 buried oxide layer, a semiconductor contact layer, an intrinsic photosensitive semiconductor layer and another semiconductor contact layer stacked in sequence on the surface of one side of the Si substrate. Among them, one of the two semiconductor contact layers is P-type doped and the other is N-type doped. The intrinsic photosensitive semiconductor layer is an intrinsic semiconductor material that can sense short-wave infrared light. In the embodiment of the present application, the photosensitive chip 12 capable of sensing short-wave infrared light is prepared based on a Si substrate, and has the performance advantages of low dark current, fast operating speed, low power consumption, strong radiation resistance, high responsiveness, high sensitivity, high quantum efficiency, high yield and easy mass production, and can also be formed on a large-size Si substrate, with low chip cost and a resonant cavity effect in the vertical direction.

[0127] For the second image sensor 22 , the intrinsic photosensitive semiconductor layer in the photosensitive chip 12 that can sense mid-wave infrared light can be any one of antimonide, mercury cadmium telluride (HgCdTe) and III-V group multiple quantum well materials.

[0128] For the third image sensor 23, the intrinsic photosensitive semiconductor layer in the photosensitive chip 12 that can sense long-wave infrared light can be any one of amorphous silicon (a-Si), vanadium oxide (VOx), amorphous germanium (a-Ge), amorphous germanium tin (a-GeSn), carbon nanotubes, etc.

[0129] For the fourth image sensor 24, the intrinsic photosensitive semiconductor layer in the photosensitive chip 12 that can sense terahertz light can be any one of the Group IV and Group III and V materials such as silicon on insulator, silicon germanium on insulator, germanium on insulator, germanium tin on insulator, gallium arsenide on insulator and indium gallium arsenic on insulator.

[0130] The photosensitive chip 12 capable of sensing terahertz light in the fourth image sensor 24 includes a Si substrate, a SiO2 buried oxide layer and an intrinsic photosensitive semiconductor layer capable of sensing terahertz light, which are sequentially stacked on the surface of one side of the Si substrate. In the embodiment of the present application, the photosensitive chip 12 capable of sensing terahertz light is prepared based on the Si substrate, and has the performance advantages of low dark current, fast operating speed, low power consumption, strong radiation resistance, high responsiveness, high sensitivity, high quantum efficiency, high yield, and easy mass production, and can also be formed on a large-size Si substrate, and the chip cost is low.

[0131] For the fifth image sensor 25, the photosensitive chip 12 includes a transparent substrate and an intrinsic photosensitive semiconductor layer on the substrate that can sense day-blind ultraviolet light. The intrinsic photosensitive semiconductor layer can be any one of Si, AlGaN, ZnMgO, ZnGaO, Ga2O3, etc.

[0132] Specifically, the photosensitive chip 12 capable of sensing day-blind ultraviolet light in the fifth image sensor 25 includes: a transparent substrate; an Al2O3 layer, a semiconductor contact layer, an intrinsic photosensitive semiconductor layer and another semiconductor contact layer stacked in sequence on the surface of one side of the transparent substrate. Among them, one of the two semiconductor contact layers is P-type doped and the other is N-type doped. The intrinsic photosensitive semiconductor layer is a semiconductor material that can sense day-blind ultraviolet light. The transparent substrate can be a sapphire or a glass substrate. In the embodiment of the present application, the photosensitive chip 12 capable of sensing day-blind ultraviolet light is prepared based on a transparent substrate, and has the performance advantages of low dark current, fast operating speed, low power consumption, strong radiation resistance, high responsiveness, high sensitivity, high quantum efficiency, high yield and easy mass production, and can also be formed on a large-size transparent substrate, the chip cost is low, and there is a resonant cavity effect in the vertical direction.

[0133] In the specification of this application, each embodiment is described in a progressive, parallel, or progressive and parallel manner, and each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other. The embodiments provided in the embodiments of this application can be combined with each other if there is no contradiction.

[0134] It should be noted that in the description of the present application, it should be understood that the description of the drawings and embodiments is illustrative rather than restrictive. The same reference numerals throughout the embodiments of the specification identify the same structure. In addition, for the sake of understanding and ease of description, the drawings may exaggerate the thickness of some layers, films, panels, regions, etc. It is also understood that when an element such as a layer, film, region, or substrate is referred to as "on" another element, the element may be directly on the other element or there may be an intermediate element. In addition, "on" refers to positioning an element on or below another element, but does not essentially refer to positioning on the upper side of another element according to the direction of gravity.

[0135] The terms "upper", "lower", "top", "bottom", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. When a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a centrally arranged component at the same time.

[0136] It should also be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprises", "comprising" or any other variants thereof are intended to cover non-exclusive inclusion, so that an article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such article or device. In the absence of further restrictions, the elements defined by the sentence "comprising a ..." do not exclude the existence of other identical elements in the article or device including the above elements.

[0137] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A multi-channel ball machine system, characterized in that: include: Bracket; A spherical camera, the spherical camera is rotatably mounted on the bracket; Wherein, the dome camera comprises: A first image sensor, used for imaging based on visible light and short-wave infrared light; the first image sensor includes a photosensitive chip capable of simultaneously sensing visible light and short-wave infrared light; or the first image sensor includes two photosensitive chips, the two photosensitive chips being capable of respectively sensing visible light and short-wave infrared light; A second image sensor, used for imaging based on medium-wave infrared light; the second image sensor includes a photosensitive chip capable of sensing medium-wave infrared light; A third image sensor, used for imaging based on long-wave infrared light; the third image sensor includes a photosensitive chip capable of sensing long-wave infrared light; A fourth image sensor, used for imaging based on terahertz light; the fourth image sensor comprises a photosensitive chip capable of sensing terahertz light; A fifth image sensor, used for imaging based on solar-blind ultraviolet light; the fifth image sensor comprises a photosensitive chip capable of sensing solar-blind ultraviolet light; A circuit board assembly, wherein the photosensitive chip is fixed on one side surface of the circuit board assembly; A battery assembly, the battery assembly being located on a side of the circuit board assembly away from the photosensitive chip, and being used to supply power to the photosensitive chip through the circuit board assembly; A refrigeration assembly is located on a side of the battery assembly away from the circuit board assembly and is used to reduce the temperature inside the dome camera.

2. The multi-channel ball machine system according to claim 1, characterized in that: The dome camera comprises: A shell, wherein the shell has a cavity, wherein the photosensitive chips are coplanarly fixedly arranged in the cavity, and the photosensitive sides of the photosensitive chips are all facing the top of the cavity; the top of the cavity has a plurality of light entrance windows arranged one by one corresponding to the photosensitive chips; A telescope module covering the light entrance window is arranged on the outer side of the top of the cavity, and the telescope module is at least used to converge the light and then incident on the relative photosensitive chip, and filter out stray light other than the light that can be sensed by the relative photosensitive chip.

3. The multi-channel ball machine system according to claim 2, characterized in that: The telescope module includes: at least one lens for converging light; and a filter film for filtering out stray light other than the light that can be sensed by the corresponding photosensitive chip.

4. The multi-channel ball machine system according to claim 1, characterized in that: The circuit board assembly is an integrated printed circuit board, and the photosensitive chips are respectively fixedly connected to different areas on the same side surface of the printed circuit board; Alternatively, the circuit board assembly includes sub-boards corresponding one to one with the photosensitive chips, the sub-boards are arranged in the same plane, and the same side surface of the sub-boards is respectively fixedly connected to a corresponding one of the photosensitive chips.

5. The multi-channel ball machine system according to claim 1, characterized in that: The battery assembly includes a battery, and the battery supplies power to each of the photosensitive chips simultaneously through the circuit board assembly; Alternatively, the battery assembly includes a plurality of batteries corresponding one to the photosensitive chips, and the batteries supply power to the corresponding photosensitive chips through the circuit board assembly.

6. The multi-channel ball machine system according to claim 1, characterized in that: The refrigeration component includes a refrigeration module, and the refrigeration component dissipates heat for each of the photosensitive chips through the same refrigeration module; Alternatively, the refrigeration component includes a plurality of refrigeration modules corresponding one to one with the photosensitive chips, and the photosensitive chips dissipate heat based on the corresponding refrigeration modules respectively.

7. The multi-channel ball machine system according to claim 1, characterized in that: The spherical camera further comprises: a fan assembly for accelerating the gas flow rate in the spherical camera.

8. The multi-channel ball camera system according to any one of claims 1 to 7, characterized in that: The dome camera comprises: at least one of a communication module, an image processor, a network interface and a wiring port; The communication module is used to connect the multi-channel ball camera system to the Internet; The image processor is at least used to fuse images formed by different image sensors; The network interface is used for data exchange between the multi-channel ball camera system and other devices, equipment expansion, and connection to solar cells for power supply; The power connection port is used to connect the multi-channel ball camera system to an external power supply.

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