High-brightness low-loss EMC ultraviolet LED lamp bead module
By using the EMC bracket and the conductive terminals integrated into one, and combined with the packaging technology of sapphire lenses, the existing LED brackets have solved the problems of complex structure, cumbersome assembly and high cost, and achieved high brightness, low loss, stable structure and simple assembly of EMC ultraviolet LED lamp bead module.
CN222885097UActive Publication Date: 2025-05-16GUANGDONGBEIDEANOPTOELECTRONICTECHNOLOGYCO LTD
Patent Information
- Application Number
- CN202421854348.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-01
- Publication Date
- 2025-05-16
- Estimated Expiration
- 2034-08-01
AI Technical Summary
Technical Problem
The existing LED brackets have complex structures, cumbersome assembly, and high costs, which affect market competitiveness.
Method used
The EMC bracket is used as the bracket, and is integrated with the conductive terminals through in-mold injection molding, and is packaged with sapphire lenses to form a high-brightness and low-loss EMC ultraviolet LED lamp bead module.
Benefits of technology
It realizes a LED module with stable structure, simple assembly and low cost, improves market competitiveness, and achieves a high-brightness and low loss luminous effect through high-light transmittance sapphire lenses.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN222885097U_ABST
Abstract
The utility model discloses a high-brightness low-loss EMC ultraviolet LED lamp bead module which comprises a support, an ultraviolet LED chip, a first conductive terminal and a second conductive terminal, the upper end of the support is provided with a concave position, and the second upper end face of the first conductive terminal and the second upper end face of the second conductive terminal are both exposed out of the bottom of the concave position. The lower end face of the first conductive terminal and the lower end face of the second conductive terminal serve as a first weld leg and a second weld leg respectively to be exposed out of the lower end face of the support, a first electrode of the ultraviolet LED chip is fixed to the upper end face of the first conductive terminal in an attached mode and arranged in the middle of the concave position, and a second electrode of the ultraviolet LED chip is connected with the second conductive terminal in a welded mode through a gold wire. The support is an EMC support made of EMC materials, the support is integrally connected and fixed with the first conductive terminal and the second conductive terminal in an in-mold injection molding mode, the first conductive terminal and the second conductive terminal are distributed in a spaced mode, a sapphire lens is fixedly attached to the upper end of the EMC support, and the sapphire lens covers an opening in the upper end of the concave position in a sealing mode.
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Citation Information
Patent Citations
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