Heat dissipation assembly and electronic equipment
By setting heat dissipation holes and partitions in the housing of the electronic device and optimizing the heat dissipation air duct, the cost problem caused by the increase in heat dissipation demand in fanless equipment is solved, and efficient heat dissipation effect and cost reduction are achieved.
Patent Information
- Application Number
- CN202421798008.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-26
- Publication Date
- 2025-06-06
- Estimated Expiration
- 2034-07-26
AI Technical Summary
In fanless electronic devices, in order to meet higher heat dissipation needs, it is necessary to increase the area of printed circuit boards and copper clads or increase the area of heat dissipation fins, resulting in increased costs.
By setting a heat dissipation hole and multiple partitions in the shell, the hot air in the shell is divided, and the heat dissipation air duct is optimized through the partition, the inner wall of the shell and the heat dissipation hole to improve the heat dissipation effect.
It realizes that the heat dissipation effect is improved without increasing the equipment volume and cost, reduces production costs, and improves the stability of electronic components at high temperatures.
Smart Images
Figure CN222954277U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of electronic technology, and in particular to a heat dissipation component and an electronic device. Background Art
[0002] Heat dissipation of electronic equipment is an issue that must be considered during the design phase. For example, for a switching power supply, active heat dissipation can be performed inside the power supply by installing cooling modules such as fans and circulating coolant inside the switching power supply. However, this method not only increases the size of the switching power supply, but also increases production costs due to the addition of additional heat dissipation costs, reducing product competitiveness. In addition, the increase in equipment size is not conducive to the miniaturization and narrowing of the equipment, which limits the application scenarios of the product.
[0003] In order to make the device smaller and narrower, it is also possible not to set up cooling modules such as fans in the device. Instead, by covering the printed circuit board with copper, setting up heat sinks, etc., the heat convection of the air can be used to passively dissipate the heat of the heat module of the power module.
[0004] It should be noted that the above introduction to the technical background is only for the convenience of providing a clear and complete description of the technical solutions of the present application and for the convenience of understanding by those skilled in the art. It cannot be considered that the above technical solutions are well known to those skilled in the art simply because they are described in the background technology section of the present application. Utility Model Content
[0005] The inventors have found that in fanless devices, in order to meet higher heat dissipation requirements, it is necessary to increase the area of the printed circuit board and the copper coating area, or increase the area of the heat sink, which leads to increased costs. In addition, in order to ensure circuit performance, it is sometimes necessary to improve the stability of electronic components at high temperatures and use higher-specification electronic components, which further increases costs.
[0006] In order to solve at least one of the above problems or other similar problems, the embodiments of the present application provide a heat dissipation component and an electronic device to improve the heat dissipation effect while reducing the production cost.
[0007] A first aspect of an embodiment of the present application provides a heat dissipation assembly, the heat dissipation assembly comprising a housing, the housing comprising:
[0008] Two first side walls, the two first side walls are respectively arranged on two sides of the shell in a first direction opposite to each other;
[0009] two second side walls, the two second side walls being respectively arranged on two sides of the housing in a second direction intersecting the first direction; and
[0010] A plurality of partitions are arranged in the shell, the plurality of partitions are respectively distributed along the two first side walls, and one end of each partition abuts against the first side wall, and the other end extends toward the inside of the shell along the first direction,
[0011] Wherein, heat dissipation holes are formed on the two first side walls.
[0012] Adjacent partitions among the plurality of partitions form heat dissipation ducts with heat dissipation holes between the adjacent partitions; and / or
[0013] One of the two second side walls, a partition closest to the one second side wall, and a heat dissipation hole located between the one second side wall and the partition closest to the one second side wall form a heat dissipation air duct.
[0014] In addition, optionally, the partitions respectively located on the two first side walls are opposite to each other in the first direction.
[0015] In addition, optionally, the plurality of partitions extend along the first direction by a predetermined length, and the sum of the lengths of two partitions opposite to each other in the first direction is smaller than a dimension of the shell in the first direction.
[0016] In addition, optionally, the plurality of partitions extend along the first direction by a predetermined length, and a size of the plurality of partitions in the first direction is less than 16% of a size of the shell in the first direction.
[0017] In addition, optionally, the heat dissipation assembly also includes at least one portion to be dissipated of heat located in the shell.
[0018] In addition, optionally, at least one of the parts to be cooled is located in the cooling duct.
[0019] A second aspect of the embodiments of the present application provides an electronic device, which includes the heat dissipation assembly described in the embodiments of the first aspect.
[0020] In addition, optionally, the electronic device further includes a printed circuit board disposed in the housing.
[0021] In addition, optionally, at least one of the plurality of partitions abuts against the printed circuit board in the first direction.
[0022] In addition, optionally, the electronic device is a switching power supply.
[0023] One of the beneficial effects of the embodiments of the present application is that by arranging heat dissipation holes and multiple partitions in the shell, the trapped air remaining in the shell is divided with a simple structure, and the heat dissipation air duct in the shell is optimized through the partitions, the inner wall of the shell and the heat dissipation holes, thereby guiding the trapped air and improving the heat dissipation effect.
[0024] With reference to the following description and accompanying drawings, the specific embodiments of the present application are disclosed in detail, indicating the way in which the principles of the present application can be adopted. It should be understood that the embodiments of the present application are not limited in scope. Within the scope of the terms of the appended claims, the embodiments of the present application include many changes, modifications and equivalents.
[0025] Features described and / or illustrated with respect to one embodiment may be used in the same or similar manner in one or more other embodiments, combined with features in other embodiments, or substituted for features in other embodiments.
[0026] It should be emphasized that the term “include / comprises” when used herein refers to the presence of features, integers, steps or components, but does not exclude the presence or addition of one or more other features, integers, steps or components. BRIEF DESCRIPTION OF THE DRAWINGS
[0027] The elements and features described in one figure or one implementation of the present application embodiment may be combined with the elements and features shown in one or more other figures or implementations. In addition, in the accompanying drawings, similar reference numerals represent corresponding parts in several figures and can be used to indicate corresponding parts used in more than one implementation.
[0028] The included drawings are used to provide a further understanding of the embodiments of the present application, which constitute a part of the specification, are used to illustrate the implementation methods of the present application, and together with the text description, explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0029] In the attached picture:
[0030] Figure 1 is a three-dimensional diagram of a heat dissipation assembly according to an embodiment of the present application;
[0031] Figure 2 yes Figure 1 A top view of the heat dissipation assembly shown;
[0032] Figure 3 is a schematic diagram illustrating the structure of a heat dissipation assembly according to an embodiment of the present application;
[0033] Figure 4 is a schematic diagram of a portion to be cooled according to an embodiment of the present application;
[0034] Figure 5 It is a schematic diagram of an electronic device according to an embodiment of the present application.
[0035] Tag Name
[0036] 1: Heat dissipation components;
[0037] 10: Shell;
[0038] 101: first side wall;
[0039] 102, 121, 122: second side wall;
[0040] 103, 131-138: partition;
[0041] 110: heat dissipation holes;
[0042] 121: second side wall;
[0043] 2: Electronic equipment;
[0044] 20, 20-1, 20-2, 20-3: heat dissipation part;
[0045] 201: heat sink;
[0046] 202: Terminal block;
[0047] 300, 50: printed circuit board;
[0048] 301: power tube;
[0049] W: Cooling duct
[0050] x: first direction;
[0051] y: Second direction. DETAILED DESCRIPTION
[0052] With reference to the accompanying drawings, the above and other features of the present application will become apparent through the following description. In the specification and the accompanying drawings, specific embodiments of the present application are specifically disclosed, which show some embodiments in which the principles of the present application can be adopted. It should be understood that the present application is not limited to the described embodiments. On the contrary, the present application includes all modifications, variations and equivalents that fall within the scope of the attached claims.
[0053] In the embodiments of the present application, the terms "first", "second", etc. are used to distinguish different elements in terms of title, but do not indicate the spatial arrangement or temporal order of these elements, etc., and these elements should not be limited by these terms. The term "and / or" includes any one and all combinations of one or more of the associated listed terms. The terms "comprising", "including", "having", etc. refer to the presence of the stated features, elements, components or components, but do not exclude the presence or addition of one or more other features, elements, components or components.
[0054] In the embodiments of the present application, the singular forms "a", "the", etc. may include plural forms and should be broadly understood as "a kind" or "a type" rather than being limited to the meaning of "one"; in addition, the term "said" should be understood to include both singular and plural forms, unless the context clearly indicates otherwise. In addition, the term "according to" should be understood as "at least in part according to...", and the term "based on" should be understood as "at least in part based on...", unless the context clearly indicates otherwise.
[0055] The embodiments of the present application will be described below with reference to the accompanying drawings.
[0056] The present application embodiment provides a heat dissipation component. Figure 1 is a three-dimensional diagram of a heat dissipation assembly according to an embodiment of the present application, Figure 2 yes Figure 1 A top view of the heat dissipation assembly is shown. Figure 3 It is a schematic diagram illustrating the structure of the heat dissipation component of an embodiment of the present application.
[0057] like Figure 1 As shown, the heat dissipation assembly 1 includes a housing 10, the housing 10 includes two first side walls 101 arranged opposite to each other in a first direction x and two second side walls 102 arranged opposite to each other in a second direction y, and heat dissipation holes 110 are formed on the two first side walls 101. Figure 1 As shown, the first direction x intersects with the second direction y. In addition, Figure 1 In the example, the first direction x is perpendicular to the second direction y, but the embodiments of the present application are not limited to this. That is, the first side wall 101 and the second side wall 102 of the shell 10 may be perpendicular to each other or may not be perpendicular. For example, the bottom surface of the shell 10 may be a rough rectangle, or a trapezoid, a rhombus, or other quadrilaterals.
[0058] like Figure 1 and Figure 2 As shown, a plurality of partitions 103 are further disposed in the housing 10. The plurality of partitions 103 extend from the two first side walls 101 in opposite directions in the first direction x, respectively. The plurality of partitions 103 are spaced apart and distributed on the two first side walls 101 along the second direction y. For example, Figure 2As shown, three partitions 103 are arranged on each first side wall 101, and the partitions 103 arranged on the two first side walls 101 are respectively opposite to each other in the first direction x. However, the embodiment of the present application is not limited thereto, and at least one partition 103 may be arranged on each first side wall 101. In addition, the partitions 103 arranged on the two first side walls 101 may not be opposite to each other in the first direction x, that is, the partitions 103 arranged on the two first side walls 101 may extend in a staggered manner in the first direction x.
[0059] Figure 3 This is a schematic diagram for explaining the structure of the heat dissipation component of the embodiment of the present application. Figure 3 Taking as an example, various implementation methods of the structure of the heat dissipation assembly of the embodiment of the present application are described. Those skilled in the art should understand that Figure 3 Just a schematic diagram, Figure 3 The various embodiments shown can be implemented separately or in combination. Figure 3 The example structures shown are to be understood as limitations on implementations of the heat sink assembly of the present application.
[0060] like Figure 3 As shown, a plurality of partitions 103 are respectively arranged on the two first side walls 101. In addition, for the convenience of description, each partition 103 is marked with reference numerals 131 to 138, and the two second side walls 102 are marked with reference numerals 121 to 122.
[0061] In some embodiments, the heat dissipation holes between adjacent partitions among a plurality of partitions form a heat dissipation air duct; and / or a second side wall among two second side walls, the partition closest to the second side wall, and the heat dissipation holes between the second side wall and the partition closest to the second side wall form a heat dissipation air duct.
[0062] For example, Figure 3 As shown, the adjacent partitions 131 and 132 and the heat dissipation holes 110 located between the partitions 131 and 132 form a heat dissipation duct W, and the adjacent partitions 133 and 134 and the heat dissipation holes 110 located between the partitions 133 and 134 form a heat dissipation duct W.
[0063] For example, Figure 3 As shown, the partition 131 , the second side wall 121 , and the heat dissipation holes 110 between the partition 131 and the second side wall 121 form a heat dissipation duct W.
[0064] Therefore, by setting the heat dissipation holes 110 and multiple partitions 103 in the shell 10, the trapped air remaining in the shell 10 is divided with a simple structure, and the heat dissipation air duct in the shell 10 is optimized through the partitions 103, the second side wall 102 and the heat dissipation holes 110, so as to guide the trapped air and improve the heat dissipation effect.
[0065] In some embodiments, Figure 1 As shown, the partitions 103 respectively located on the two first side walls 101 are opposite to each other in the first direction x. Thus, the wind speed in the heat dissipation air duct can be further increased, thereby improving the heat dissipation efficiency.
[0066] In some embodiments, the plurality of partitions extend along the first direction by a predetermined length, and a sum of lengths of two partitions opposite to each other in the first direction is smaller than a dimension of the housing in the first direction.
[0067] For example, Figure 3 As shown, the sum of the lengths L1 and L2 of the partition 131 and the partition 133 in the first direction x is smaller than the length L of the housing 10 in the first direction x.
[0068] In some embodiments, the plurality of baffles extend along the first direction by a predetermined length, and the size of the plurality of baffles in the first direction accounts for less than 16% of the size of the housing in the first direction, for example, Figure 3 As shown, the length L1 of the partition 131 is less than 16% of the length L of the housing 10 . For example, the length L of the housing 10 is 120 mm, and the length L1 of the partition 131 is set to 20 mm.
[0069] Therefore, by adjusting the length of the partition, the heat dissipation duct can be further optimized and the heat dissipation efficiency can be improved.
[0070] In some embodiments, Figure 1 As shown, heat dissipation holes 110 are formed on the two first side walls 101 , and the heat dissipation holes 110 respectively arranged on the two first side walls 101 are opposite to each other in the first direction x. Therefore, the heat dissipation efficiency is further improved through the heat dissipation holes 110 .
[0071] Figure 4 It is a schematic diagram of the part to be heat-dissipated in an embodiment of the present application.
[0072] In some embodiments, Figure 4 As shown, the heat dissipation assembly 1 may further include a heat dissipation portion 20, and the heat dissipation portion 20 may include, for example, a heat sink 201, a connection terminal 202, etc. Figure 4As shown, a power tube 301 is arranged on the printed circuit board 300, and the heat dissipation of the power tube 301 can be performed through the heat sink 201. In addition, a terminal 202 can also be arranged on the printed circuit board 300. Since the current at the terminal 202 is relatively large, in order to ensure the safety of the equipment, the terminal 202 also has a heat dissipation requirement.
[0073] The above example starts with Figure 4 The heat sink 201 and the terminal block 202 are used as examples to illustrate the heat dissipation portion 20, but the embodiments of the present application are not limited thereto. The heat dissipation portion 20 may be any component or structure that requires heat dissipation. In addition, the heat dissipation portion 20 may be disposed on the housing instead of on the circuit board, that is, it may be specifically configured according to actual needs, and the embodiments of the present application are not limited thereto.
[0074] In some embodiments, at least one of the heat dissipation parts is located in a heat dissipation duct. Figure 3 As described above, the heat dissipation portion 20 - 1 is located in the heat dissipation duct W.
[0075] However, the embodiments of the present application are not limited thereto. For example, sometimes the position of the heat dissipation portion is limited by the circuit design on the printed circuit board, and the heat dissipation portion may not be located exactly in the heat dissipation duct. Figure 3 As shown, the portion to be dissipated 20-2 is located near the heat dissipation duct W, and the portion to be dissipated 20-3 is far from the heat dissipation duct W. However, since the heat dissipation duct in the housing enhances the convection efficiency of the air entering and exiting the housing, even if the portion to be dissipated is not completely located in the heat dissipation duct, the heat dissipation efficiency can be improved. For example, the portions to be dissipated 20-2 and 20-3 can be components to be dissipated that have low heat dissipation requirements.
[0076] Optionally, when the heat dissipation portion 20 is disposed in the housing 10, the heat dissipation portion 20 may be arranged along the first direction x, for example, Figure 4 As shown, the long sides of the heat sink 201 are extended along the first direction, thereby enabling the heat sink 201 to fully contact with the cooling gas in the heat dissipation air duct to quickly dissipate heat.
[0077] In some embodiments, the setting position of the partition is related to the distribution of the part to be cooled. For example, in order to improve the heat dissipation efficiency, the part to be cooled is extended along the first direction and set in a heat dissipation duct (sometimes also called a "guide groove") formed between the partition and the second side wall or in a guide groove formed between adjacent partitions to divide the trapped air around the part to be cooled.
[0078] For example, Figure 3As shown, only a pair of partitions opposite to each other in the first direction x may be provided, for example, partitions 131 and 133 are provided, and the heat dissipation portion 20-1 is provided between the partition 131 and the second side wall 121. Figure 3 At the position below, the heat dissipation portion 20 may be arranged between the partition 133 and the second side wall 121; for another example, multiple pairs of partitions opposing each other in the first direction x may be arranged, for example, partitions 131-134 are arranged, and the heat dissipation portion 20 may be arranged in the space surrounded by the partitions 131-134; in addition, the partitions extending relatively in the first direction x may not be aligned, for example, partitions 135 and 137, and the heat dissipation portion 20-2 may be arranged between partitions 135 and 137. In addition, the partitions arranged on one first side wall 101 may not be distributed at equal intervals, for example, the intervals between the partitions 133, 134, 137, and 138 are not equidistant.
[0079] Therefore, by adjusting the relative position between the heat dissipation part and the partition, the heat generation area is isolated to suppress the heat transmission to other areas, and the trapped air is guided by the guide groove formed in the shell to improve the heat dissipation effect. The improved heat dissipation effect can improve the stability of electronic components and can also reduce the area of heat sinks, thereby reducing production costs and improving product competitiveness.
[0080] In addition, the heat dissipation effect of the heat dissipation component of the embodiment of the present application is simulated by airflow simulation software. During the simulation, the heat dissipation component of the embodiment of the present application is assembled into a switching power supply. Compared with the solution in which the shell is not provided with a guide groove, the blue area in the solution in which the shell is provided with a guide groove is larger, that is, the cooling effect is better. In addition, since heat dissipation holes are usually provided on the shell, compared with the solution in which the shell is not provided with a guide groove, the air flow speed near the heat dissipation holes in the solution in which the shell is provided with a guide groove is faster, that is, the convection efficiency of the gas in and out of the shell is higher. In other words, the embodiment of the present application has a better heat dissipation effect than the prior art.
[0081] In addition, under normal temperature and full load, under the same output conditions, the MOSFET is provided with the same heat sink, and the housing with the guide groove can reduce the temperature rise by 4.6°C compared with the housing without the guide groove; under normal temperature and full load, under the same output conditions, the output rectifier diode is provided with the same heat sink, and the housing with the guide groove can reduce the temperature rise by 6.5°C compared with the housing without the guide groove. In addition, due to the improved heat dissipation effect, the area of the heat sink can be appropriately reduced, for example, the area of the heat sink can be reduced by 9.1%, and due to the reduction of the heat sink, the area of the substrate (such as a printed circuit board) can be further reduced.
[0082] In addition, the selection specifications of the switching tube can also be lowered. For example, for the primary MOS tube, the original 650V / 15A specification can be replaced by a 650V / 9A switching tube. For the secondary rectifier tube, the original 150V / 20A specification can be replaced by a 150V / 10A specification.
[0083] In this way, the production cost can be greatly reduced by reducing the heat sink area, the printed circuit board area, and the power MOS specifications.
[0084] According to the heat dissipation assembly of the embodiment of the present application, heat dissipation holes and a plurality of partitions are arranged in the shell to divide the trapped air remaining in the shell with a simple structure, and the heat dissipation air duct in the shell is optimized through the partitions, the inner wall of the shell and the heat dissipation holes, thereby guiding the trapped air and improving the heat dissipation effect.
[0085] The present application also provides an electronic device, Figure 5 It is a schematic diagram of an electronic device according to an embodiment of the present application.
[0086] like Figure 5 As shown, the electronic device 2 includes the heat dissipation assembly 1 described in the above embodiment. Since the structure of the heat dissipation assembly has been described in detail in the above embodiment, its content is incorporated here and the description is omitted here.
[0087] In some embodiments, Figure 5 As shown, the electronic device 2 also includes a printed circuit board 50 disposed in the housing. Figure 5 (not shown) may be disposed on a side of the printed circuit board 50 that faces the interior of the housing 10 .
[0088] In some embodiments, Figure 5 As shown, at least one of the plurality of partitions 103 abuts against the printed circuit board 50 in the first direction x. Thus, the printed circuit board 50 can be fixed by the partition 103, and no additional structure for fixing the printed circuit board 50 is required, thereby further saving costs.
[0089] The electronic device of the embodiment of the present application can be a switching power supply, a transformer, a relay, etc., and the embodiment of the present application does not limit this. In addition, the electronic device of the embodiment of the present application can also include other circuit structures and / or mechanical structures, and the specific implementation method can be set or designed accordingly according to actual needs. The implementation method can refer to the relevant technology, and the embodiment of the present application does not limit this.
[0090] It is worth noting that the above only describes the components or modules related to the present application, but the present application is not limited thereto. The heat dissipation assembly and electronic device of the present application embodiment may also include other components or modules, and the specific contents of these components or modules may refer to the relevant technology.
Claims
1. A heat dissipation component, characterized in that: The heat dissipation assembly includes a housing, and the housing includes: Two first side walls, the two first side walls are respectively arranged on two sides of the shell in a first direction opposite to each other; two second side walls, the two second side walls being respectively arranged on two sides of the housing in a second direction intersecting the first direction; and A plurality of partitions are arranged in the shell, the plurality of partitions are respectively distributed along the two first side walls, and one end of each partition abuts against the first side wall, and the other end extends toward the inside of the shell along the first direction, Wherein, heat dissipation holes are formed on the two first side walls. Adjacent partitions among the plurality of partitions form heat dissipation ducts with heat dissipation holes between the adjacent partitions; and / or One of the two second side walls, a partition closest to the one second side wall, and a heat dissipation hole located between the one second side wall and the partition closest to the one second side wall form a heat dissipation air duct.
2. The heat dissipation assembly according to claim 1, characterized in that: The partitions respectively located on the two first side walls are opposite to each other in the first direction.
3. The heat dissipation assembly according to claim 2, characterized in that: The plurality of partitions extend along the first direction by a predetermined length, and a sum of lengths of two partitions facing each other in the first direction is smaller than a dimension of the housing in the first direction.
4. The heat dissipation assembly according to claim 1, characterized in that: The plurality of partitions extend along the first direction by a predetermined length, A size of the plurality of partitions in the first direction accounts for less than 16% of a size of the housing in the first direction.
5. The heat dissipation assembly according to any one of claims 1 to 4, characterized in that: The heat dissipation assembly further includes at least one portion to be dissipated of heat located in the housing.
6. The heat dissipation assembly according to claim 5, characterized in that: At least one of the parts to be cooled is located in the cooling air duct.
7. An electronic device, characterized in that: The electronic device comprises the heat dissipation assembly according to any one of claims 1 to 6.
8. The electronic device according to claim 7, characterized in that: The electronic device further comprises a printed circuit board arranged in the housing.
9. The electronic device according to claim 8, characterized in that: At least one of the plurality of spacers abuts against the printed circuit board in the first direction.
10. The electronic device according to any one of claims 7 to 9, characterized in that: The electronic device is a switching power supply.