Die bonding clamp suitable for TO packaging structure pressure sensor

Abstract

The utility model provides a die bonding clamp suitable for a TO packaging structure pressure sensor, which comprises a bottom module and an upper pressing plate, the lower part of the bottom module is a cavity, a plurality of TO positioning holes matched with a TO structure are arranged in an array on the upper surface of the bottom module, a plurality of positioning pins and strong magnetic columns are simultaneously arranged on the upper surface of the bottom module, and the strong magnetic columns are arranged in the cavity. Positioning rails are arranged on the two sides of the bottom module, through holes corresponding to TO positioning holes and pressing plate positioning holes matched with positioning pins are formed in the upper pressing plate in an array mode, the diameter of the through holes is smaller than the maximum diameter of TO, and the upper pressing plate is attracted to the bottom module through strong magnetic columns. The fixture can simultaneously solve the problems of TO positioning and placement of a TO with a chip in a TO packaging pressure sensor.

Description

Technical Field

[0001] The utility model mainly relates to the technical field related to sensors, in particular to a die-fixing fixture suitable for a pressure sensor with a TO packaging structure. Background Art

[0002] The die bonding position of the TO package structure pressure sensor is different from that of the ordinary steel-sealed pressure sensor. Because of its overall small size and thin thickness, it is more difficult to bond the die than the conventional steel-sealed pressure sensor. After bonding, it cannot be placed like the conventional steel-sealed pressure sensor, otherwise it is easy to cause damage to the chip.

[0003] Due to the lack of suitable fixtures, the current production efficiency of TO package structure pressure sensors is low and defective products are prone to occur. Therefore, for this type of product, a fixture that can solve the problem of die bonding and placement is urgently needed to meet production needs. Utility Model Content

[0004] In order to solve the shortcomings of current technology, the utility model combines the existing technology and, based on practical applications, provides a die bonding fixture suitable for TO package structure pressure sensors, which can simultaneously solve the problems of TO positioning and placement of TO with chip in TO package pressure sensors.

[0005] The technical solution of the utility model is as follows:

[0006] A die-bonding fixture suitable for a TO package structure pressure sensor comprises a bottom module and an upper pressing plate, wherein the bottom module has a cavity at the bottom, and an array of multiple TO positioning holes matching the TO structure is arranged on the upper surface, and multiple positioning pins and strong magnetic columns are arranged on the upper surface of the bottom module, and positioning rails are arranged on both sides of the bottom module, and through holes corresponding to the TO positioning holes and pressing plate positioning holes matching the positioning pins are arranged in an array on the upper pressing plate, wherein the diameter of the through holes is smaller than the maximum diameter of the TO, and the upper pressing plate is adsorbed on the bottom module through the strong magnetic columns.

[0007] Furthermore, the bottom module and the upper pressing plate are both rectangular structures, and the thickness of the upper pressing plate is 1 mm.

[0008] Furthermore, the bottom module is an aluminum structure, and the upper pressure plate is an iron plate.

[0009] Furthermore, four positioning pins are provided and are respectively arranged at four corners of the bottom module, and the positioning pins are bonded to the bottom module by adhesive.

[0010] Furthermore, a plurality of strong magnetic columns are arranged at the edges of the bottom module in the width direction and the length direction, and the strong magnetic columns are bonded to the bottom module by adhesive.

[0011] Furthermore, a handle is provided on the side of the bottom module, and the handle and the positioning track are located on different sides of the bottom module.

[0012] Beneficial effects of the utility model:

[0013] 1. This fixture solves the problems of TO positioning and placement of TO with chip at the same time, which can improve the production efficiency of TO packaged pressure sensors and increase the yield rate.

[0014] 2. This fixture can be used in both automatic die bonding machines and manual die bonding machines.

[0015] 3. A single fixture can hold a large number of TOs, which can improve efficiency. The fixture body is made of aluminum and has a lightweight structure.

[0016] 4. The fixture structure adopts strong magnetic adsorption assembly, which is more convenient than conventional screw assembly, saving time and effort. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Attached Figure 1 It is a schematic diagram of the overall structure of the utility model.

[0018] Attached Figure 2 This is a schematic diagram of the structure of the bottom module of the utility model in a disassembled state.

[0019] The numbers shown in the accompanying drawings are: 1, bottom module; 2, TO; 3, upper pressure plate; 4, positioning rail; 5, pressure plate positioning hole; 6, through hole; 7, handle; 8, screw; 9, strong magnetic column; 10, positioning pin; 11, TO positioning hole. DETAILED DESCRIPTION

[0020] The utility model is further described in conjunction with the accompanying drawings and specific embodiments. It should be understood that these embodiments are only used to illustrate the utility model and are not used to limit the scope of the utility model. In addition, it should be understood that after reading the content taught by the utility model, those skilled in the art can make various changes or modifications to the utility model, and these equivalent forms also fall within the scope defined by this application.

[0021] refer to Figure 1 as well as Figure 2 , which is a schematic diagram of a die-bonding fixture suitable for a TO package structure pressure sensor provided in this embodiment.

[0022] The clamp mainly includes a bottom module 1 and an upper pressing plate 3 .

[0023] The bottom module 1 is in the shape of a cuboid and is made of aluminum to ensure the lightness of the structure. A plurality of TO positioning holes 11 matching TO2 are opened on the plane of the cuboid bottom module 1, and the TO positioning holes 11 are provided with positioning and limiting grooves for positioning and limiting TO2.

[0024] The TO positioning holes 11 are distributed on the bottom module 1 along the width direction and the length direction, with 8 rows evenly spaced in the length direction and 5 rows evenly spaced in the width direction, so 40 pieces of TO2 can be clamped at one time.

[0025] There are four circular holes at four diagonal positions on the upper plane of the bottom module 1, with a total of four holes. Positioning pins 10 are placed on the circular holes, and the circular holes and the positioning pins 10 are bonded by adhesive. There are three circular holes on each side of the upper plane of the bottom module 1, and strong magnetic columns 9 are set on the circular holes, and the strong magnetic columns 9 are bonded to the circular holes by adhesive.

[0026] A positioning track 4 is provided on the width end face of the bottom module 1 for positioning on the automatic crystal bonding machine; two screw holes are provided on the length side of the bottom module 1, and a handle 7 is installed at the screw holes by screws 8 for loading and unloading the fixture.

[0027] 3 / 4 of the lower surface of the bottom module 1 is in a hollow state, and the TO positioning hole 11 passes through the bottom module 1 .

[0028] The upper pressing plate 3 is in the shape of a rectangular iron plate with a thickness of 1 mm. The upper pressing plate 3 is provided with evenly distributed through holes 6, the positions of the through holes 6 correspond to the TO positioning holes 11 one by one, the diameter of the through holes 6 is smaller than the maximum outer diameter of TO2, and the distribution of the through holes 6 is consistent with the distribution of the TO positioning holes 11 on the bottom module 1, that is, 8 rows are evenly distributed in the length direction and 5 rows are evenly distributed in the width direction. The upper pressing plate 3 is provided with pressing plate positioning holes 5 around it, and the positions of the pressing plate positioning holes 5 are the same as the positions of the positioning pins 10 on the bottom module 1.

[0029] In the above structure of this example, the TO2 product is placed on the bottom module 1 through the limiting groove, the upper pressure plate 3 is covered on the bottom module 1, the pressure plate positioning hole 5 of the upper pressure plate 3 is aligned with the positioning pin 10 of the bottom module 1, and the upper pressure plate 3 is adsorbed by the strong magnetic column 9, so that TO2 is pressed and fixed. Multi-point adsorption can ensure the flatness and firmness, and the product is assembled through the through hole 6 of the upper pressure plate 3.

Claims

1. A die-bonding fixture suitable for a TO package structure pressure sensor, characterized in that: It includes a bottom module and an upper pressure plate. The lower part of the bottom module is a cavity. The upper surface is arrayed with multiple TO positioning holes matching the TO structure. The upper surface of the bottom module is also arrayed with multiple positioning pins and strong magnetic columns. Positioning rails are arranged on both sides of the bottom module. Through holes corresponding to the TO positioning holes and pressure plate positioning holes matching the positioning pins are arrayed on the upper pressure plate. The diameter of the through holes is smaller than the maximum diameter of the TO. The upper pressure plate is adsorbed on the bottom module through the strong magnetic columns.

2. The die-bonding fixture for a TO package structure pressure sensor according to claim 1, characterized in that: The bottom module and the upper pressing plate are both rectangular parallelepiped structures, and the thickness of the upper pressing plate is 1 mm.

3. The die-bonding fixture for a TO package structure pressure sensor according to claim 1, characterized in that: The bottom module is an aluminum structure, and the upper pressure plate is an iron plate.

4. The die-bonding fixture for a TO package structure pressure sensor according to claim 1, characterized in that: Four positioning pins are provided and arranged at four corners of the bottom module respectively, and the positioning pins are bonded to the bottom module by adhesive.

5. The die-bonding fixture for a TO package structure pressure sensor according to claim 1, characterized in that: A plurality of strong magnetic columns are arranged at the edges of the bottom module in the width direction and the length direction, and the strong magnetic columns are bonded to the bottom module by adhesive.

6. The die-bonding fixture for a TO package structure pressure sensor according to claim 1, characterized in that: A handle is provided on the side of the bottom module, and the handle and the positioning track are located on different sides of the bottom module.

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