Weldability tester

Abstract

The utility model discloses a weldability tester, which belongs to the technical field of semiconductor testing, is matched with a semiconductor component, a soldering tin barrel and a soldering flux barrel for use, and comprises a temperature control module and a motion master control module, the temperature control module comprises a heating module, a heating trigger module, a temperature adjusting module and a temperature protection module, the motion master control module comprises an X motion control module and a Y motion control module, the X motion control module controls the mechanical arm to move horizontally, and the Y motion control module controls the soldering tin barrel and the soldering flux to move in the vertical direction. The problem that soldering flux brushing and manual tin dipping need to be conducted manually in the prior art is solved, adverse effects are eliminated, the testing accuracy is improved, the testing time is saved, and the production efficiency is improved.

Description

Technical Field

[0001] The utility model patent design belongs to the field of semiconductor testing technology, especially a solderability tester Background Art

[0002] During the manufacturing process of semiconductor components, evaluating solderability is to verify whether the solderability of component leads and solder pads meets the requirements. Due to the development trend of high-density circuit boards and the environmental requirements of lead-free and halogen-free, more and more circuit boards have problems such as poor soldering, board explosion, delamination, etc. Before the components are received by users and before assembly and soldering, it is necessary to determine their solderability.

[0003] Existing solderability testers usually require experimenters to hold semiconductor components for applying flux and manually dip them in solder. In this case, problems such as uneven application of flux and dipping in solder each time, which will have an adverse impact on test results, will occur. Especially in the later stages, the test rigor is poor, and it is greatly affected by human subjective factors, easily leading to inaccurate test results. If there are problems in the test data of other experimenters, it is very difficult to determine whether the data error is due to uneven application of flux, dipping in solder, or the sample itself, increasing the difficulty of semiconductor detection and requiring re-testing, wasting accessories and time. Therefore, there is an urgent need to invent an automatic solderability tester to solve the above problems. Content of the Utility Model

[0004] The utility model discloses a solderability tester that can automatically complete the solderability test of semiconductor components. This device can automatically perform the steps of applying flux and dipping in solder, and can adjust parameters such as solder temperature, immersion depth, and immersion speed in real time according to needs, fully realizing the automated operation of the device, eliminating uneven application of flux caused by the operator's own operation, improving the success rate of solderability testing, and saving semiconductor testing time.

[0005] A solderability tester disclosed by the utility model is used in cooperation with semiconductor components, a solder barrel, and a flux barrel. The tester includes a temperature control module and a motion total control module. The temperature control module includes a heating module, a heating trigger module, a temperature adjustment module, and a temperature protection module. The motion total control module includes an X motion control module and a Y motion control module. The X motion control module controls the horizontal movement of the robotic arm, and the Y motion control module controls the vertical movement of the solder barrel and the flux barrel.

[0006] Preferably, the heating module is provided with a heating plate, a temperature control thermocouple, and an extreme thermocouple. The temperature sensing part of the temperature control thermocouple is arranged in the solder barrel, and the other end is electrically connected to the temperature adjustment module. The extreme thermocouple is electrically connected to the temperature protection module.

[0007] Preferably, the temperature regulating module is provided with a temperature control table, and the temperature control table can set the heating range of the solder barrels respectively.

[0008] Preferably, the temperature protection module includes a temperature limit meter, an audible and visual alarm, and a safety emergency stop switch. The temperature limit meter receives the limit thermocouple feedback data information. When the temperature in the solder barrel exceeds the set temperature, the heating trigger module will start the power-off protection to stop the heating module from continuing to heat. The safety emergency stop switch is electrically connected to the heating module.

[0009] Preferably, the overall motion control unit is a PLC electronic control system, which has a built-in X-axis controller and a Y-axis controller, and the PLC electronic control system can limit the movement distance and residence time of the components.

[0010] Preferably, the X-motion control module comprises a mechanical arm and a horizontal slide, the X-direction controller is electrically connected to the mechanical arm, a sample clamp is provided under the mechanical arm, and the sample clamp is connected to the mechanical arm by magnetic attraction.

[0011] Preferably, the Y motion control module includes a lifting guide rail and an operating table, the bottom of the operating table is a lifting platform, the lifting platform is fixedly connected to the lifting guide rail, two insulation boxes are arranged above the lifting platform, a solder bucket seat and a flux bucket seat are respectively arranged above the insulation boxes, a heating plate is arranged on the inner wall of the solder bucket seat, an extreme thermocouple is arranged on the outer wall of the solder bucket seat, an outer cover is arranged above the solder bucket seat and the flux bucket seat, and the outer cover is provided with a through hole with the same aperture as the solder bucket seat and the flux bucket seat.

[0012] Preferably, the bottom of the tester is provided with feet, and the rear of the tester is provided with a rear switch and a fan.

[0013] Beneficial Effects

[0014] The utility model regulates the heating temperature by setting a temperature control module to ensure safe and stable operation of the equipment and the heating requirements. The overall equipment is compact in design, occupies a small space, and can be operated with one button. From dipping the soldering flux to the end of the test, automated testing is adopted. The PLC electronic control system in the motion master control module can adjust parameters such as soldering temperature, immersion depth, and immersion speed as required, which is convenient for more conditional tests and can reduce the instability of human test intervention. At the same time, solder and soldering flux can be easily replaced, and a large-capacity solder bucket is equipped to hold more solder and test various packaging devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only the embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on the provided drawings.

[0016] Figure 1 It is a structural schematic diagram of a solderability tester;

[0017] Figure 2 It is a partial structural schematic diagram of a solderability tester;

[0018] Figure 3 It is a rear view of a solderability tester;

[0019] Figure 4 It is a structural schematic diagram of the interior of the operation table in a solderability tester;

[0020] Figure 5 It is a flow chart of the temperature control module of a solderability tester;

[0021] Figure 6 It is a flow chart of the overall motion control unit of a solderability tester;

[0022] In the figure: 1. Tester, 2. Temperature control thermocouple, 3. Limit thermocouple, 4. Temperature control meter, 5. Temperature limit meter, 6. Acousto-optic alarm, 7. Safety emergency stop switch, 8. PLC electric control system, 9. Robot arm, 10. Horizontal slideway, 11. Sample clamp, 12. Lifting guide rail, 13. Lifting table, 14. Heat preservation box, 15. Outer cover, 16. Solder bucket seat, 17. Flux bucket seat, 18. Solder bucket, 19. Flux bucket, 20. Floor feet, 21. Rear switch, 22. Fan, 23. Operation table. Detailed implementation manners

[0023] A solderability tester is used in cooperation with semiconductor components, a solder bucket 18 and a flux bucket 19. The tester 1 includes: a temperature control module and an overall motion control module. The feature is that the temperature control module includes a heating module, a heating trigger module, a temperature adjustment module and a temperature protection module. The overall motion control module includes an X motion control module and a Y motion control module. Among them, the X motion control module controls the horizontal motion of the robot arm 9, and the Y motion control module controls the vertical motion of the solder bucket 18 and the flux bucket 19. Through the X-direction motion and the Y-direction motion, the sample clamp 11 is controlled to perform a solderability test in the flux bucket 19 and the solder bucket 18.

[0024] In some embodiments, the heating module is provided with a heating plate, a temperature control thermocouple 2 and a limit thermocouple 3. The temperature sensing part of the temperature control thermocouple 2 is arranged in the solder bucket 18, and the other end is connected to the temperature adjustment module. The temperature control thermocouple 2 will transmit the temperature of the heating module to the temperature controller 4 in real time for comparison with the set temperature to ensure accurate temperature rise. The limit thermocouple 3 is connected to the temperature protection module, and the limit thermocouple 3 transmits the temperature of the heating module to the temperature limit meter 5 in real time.

[0025] In some embodiments, the temperature adjustment module is provided with a temperature controller 4, and the temperature controller 4 can set the heating range for the solder bucket 18 and the flux bucket 19 to control the heating temperature of the heating module.

[0026] In some embodiments, the temperature protection module includes a temperature limit meter 5, an audible and visual alarm 6 and an emergency stop switch 7. The temperature limit meter 5 receives the feedback data information from the limit thermocouple 3. When the temperature in the solder bucket 18 exceeds the set temperature, the heating trigger module will activate the power-off protection to stop the heating module from continuing to heat and stop the movement of the equipment. The emergency stop switch 7 is connected to the heating module. When the temperature exceeds the predetermined range and the heating module continues to heat, the audible and visual alarm 6 will give an alarm reminder, and the operator presses the emergency stop switch 7 to cut off the power supply of the heating and movement modules.

[0027] In some embodiments, the overall motion control unit is a PLC electric control system 8. The PLC electric control system 8 is built-in with an X-axis controller and a Y-axis controller. The PLC electric control system 8 can limit the motion distance and residence time of the motion device, and can adjust parameters such as the solder temperature, immersion depth, and immersion speed according to requirements to make the data of the solderability test more accurate.

[0028] In some embodiments, the X-axis motion control module includes a robotic arm 9 and a horizontal slide 10. The X-axis controller is connected to the robotic arm 9 to control the horizontal movement of the robotic arm 9 in the horizontal slide 10. A sample clamp 11 is provided below the robotic arm 9, and the sample clamp 11 is magnetically adsorbed to the robotic arm 9 for convenient replacement of the sample clamp 11.

[0029] In some embodiments, the Y-axis motion control module includes a lifting guide rail 12 and an operating table 23. The bottom of the operating table 23 is a lifting platform 13, and the lifting platform 13 is fixedly connected to the lifting guide rail 12. Two heat preservation boxes 14 are provided above the lifting platform 13. Above the heat preservation boxes 14 are provided a solder bucket seat 16 and a flux bucket seat 17 respectively to keep the solder bucket 18 and the flux bucket 19 warm. A heating plate is provided inside the solder bucket seat 16 for heating the solder bucket 18. A limit thermocouple 3 is provided on the outer wall of the solder bucket 18, and the limit thermocouple 3 measures the temperature in the solder bucket 18 in real time. An outer cover 15 is provided above the solder bucket seat 16 and the flux bucket seat 17, and through holes with the same aperture as the solder bucket seat 16 and the flux bucket seat 17 are provided on the outer cover 15 to facilitate the replacement of the solder bucket 18 and the flux bucket 19.

[0030] In some embodiments, a foot 20 is provided at the bottom of the tester to adjust the horizontal state of the device. A rear switch 21 and a fan 22 are provided at the rear of the tester. The rear switch 21 serves as a double confirmation, and the fan 22 cools down the inside of the device.

[0031] Example

[0032] First, place the tester on the platform and adjust the tester's feet 20 to keep the tester in a horizontal state. Connect the tester to a 220V power supply, close the tester's rear switch 21, and power on the entire tester. Set the corresponding experimental temperature on the temperature control table according to the experimental requirements, put the flux into the flux barrel 19, put the solder material into the solder barrel 18, turn on the heating switch, and the heating trigger module will power on and heat the heating module under the control of the temperature control table 4. The temperature control thermocouple 2 will transmit the heating module temperature to the temperature control table 4 in real time for comparison with the preset temperature to ensure accurate heating. In addition, the heating module is equipped with a limit thermocouple 3, which transmits the temperature to the temperature limit table 5 in real time. When the heating module exceeds the set temperature, the heating trigger module will be powered off for protection.

[0033] When the solder in the solder barrel 18 reaches the set temperature, remove the sample clamp 11. After the sample clamp 11 clamps the semiconductor components, put the sample clamp 11 back on the robot arm 9, set the movement distance and dwell time of the robot arm 9 and the lifting guide rail 12 on the control panel, and control the movement of the motion module through the PLC electronic control system 8. The robot arm 9 moves to the top of the flux barrel 19, and the main control unit controls the lifting guide rail 12 to rise and drive the lifting platform 13 to rise. The semiconductor components are immersed in the flux and reach the set depth. After staying for 5S, the lifting guide rail 12 drives the lifting platform 13 to descend. The main control unit controls the robot arm 9 to move to the top of the solder barrel 18, and the lifting guide rail 12 drives the lifting platform 13 to rise. The pins of the semiconductor components will be immersed in the set depth in the solder barrel 18. After staying for 5S, the lifting guide rail 12 drives the lifting platform 13 to descend, and the robot arm 9 returns to the initial position to complete the entire test process.

Claims

1. A solderability tester, used in conjunction with semiconductor components, solder barrels and flux barrels, the tester comprising: The temperature control module and the motion control module are characterized in that the temperature control module includes a heating module, a heating trigger module, a temperature adjustment module and a temperature protection module, the motion control module includes an X motion control module and a Y motion control module, wherein the X motion control module controls the horizontal movement of the robot arm, and the Y motion control module controls the vertical movement of the solder bucket and the flux bucket, the Y motion control module includes a lifting rail and an operating table, the bottom of the operating table is a lifting platform, the lifting platform is fixedly connected to the lifting rail, two insulation boxes are arranged above the lifting platform, and a solder bucket seat and a flux bucket seat are respectively arranged above the insulation box, a heating plate is arranged on the inner wall of the solder bucket seat, and an extreme thermocouple is arranged on the outer wall of the solder bucket seat, and an outer cover is arranged above the solder bucket seat and the flux bucket seat, and a through hole with the same aperture as the solder bucket seat and the flux bucket seat is provided on the outer cover.

2. A solderability tester according to claim 1, characterized in that: The heating module is provided with a heating plate, a temperature-controlling thermocouple and a limit thermocouple. The temperature sensing part of the temperature-controlling thermocouple is arranged in the solder barrel, and the other end of the temperature-controlling thermocouple is electrically connected to the temperature regulating module, and the limit thermocouple is electrically connected to the temperature protection module.

3. A solderability tester according to claim 1, characterized in that: The temperature regulating module is provided with a temperature control table, and the temperature control table can set the heating range of the solder barrel.

4. A solderability tester according to claim 1, characterized in that: The temperature protection module includes a temperature limit meter, an audible and visual alarm, and a safety emergency stop switch. The temperature limit meter receives the limit thermocouple feedback data information. When the temperature in the solder barrel exceeds the set temperature, the heating trigger module will start the power-off protection to stop the heating module from continuing to heat. The safety emergency stop switch is electrically connected to the heating module.

5. A solderability tester according to claim 1, characterized in that: The motion master control unit is a PLC electronic control system, which has a built-in X-axis controller and a Y-axis controller. The PLC electronic control system can limit the movement distance and residence time of the components.

6. A solderability tester according to claim 1, characterized in that: The X-motion control module includes a mechanical arm and a horizontal slideway. The X-direction controller is electrically connected to the mechanical arm. A sample clamp is provided under the mechanical arm. The sample clamp is connected to the mechanical arm by magnetic attraction.

7. A solderability tester according to claim 1, characterized in that: The bottom of the tester is provided with a ground foot, and the rear of the tester is provided with a rear switch and a fan.

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