Automatic degumming machine capable of preventing silicon wafer from being damaged

Abstract

The utility model discloses an automatic degumming machine capable of preventing a silicon wafer from being damaged, which relates to the technical field of silicon wafer degumming and comprises an automatic degumming machine body, a support is arranged on the automatic degumming machine body, an air cylinder is arranged on the support, and a piston rod of the air cylinder is connected with an installation frame. Connecting rods are arranged on the opposite sides of the mounting frames on the two sides, and first spring telescopic assemblies are evenly arranged on the opposite sides of the connecting rods on the two sides. The front side and the rear side of the silicon wafer are not in contact with the supporting frames, and the left side and the right side of the silicon wafer are in contact with the rubber strips, so that when the silicon wafer is inserted between the supporting frames on the two sides, the situation that the surface of the silicon wafer is scratched due to friction between the silicon wafer and the supporting frames can be avoided; and through the elastic force of the second spring telescopic assembly, the clamping rod can drive the rubber strip to fix the silicon wafer.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer degumming, in particular to an automatic degumming machine for preventing silicon wafers from being damaged. Background Art

[0002] When degumming silicon wafers, they need to be rinsed with a nozzle first, so the silicon wafers need to be fixed. Traditionally, the silicon wafers are generally inserted into slots for fixation. However, the applicant found that the surface of the silicon wafers is easily scratched when inserted into the slots, and the water flow impact force during high-pressure flushing is large, and the silicon wafers lack a buffer structure, resulting in the risk of damage to the silicon wafers. For this reason, we propose an automatic degumming machine that prevents silicon wafer damage. Utility Model Content

[0003] The purpose of the utility model is to provide an automatic degumming machine for preventing silicon wafers from being damaged, so as to solve the problems raised in the above background technology.

[0004] To achieve the above object, the present invention provides the following technical solution: an automatic degumming machine for preventing silicon wafer damage, comprising an automatic degumming machine body, a bracket provided on the automatic degumming machine body, a cylinder provided on the bracket, a piston rod of the cylinder connected to a mounting frame;

[0005] Connecting rods are provided on opposite sides of the mounting frames on both sides, and spring telescopic components 1 are evenly provided on opposite sides of the connecting rods on both sides;

[0006] Fixed rods are provided on opposite sides of the spring expansion and contraction components on both sides. Fixed components are evenly provided on the fixed rods on both sides, and the fixed components are used to fix the silicon wafer.

[0007] As a preferred solution of the automatic degumming machine for preventing silicon wafer damage described in the utility model, the fixing component includes two support frames with the same structure, the two sides of the support frame are respectively connected to the fixing rods on both sides, and the inner walls on both sides of the support frame are provided with spring telescopic components 2, and the spring telescopic components 2 are provided with clamping rods.

[0008] As a preferred solution of the automatic debonding machine for preventing silicon wafer damage described in the present invention, several spring expansion and contraction components 2 are provided on the inner walls of both sides of the support frame.

[0009] As a preferred solution of the automatic debonding machine for preventing silicon wafer damage described in the utility model, rubber strips are provided on opposite sides of the clamping rods on both sides.

[0010] As a preferred solution of the automatic degumming machine for preventing silicon wafer damage described in the utility model, both sides of the silicon wafer are in contact with the rubber strip, and the bottom of the silicon wafer is in contact with the bottom inner wall of the support frame.

[0011] As a preferred solution of the automatic debonding machine for preventing silicon wafer damage described in the present invention, the front and rear sides of the silicon wafer are not in contact with the support frame.

[0012] Compared with the prior art, the beneficial effects of the present invention are:

[0013] 1. By ensuring that the front and back sides of the silicon wafer do not contact the support frame, and the left and right sides of the silicon wafer contact the rubber strip, scratches on the surface of the silicon wafer caused by friction with the support frame can be avoided when the silicon wafer is inserted between the two support frames. The elastic force of the spring expansion component 2 can enable the clamping rod to drive the rubber strip to fix the silicon wafer.

[0014] 2. When the silicon wafer is being rinsed, the high-pressure water flow impacts the surface of the silicon wafer, causing the silicon wafer to be subjected to force and drive the spring expansion component 2 to expand and contract for initial buffering. The remaining impact force is transmitted to the support frame, causing the support frame to drive the fixed rod to move, causing the spring expansion component 1 to buffer. In this way, the impact force brought by the high-pressure water flow impacting the silicon wafer surface can be reduced to avoid damage to the silicon wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the overall structure of an automatic degumming machine for preventing silicon wafer damage according to the present invention;

[0016] Figure 2 This is a partial structural diagram of an automatic degumming machine for preventing silicon wafer damage according to the present invention;

[0017] Figure 3 The utility model is a schematic diagram of the structure of the fixing assembly of an automatic debonding machine for preventing silicon wafer damage.

[0018] In the figure: 1. Automatic degumming machine body; 2. Bracket; 3. Cylinder; 4. Mounting frame; 5. Connecting rod; 6. Spring expansion assembly 1; 7. Fixing rod; 8. Support frame; 9. Silicon wafer; 10. Spring expansion assembly 2; 11. Clamping rod; 12. Rubber strip. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0020] As mentioned in the background technology, the existing technology easily scratches the surface of the silicon wafer when it is inserted into the slot. In addition, the water flow during high-pressure washing has a strong impact force, and the silicon wafer lacks a buffer structure, which leads to the risk of causing damage to the silicon wafer. The present utility model provides an automatic degumming machine that prevents silicon wafer damage.

[0021] Example 1

[0022] Reference Figures 1 to 3 An automatic degumming machine for preventing silicon wafer damage includes an automatic degumming machine body 1, a bracket 2 is provided on the automatic degumming machine body 1, a cylinder 3 is provided on the bracket 2, a piston rod of the cylinder 3 is connected to a mounting frame 4, and the cylinder 3 drives the mounting frame 4 to move downward;

[0023] Connecting rods 5 are provided on opposite sides of the mounting frames 4 on both sides, and spring expansion and contraction components 6 are evenly provided on opposite sides of the connecting rods 5 on both sides;

[0024] Fixed rods 7 are provided on opposite sides of the spring expansion and contraction components 6 on both sides, and fixed components are evenly provided on the fixed rods 7 on both sides, and the fixed components are used to fix the silicon wafer 9.

[0025] The fixing assembly includes two support frames 8 of the same structure. Both sides of the support frame 8 are connected to the fixing rods 7 on both sides respectively. The inner walls of both sides of the support frame 8 are provided with spring telescopic assemblies 10, and the spring telescopic assemblies 10 are provided with clamping rods 11.

[0026] In order to increase the clamping force of the clamping rod 11 on the silicon wafer 9 , a plurality of spring expansion and contraction components 10 are provided on the inner walls of both sides of the support frame 8 .

[0027] Rubber strips 12 are provided on opposite sides of the clamping rods 11 on both sides to prevent the silicon wafer 9 from being scratched.

[0028] Both sides of the silicon wafer 9 are in contact with the rubber strip 12 , and the bottom of the silicon wafer 9 is in contact with the bottom inner wall of the support frame 8 .

[0029] Example 2

[0030] Reference Figures 1 to 3 , the front and rear sides of the silicon wafer 9 do not contact the support frame 8, avoiding the front and rear sides of the silicon wafer 9 being scratched by the support frame 8.

[0031] The rest of the structure is the same as that of Example 1.

[0032] The left and right sides of the silicon wafer 9 are connected with the rubber strips 12, so that the silicon wafer 9 is not in contact with the support frame 8. The left and right sides of the silicon wafer 9 are in contact with the rubber strips 12, so as to avoid the surface scratches of the silicon wafer 9 caused by the friction with the support frame 8. The spring expansion component 2 10 has the elastic force on the clamping rod 11, so that the clamping rod 11 drives the rubber strips 12 to fix the silicon wafer 9. After fixation, the cylinder 3 drives the mounting frame 4 to move downward, so that the silicon wafer 9 enters the automatic degumming machine body 1 for washing. When the left side of the silicon wafer 9 is washed, the high-pressure water flow hits the surface of the silicon wafer 9, so that the silicon wafer 9 is forced to drive the spring expansion component 2 10 to expand and contract for preliminary buffering. The remaining impact force is transmitted to the support frame 8, so that the support frame 8 drives the fixing rod 7 to move, so that the spring expansion component 1 6 is buffered. After the washing is completed, the right side of the silicon wafer 9 is washed, which can also be buffered, so that the impact force brought by the high-pressure water flow hitting the surface of the silicon wafer 9 can be reduced to avoid damage to the silicon wafer 9.

[0033] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An automatic degumming machine for preventing silicon wafer damage, characterized by: include, An automatic degumming machine body (1), wherein a bracket (2) is provided on the automatic degumming machine body (1), a cylinder (3) is provided on the bracket (2), and a piston rod of the cylinder (3) is connected to a mounting frame (4); Connecting rods (5) are provided on opposite sides of the mounting frames (4) on both sides, and spring telescopic components (6) are evenly provided on opposite sides of the connecting rods (5) on both sides; The opposite sides of the spring expansion and contraction components (6) on both sides are provided with fixing rods (7), and fixing components are evenly provided on the fixing rods (7) on both sides, and the fixing components are used to fix the silicon chip (9).

2. The automatic degumming machine for preventing silicon wafer damage according to claim 1, characterized in that: The fixing assembly comprises two support frames (8) of identical structure, both sides of the support frame (8) are respectively connected to the fixing rods (7) on both sides, and the inner walls on both sides of the support frame (8) are provided with a spring telescopic assembly (10), and the spring telescopic assembly (10) is provided with a clamping rod (11).

3. The automatic degumming machine for preventing silicon wafer damage according to claim 2, characterized in that: The inner walls on both sides of the support frame (8) are provided with a plurality of spring telescopic components 2 (10).

4. The automatic degumming machine for preventing silicon wafer damage according to claim 2, characterized in that: The opposite sides of the clamping rods (11) on both sides are provided with rubber strips (12).

5. The automatic degumming machine for preventing silicon wafer damage according to claim 4, characterized in that: Both sides of the silicon chip (9) are in contact with the rubber strip (12), and the bottom of the silicon chip (9) is in contact with the bottom inner wall of the support frame (8).

6. The automatic degumming machine for preventing silicon wafer damage according to claim 2, characterized in that: The front and rear sides of the silicon chip (9) are not in contact with the support frame (8).

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