Electronic chip packaging strip processing cooling pond
By improving the cooling pool structure and adopting components such as heat exchange cylinders and sealing rings, the recycling of coolant and continuous feeding of packaging strips are achieved, solving the problem of reduced cooling efficiency after the water-absorbing sponge is full of water and improving processing efficiency.
CN223302044UActive Publication Date: 2025-09-05SHENZHEN BAOHONGJIA ELECTRONIC TECHNOLOGY CO LTD
Patent Information
- Application Number
- CN202422713996.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-07
- Publication Date
- 2025-09-05
- Estimated Expiration
- 2034-11-07
Smart Images

Figure CN223302044U_ABST
Abstract
The utility model relates to the technical field of electronic chip packaging, in particular to an electronic chip packaging strip processing cooling pond which comprises a pond body, a heat exchange assembly, an auxiliary assembly, a sealing assembly and a flow guide assembly. The heat exchange assembly comprises a heat exchange cylinder, sealing rings, a feeding seat and a discharging seat, the heat exchange cylinder is fixedly connected with the pool body and located in the pool body, the two sealing rings are fixedly connected with the heat exchange cylinder and located between the heat exchange cylinder and the pool body, the feeding seat is fixedly connected with the pool body and located on the outer side of the pool body, and the discharging seat is fixedly connected with the pool body and located on the outer side of the pool body. The electronic chip packaging strip processing cooling pool solves the problems that when the electronic chip packaging strip processing cooling pool is used, the packaging strips are subjected to water absorption through a water absorption sponge body, and after the water absorption sponge body is full of water, the packaging strips cannot be continuously subjected to water absorption, so that the packaging strips cannot be continuously subjected to water absorption, and the service life of the packaging strips is prolonged. And the processing and cooling efficiency of the packaging strips is reduced.
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Citation Information
Patent Citations
Electronic chip packaging strip processing cooling pool
CN212006387U