Power supply over-temperature protection power adapter

Abstract

The utility model relates to the technical field of power adapters, in particular to a power supply over-temperature protection power adapter, which adopts the technical scheme that the power supply over-temperature protection power adapter comprises a main body, a heat dissipation assembly is fixedly mounted on the upper end surface of the main body, a main board is fixedly mounted in the main body, and a temperature sensor and a processor are arranged on the main board; the main body comprises a shell, a reserved groove is formed in the upper end face of the shell, a panel is embedded in the reserved groove, and a mounting hole is formed in the front end of the shell; an inserting groove is formed in the middle of the upper end face of the panel, a temperature guide column penetrates through the inserting groove, the bottom end of the temperature guide column extends into the main body and makes contact with the upper end face of the processor but is not fixedly connected with the upper end face of the processor, a screw hole is formed in the upper end face of the panel on the outer side of the inserting groove, and a threading hole is formed in the upper end face of the panel at the rear end of the inserting groove. According to the utility model, the problems of low heat dissipation efficiency and poor waterproof and dustproof performance of the adapter in the prior art are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of power adapters, in particular to a power adapter with power supply over-temperature protection. Background Art

[0002] Power adapters are an integral part of modern electronic devices, converting alternating current (AC) into direct current (DC) suitable for specific devices. After extensive research, publication number CN218041225U was found, which discloses a power adapter comprising a power adapter body and a support stand. The power adapter body is equipped with a heat sink, a heat conducting column, and a heat sink extending into the inner cavity of the power adapter body. Heat dissipation holes are also provided on the surface of the heat conducting column, improving the heat dissipation efficiency of the device.

[0003] When the above device is in use, heat dissipation holes are opened on the heat-conducting column. Although this can improve the heat dissipation effect to a certain extent, the provision of the heat dissipation holes increases the risk of water and dust ingress. At the same time, when the above device is in use, air circulation can only be carried out through the limited space provided by the heat dissipation holes, and the internal heat of the device is dissipated by means of the circulating air. When the heat dissipation adapter works for a long time, its internal temperature is difficult to cool down quickly, which directly affects the performance and life of the adapter, and is also related to the safety of use. Therefore, a power adapter with power supply overtemperature protection is needed to solve the above problems. Utility Model Content

[0004] The purpose of the utility model is to provide a power adapter with over-temperature protection for power supply, which has the advantages of improving the heat dissipation efficiency of the adapter and preventing water and dust from entering, thereby solving the problems of low heat dissipation efficiency and poor waterproof and dustproof performance of the adapter in the prior art.

[0005] To achieve the above-mentioned object, the present invention provides the following technical solution: a power supply adapter with over-temperature protection, comprising a main body, a heat dissipation assembly fixedly mounted on the upper end surface of the main body, a main board fixedly mounted inside the main body, and a temperature sensor and a processor provided on the main board;

[0006] The main body includes a shell, the upper end surface of the shell is provided with a reserved groove, a panel is embedded in the reserved groove, and the front end of the shell is provided with a mounting hole;

[0007] A plug-in slot is provided in the middle of the upper end surface of the panel, a thermal conductive column passes through the plug-in slot, the bottom end of the thermal conductive column extends into the main body and contacts the upper end surface of the processor but is not fixedly connected, a screw hole is provided on the upper end surface of the panel outside the plug-in slot, and a wire threading hole is provided on the upper end surface of the panel at the rear end of the plug-in slot.

[0008] Preferably, the heat dissipation assembly includes heat dissipation fins and a heat dissipation fan. The connecting wires on the heat dissipation fan pass through the wire holes and are electrically connected to the mainboard. The heat dissipation fan is welded and installed at the rear end of the heat dissipation fins. The bottom of the heat dissipation fins contacts the top of the thermal conductive column but is not fixedly connected. In the design, the heat dissipation assembly consists of heat dissipation fins and a heat dissipation fan to achieve efficient thermal management. The connecting wires of the heat dissipation fan cleverly pass through the wire holes to ensure that the electrical connection with the mainboard is both stable and concealed, and the connection is dustproof and waterproof. The heat dissipation fan is fixed to the rear end of the heat dissipation fins by welding to ensure the stability of the structure. The bottom of the heat dissipation fin contacts the top of the thermal conductive column. This design not only optimizes the heat conduction path, but also avoids rigid connection, increasing the flexibility and durability of the system. The combination of the heat dissipation fan and the heat dissipation fins provides powerful heat dissipation capacity, effectively reducing the operating temperature of the equipment. The welding installation method enhances the structural stability of the heat dissipation assembly and ensures the reliability of long-term operation. The non-fixed contact design between the heat dissipation fins and the thermal conductive column allows a certain degree of thermal expansion and reduces thermal stress.

[0009] Preferably, the four corners of the bottom of the heat sink fins are provided with holes and mounting screws are movably inserted therein. The bottom of the mounting screws passes through the heat sink fins and is threaded into the screw holes. The design of the heat sink fins takes into account the convenience of installation and the stability of the structure. The openings at the four corners of the bottom of the heat sink fins allow the mounting screws to be movably inserted. This design simplifies the installation process while providing a secure fixation. At the same time, the mounting screws pass through the heat sink fins and are threaded into the screw holes, ensuring a tight connection between the heat sink assembly and the power adapter body, and enhancing the stability of the overall structure.

[0010] Preferably, a power cord is provided at the rear end of the motherboard, the power cord passes through the rear end of the shell, a choke is provided on the power cord, and a female socket is provided at the front end of the motherboard, which passes through the mounting hole. In the design, the power cord at the rear end of the motherboard of the power adapter passes through the rear end of the shell. This design not only maintains the neat appearance of the power adapter, but also facilitates the management and maintenance of the power cord. The choke on the power cord effectively reduces electromagnetic interference and ensures the purity and stability of the power supply. The female socket design at the front end of the motherboard, which passes through the mounting hole, ensures the stable installation of the female socket and the reliability of the electrical connection.

[0011] Preferably, the female socket includes a socket and a switch, and the switch is electrically connected to the socket. In this design, the female socket includes the socket and the switch, and the two are electrically connected to realize the control function of the power adapter. The electrical connection design between the switch and the socket not only simplifies the user's operation process, but also improves the safety and convenience of the power adapter.

[0012] Preferably, a mounting slot is defined at the front end of the upper end of the panel, into which a display screen is embedded. The display screen is made of an LCD material and is electrically connected to the mainboard. This design not only provides an intuitive user interface, but also allows for real-time monitoring of the power adapter's operating status, including temperature information and any abnormality warnings, through the display screen, greatly enhancing the user experience and device monitoring capabilities.

[0013] Preferably, the top and bottom of the thermal column are coated with thermally conductive silicone, and the connection between the column and the insertion slot is filled with sealant. The design of the thermal column pays attention to detail and performance. The top and bottom of the thermal column are coated with thermally conductive silicone. This design significantly improves heat conduction efficiency and ensures rapid heat transfer. The connection between the thermal column and the insertion slot is filled with sealant. This sealing treatment not only enhances structural stability but also improves the water and dust resistance of the power adapter, enabling it to operate stably in a wider range of environmental conditions.

[0014] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0015] In the present invention, the heat dissipation component is directly fixed on the upper end surface of the main body. This design allows the heat dissipation component to be placed outside the power adapter, so that under normal temperature conditions, the temperature of the heat dissipation fins is still lower than the temperature of the motherboard. At the same time, the heat conduction column passes through the insertion slot of the panel, and its bottom end extends into the main body and contacts the upper end surface of the processor. This design allows the heat generated by the processor to be directly transferred to the thermal column, and the heat is conducted to the outside through the thermal column to achieve effective heat dissipation. The contact between the thermal column and the processor is not fixed. This design can adapt to thermal expansion and mechanical vibration to a certain extent, and reduce the thermal stress and mechanical stress caused by fixed connection. Screw holes are provided on the outside of the insertion slot on the panel. This design allows the heat dissipation component on the panel to be fastened by screws and enhances the sealing, thereby preventing moisture and dust from entering the adapter through the gap. The wire hole is located at the rear end of the insertion slot. This layout allows the connecting wires on the heat dissipation component to pass through a fixed position, reducing the area of ​​the cable exposed to the outside and reducing the risk of water and dust ingress. The temperature sensor monitors the internal temperature of the adapter in real time. Once the temperature is detected to exceed the preset safety threshold, the processor will initiate corresponding protection measures, such as reducing power output and starting the cooling fan to prevent overheating, thereby improving the heat dissipation efficiency of the adapter and avoiding water and dust ingress. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the main structure of the utility model;

[0017] Figure 2This is a schematic diagram of the shell connection structure of the utility model;

[0018] Figure 3 This is a schematic diagram of the mainboard connection structure of the present utility model;

[0019] Figure 4 This is a schematic structural diagram of the heat dissipation component of the present utility model.

[0020] In the figure: 1. Power cord; 11. Choke; 2. Main body; 21. Shell; 23. Reserved slot; 24. Mounting hole; 3. Display screen; 4. Female socket; 41. Socket; 42. Switch; 5. Panel; 51. Wire hole; 52. Screw hole; 53. Insertion slot; 54. Mounting slot; 6. Heat dissipation component; 61. Heat dissipation fins; 62. Cooling fan; 7. Mainboard; 71. Temperature column; 72. Temperature sensor; 73. Processor. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0022] Example 1

[0023] like Figure 1 、 Figure 2 、 Figure 3 and Figure 4 As shown, an embodiment of the present invention provides: a power supply adapter with over-temperature protection, comprising a main body 2, a heat dissipation component 6 fixedly mounted on the upper end surface of the main body 2, a main board 7 fixedly mounted inside the main body 2, and a temperature sensor 72 and a processor 73 provided on the main board 7;

[0024] The main body 2 includes a shell 21, the upper end surface of the shell 21 is provided with a reserved groove 23, the reserved groove 23 is embedded in the panel 5, and the front end of the shell 21 is provided with a mounting hole 24;

[0025] An insertion slot 53 is provided in the middle of the upper end surface of the panel 5, and a thermal conductive column 71 passes through the insertion slot 53. The bottom end of the thermal conductive column 71 extends into the main body 2 and contacts the upper end surface of the processor 73 but is not fixedly connected. A screw hole 52 is provided on the upper end surface of the panel 5 outside the insertion slot 53, and a wire hole 51 is provided on the upper end surface of the panel 5 at the rear end of the insertion slot 53.

[0026] Specifically, the heat dissipation component 6 is directly fixed on the upper end surface of the main body 2. This design allows the heat dissipation component 6 to be placed outside the power adapter, so that under normal temperature conditions, the temperature of the heat dissipation fins 61 is still lower than the temperature of the main board 7. At the same time, the heat conduction column 71 passes through the insertion slot 53 of the panel 5, and its bottom end extends into the main body 2 and contacts the upper end surface of the processor 73. This design allows the heat generated by the processor 73 to be directly transferred to the thermal conductive column 71, and the heat is conducted to the outside through the thermal conductive column 71 to achieve effective heat dissipation. The contact between the thermal conductive column 71 and the processor 73 is not fixed. This design can adapt to thermal expansion and mechanical vibration to a certain extent, and reduce the thermal stress and mechanical stress caused by the fixed connection. A screw hole 52 is provided on the outside of the insertion slot 53 on the panel 5. This design allows the heat dissipation component 6 on the panel 5 to be fastened by screws and enhances the sealing, thereby preventing moisture and dust from entering the interior of the adapter through the gap. The wire hole 51 is located at the rear end of the insertion slot 53. This layout allows the connecting wires on the heat dissipation component 6 to pass through a fixed position, reducing the area of ​​the cable exposed to the outside and reducing the risk of water and dust ingress. The temperature sensor 72 monitors the internal temperature of the adapter in real time. Once it is detected that the temperature exceeds the preset safety threshold, the processor 73 will initiate corresponding protection measures, such as reducing power output and starting the cooling fan 62 to prevent overheating, thereby improving the heat dissipation efficiency of the adapter and avoiding water and dust ingress.

[0027] Example 2

[0028] In order to improve the stability of the heat dissipation components during installation, such as Figure 1 、 Figure 2 and Figure 4 As shown, in this embodiment, the heat dissipation assembly 6 includes heat dissipation fins 61 and a heat dissipation fan 62. The connecting wires on the heat dissipation fan 62 pass through the threading holes 51 and are electrically connected to the mainboard 7. The heat dissipation fan 62 is welded and installed on the rear end of the heat dissipation fins 61. The bottom of the heat dissipation fins 61 is in contact with the top of the heat conduction column 71 but is not fixedly connected. In the design, the heat dissipation assembly 6 consists of heat dissipation fins 61 and heat dissipation fan 62 to achieve efficient thermal management. The connecting wires of the heat dissipation fan 62 cleverly pass through the threading holes 51 to ensure that the electrical connection with the mainboard 7 is both stable and concealed, and the connection is dustproof and waterproof. The heat dissipation fan 62 is fixed to the rear end of the heat dissipation fins 61 by welding to ensure the stability of the structure. The bottom of the heat sink fin 61 contacts the top of the thermal conductive column 71. This design not only optimizes the heat conduction path, but also avoids rigid connection, increasing the flexibility and durability of the system. The combination of the cooling fan 62 and the heat sink fin 61 provides powerful heat dissipation capabilities, effectively reducing the operating temperature of the equipment. The welding installation method enhances the structural stability of the heat sink assembly 6 and ensures long-term operational reliability. The non-fixed contact design between the heat sink fin 61 and the thermal conductive column 71 allows a certain degree of thermal expansion and reduces thermal stress.

[0029] Furthermore, holes are opened at the four corners of the bottom of the heat sink 61 and mounting screws are movably inserted. The bottom of the mounting screw passes through the heat sink 61 and is threaded into the screw hole 52. The design of the heat sink 61 takes into account the convenience of installation and structural stability. The opening design at the four corners of the bottom of the heat sink 61 allows the mounting screws to be movably inserted. This design simplifies the installation process while providing a secure fixation. At the same time, the mounting screws pass through the heat sink 61 and are threaded into the screw hole 52, ensuring a tight connection between the heat sink assembly 6 and the power adapter body 2, enhancing the stability of the overall structure.

[0030] Furthermore, the top and bottom of the thermal conductive column 71 are coated with thermally conductive silicone, and the connection between the thermal conductive column 71 and the insertion slot 53 is filled with sealant. The design of the thermal conductive column 71 pays attention to detail and performance. The top and bottom of the thermal conductive silicone are brushed with thermally conductive silicone. This design significantly improves the efficiency of heat conduction and ensures rapid heat transfer. The connection between the thermal conductive column 71 and the insertion slot 53 is filled with sealant. This sealing treatment not only enhances the stability of the structure, but also improves the waterproof and dustproof performance of the power adapter, enabling it to operate stably in a wider range of environmental conditions.

[0031] Example 3

[0032] In order to improve the dustproof and waterproof performance of the motherboard during use, and to facilitate the mastering of the motherboard working information, such as Figure 2 and Figure 3 As shown, in this embodiment, a power cord 1 is provided at the rear end of the mainboard 7, and the power cord 1 passes through the rear end of the housing 21. A choke 11 is provided on the power cord 1, and a female socket 4 is provided at the front end of the mainboard 7, and the female socket 4 passes through the mounting hole 24. In the design, the power cord 1 at the rear end of the mainboard 7 of the power adapter passes through the rear end of the housing 21. This design not only maintains the neat appearance of the power adapter, but also facilitates the management and maintenance of the power cord 1. The choke 11 on the power cord 1 effectively reduces electromagnetic interference and ensures the purity and stability of the power supply. The female socket 4 at the front end of the mainboard 7 is designed to pass through the mounting hole 24, ensuring the stable installation of the female socket 4 and the reliability of the electrical connection.

[0033] Furthermore, the female connector 4 includes a socket 41 and a switch 42, which is electrically connected to the socket 41. In this design, the female connector 4 includes the socket 41 and the switch 42, which are electrically connected to realize the control function of the power adapter. The electrical connection design between the switch 42 and the socket 41 not only simplifies the user's operation process, but also improves the safety and convenience of the power adapter.

[0034] Furthermore, a mounting slot 54 is defined at the front end of the upper end of the panel 5. A display screen 3, designed using an LCD material, is embedded and mounted within the mounting slot 54. The display screen 3, designed using advanced LCD material, is electrically connected to the mainboard 7. This design not only provides an intuitive user interface, but also allows for real-time monitoring of the power adapter's operating status, including temperature information and any abnormality warnings, through the display screen 3, greatly enhancing the user experience and device monitoring capabilities.

[0035] When the present invention is used, the heat dissipation component is installed on the panel, the bottom of the mounting screw passes through the heat dissipation fin 61 and is threadedly installed in the screw hole 52 to fix the heat dissipation component 6, and the bottom of the heat dissipation fin 61 contacts the top of the temperature conducting column 71 to improve the heat dissipation efficiency. Turn on the switch 42 on the mother seat 4, start the power adapter, and the power adapter starts working to convert AC power into DC power for use by the device. A temperature sensor 72 and a processor 73 are provided on the main board 7. The temperature sensor 72 monitors the internal temperature of the adapter in real time. When it is detected that the temperature exceeds the preset safety threshold, the processor 73 controls the power adapter to reduce the temperature. Power is output and the cooling fan 62 is started to prevent overheating and quickly cool the processor 73. The top and bottom of the temperature conducting column 71 are coated with thermal silica gel to improve the heat conduction efficiency. The connection between the temperature conducting column 71 and the insertion slot 53 is filled with sealant to improve the waterproof and dustproof performance. The user can monitor the working status of the power adapter through the display 3, including temperature information and any abnormal warnings. During the entire use process, the design of the adapter ensures that even under high load or long-term working conditions, it can prevent overheating through effective heat dissipation and temperature monitoring mechanisms to ensure the safety of the adapter and connected devices.

[0036] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be encompassed within the present invention. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

Claims

1. A power supply adapter with over-temperature protection, comprising a main body (2), a heat dissipation component (6) fixedly mounted on the upper end surface of the main body (2), a main board (7) fixedly mounted inside the main body (2), and a temperature sensor (72) and a processor (73) provided on the main board (7), characterized in that: The main body (2) includes a shell (21), the upper end surface of the shell (21) is provided with a reserved groove (23), a panel (5) is embedded and installed in the reserved groove (23), and the front end of the shell (21) is provided with a mounting hole (24); A plug-in slot (53) is provided in the middle of the upper end surface of the panel (5), a heat conducting column (71) passes through the plug-in slot (53), the bottom end of the heat conducting column (71) extends into the body (2) and contacts the upper end surface of the processor (73) but is not fixedly connected, a screw hole (52) is provided on the upper end surface of the panel (5) outside the plug-in slot (53), and a threading hole (51) is provided on the upper end surface of the panel (5) at the rear end of the plug-in slot (53).

2. The power adapter with over-temperature protection according to claim 1, characterized in that: The heat dissipation assembly (6) includes heat dissipation fins (61) and a heat dissipation fan (62). The connecting wire on the heat dissipation fan (62) passes through the wire hole (51) and is electrically connected to the main board (7). The heat dissipation fan (62) is welded and installed on the rear end of the heat dissipation fins (61). The bottom of the heat dissipation fins (61) contacts the top of the temperature conducting column (71) but is not fixedly connected.

3. The power adapter with over-temperature protection according to claim 2, characterized in that: Holes are respectively opened at the four corners of the bottom of the heat dissipation fin (61) and movably inserted with mounting screws. The bottom of the mounting screw passes through the heat dissipation fin (61) and is threadedly installed in the screw hole (52).

4. The power adapter with over-temperature protection according to claim 1, characterized in that: The rear end of the mainboard (7) is provided with a power line (1), which passes through the rear end of the housing (21). A choke coil (11) is provided on the power line (1). The front end of the mainboard (7) is provided with a female socket (4), which passes through the mounting hole (24).

5. The power adapter with over-temperature protection according to claim 4, characterized in that: The female socket (4) comprises a socket (41) and a switch (42), and the switch (42) is electrically connected to the socket (41).

6. The power adapter with over-temperature protection according to claim 1, characterized in that: The front end of the upper end of the panel (5) is provided with a mounting groove (54), and a display screen (3) is embedded and installed in the mounting groove (54). The display screen (3) is designed with a liquid crystal screen material, and the display screen (3) is electrically connected to the mainboard (7).

7. The power adapter with over-temperature protection according to claim 1, characterized in that: The top and bottom of the temperature conducting column (71) are both coated with heat-conducting silica gel, and the connection between the temperature conducting column (71) and the insertion slot (53) is filled with sealant.

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