Microcrystal solder ball blanking device

Abstract

The utility model relates to the field of microcrystal solder balls, in particular to a microcrystal solder ball discharging device which comprises a die casting machine, a material guiding assembly is arranged at a discharging opening in the bottom of the die casting machine, the material guiding assembly comprises a lower material guiding part and an upper material guiding part, the lower material guiding part comprises a lower material guiding plate and a partition plate, the upper material guiding part comprises an upper material guiding plate, and the partition plate is arranged on the lower material guiding plate. One end of the upper material guide plate is fixedly connected with one end of the lower material guide plate, and the upper material guide plate is designed to be inclined; according to the die-casting machine, the material guiding assembly is arranged at the discharging opening of the die-casting machine, the upper material guiding plate and the lower material guiding plate in the material guiding assembly can be used for guiding flow of the microcrystal solder balls, the microcrystal solder balls can roll along the upper material guiding plate and the lower material guiding plate, and meanwhile the microcrystal solder balls are prevented from colliding with one another under the separation effect of the upper partition plate; and in the falling process, the material guide block can reduce the falling acting force of the microcrystal tin balls, the buffering effect is achieved, and the microcrystal tin balls are further protected.

Description

Technical Field

[0001] This utility model relates to the field of microcrystalline solder balls, specifically to a microcrystalline solder ball feeding device. Background Art

[0002] Microcrystalline solder balls play an important role in the electronics industry, especially in the assembly of multiple integrated circuits. They are often used as connecting elements to ensure the stability and reliability of circuits. With the development of communication and information technology, microcrystalline solder balls are also being used more and more widely in consumer electronics products such as digital and intelligent communication electronics and satellite positioning systems.

[0003] During the production of microcrystalline solder balls, the formed microcrystalline solder balls are discharged from the feed port of the die-casting machine and enter the guide plate. When they roll on the guide plate, there will be a problem of multiple microcrystalline solder balls colliding with each other. Furthermore, since the microcrystalline solder balls are not stable in shape when they are first formed, they are prone to being damaged by bumps and knocks. Utility Model Content

[0004] Based on the above description, this utility model provides a microcrystalline solder ball feeding device to solve the problem of multiple microcrystalline solder balls colliding with each other in existing microcrystalline solder balls.

[0005] The technical solution of this utility model to solve the above-mentioned technical problems is as follows: a microcrystalline tin ball feeding device, including a die casting machine;

[0006] A material guiding assembly is provided at the material discharge port at the bottom of the die casting machine. The material guiding assembly includes a lower material guiding part and an upper material guiding part.

[0007] Furthermore, the lower guide section includes a lower guide plate and a partition, and the upper guide section includes an upper guide plate. One end of the upper guide plate is fixedly connected to one end of the lower guide plate. The upper guide plate is designed to be inclined, and there are several partitions. The several partitions are evenly fixedly installed on the upper guide plate and the lower guide plate.

[0008] Furthermore, the upper guide section also includes a guide block, which is fixedly installed on the top of the upper guide plate, and one side of the guide block is designed to be arc-shaped.

[0009] Based on the above technical solution, the present invention can be further improved as follows.

[0010] Furthermore, the lower guide section also includes several discharge ports, which are evenly arranged on the top of the lower guide plate.

[0011] Furthermore, the partition has a cavity inside, and air outlets are evenly distributed on the side wall of the partition, and the air outlets are connected to the cavity inside the partition.

[0012] Furthermore, a cooling section is fixedly installed on the top of the upper guide plate. The cooling section includes a cooling plate, a connecting pipe, and an air duct. The cooling plate has a cavity inside, and the entire cooling plate is fixedly connected to the top surface of the upper guide plate.

[0013] Furthermore, one end of the connecting pipe is connected to the bottom of the cooling plate, and the other end is fixedly connected to the partition plate. The connecting pipe is also connected to the cavity of the cooling plate and the chamber of the partition plate.

[0014] Furthermore, one end of the air duct is fixedly connected to the side wall of the cooling plate, and the air duct communicates with the cavity of the cooling plate. An air pump is connected to the end of the air duct away from the cooling plate, and the air pump is installed on the side wall of the die-casting machine.

[0015] Furthermore, the number of air outlets is several, and the several air outlets are evenly distributed on the side wall of the partition, and the positions of the air outlets are all located on the partition at the upper guide plate.

[0016] Compared with the prior art, the technical solution of this application has the following beneficial technical effects:

[0017] 1. This utility model provides a material guiding component at the discharge port of the die-casting machine. The upper and lower guide plates in the material guiding component can guide the microcrystalline solder balls, allowing them to roll along the upper and lower guide plates. At the same time, the upper partition plate separates the microcrystalline solder balls to prevent them from colliding with each other. During the falling process, the guide block can reduce the force of the falling microcrystalline solder balls, playing a buffering role and further protecting the microcrystalline solder balls.

[0018] 2. By installing a cooling plate on the upper guide plate, along with an air pump and air pipe, air is blown onto the microcrystalline solder balls through the air outlet on the partition, thereby cooling the microcrystalline solder balls, reducing their temperature, and ensuring the overall shape of the microcrystalline solder balls. Attached Figure Description

[0019] Figure 1 A schematic diagram of a microcrystalline solder ball feeding device provided in an embodiment of this utility model;

[0020] Figure 2 This is a three-dimensional structural diagram of the material guiding component in this utility model;

[0021] Figure 3 This is a three-dimensional structural diagram of the upper guide plate and the lower guide plate in this utility model;

[0022] Figure 4 This is a bottom-view three-dimensional structural diagram of the die-casting machine in this utility model.

[0023] The attached diagram lists the components represented by each number as follows:

[0024] 1. Die-casting machine; 2. Material guiding assembly; 201. Lower material guiding section; 2011. Lower material guiding plate; 2012. Baffle plate; 2013. Discharge port; 2014. Air outlet; 202. Upper material guiding section; 2021. Upper material guiding plate; 2022. Material guiding block; 3. Cooling section; 301. Cooling plate; 302. Connecting pipe; 303. Air duct; 4. Air pump. DETAILED DESCRIPTION

[0025] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings, which illustrate embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this application will be thorough and complete.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0027] It should be noted that when one element is considered to be "connected" to another element, it can be directly connected to the other element or connected to the other element through an intermediary element. In the following embodiments, "connection" should be understood as "electrical connection," "communication connection," etc., if the connected circuits, modules, units, etc., have the transmission of electrical signals or data between them.

[0028] When used herein, the singular forms of “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising,” “including,” or “having,” etc., specify the presence of the stated feature, whole, step, operation, component, part, or combination thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof.

[0029] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0030] It should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the technical product is in use. They are used only for the convenience of describing the technology and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the technology. Furthermore, "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature. Therefore, the terms "first," "second," "third," etc., are used only for distinguishing descriptions and should not be construed as indicating or implying relative importance. In the description of this utility model, unless otherwise stated, "multiple" means two or more.

[0031] Furthermore, terms such as "horizontal," "vertical," and "sag" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal relative to "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0032] In the description of this technology, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this technology based on the specific circumstances.

[0033] Please see Figure 1 and Figure 2 A microcrystalline tin ball feeding device, comprising a die-casting machine 1;

[0034] A material guiding assembly 2 is provided at the bottom of the die casting machine 1, which includes a lower material guiding part 201 and an upper material guiding part 202.

[0035] The lower guide section 201 includes a lower guide plate 2011 and a partition plate 2012. The upper guide section 202 includes an upper guide plate 2021. One end of the upper guide plate 2021 is fixedly connected to one end of the lower guide plate 2011. The upper guide plate 2021 is designed to be inclined. There are several partition plates 2012. Several partition plates 2012 are evenly fixedly installed on the upper guide plate 2021 and the lower guide plate 2011.

[0036] A guide assembly 2 is installed at the unloading point of the die casting machine 1 to facilitate the use of the upper guide plate 2021 and the lower guide plate 2011 in the guide assembly 2 to guide the microcrystalline solder balls. At the same time, partitions 2012 are installed on the upper guide plate 2021 and the lower guide plate 2011 to separate and guide the microcrystalline solder balls, thereby avoiding the phenomenon of microcrystalline solder balls colliding with each other.

[0037] Please see Figure 2 and Figure 3 In this embodiment, the upper guide section 202 also includes a guide block 2022, which is fixedly installed on the top of the upper guide plate 2021, and one side of the guide block 2022 is designed to be arc-shaped.

[0038] A guide block 2022 is set on the upper guide plate 2021 to guide the microcrystalline solder balls during unloading, so that the microcrystalline solder balls do not fall directly onto the upper guide plate 2021. This has a certain buffering effect and further prevents the microcrystalline solder balls from falling directly and being damaged by impact.

[0039] Please see Figure 2 and Figure 3 In this embodiment, the lower guide section 201 also includes a discharge port 2013. The number of discharge ports 2013 is several, and the several discharge ports 2013 are evenly arranged on the top of the lower guide plate 2011.

[0040] The microcrystalline solder balls roll along the upper guide plate 2021 to the lower guide plate 2011, and are then smoothly discharged from the outlet 2013 opened on the lower guide plate 2011.

[0041] Please see Figure 2 and Figure 3 In this embodiment, the partition 2012 has a cavity inside, and air outlets 2014 are evenly provided on the side wall of the partition 2012. The air outlets 2014 are connected to the cavity inside the partition 2012.

[0042] Please see Figure 4 In this embodiment, a cooling section 3 is fixedly installed on the top of the upper guide plate 2021. The cooling section 3 includes a cooling plate 301, a connecting pipe 302 and an air guide pipe 303. The cooling plate 301 has a cavity inside, and the entire cooling plate 301 is fixedly connected to the top surface of the upper guide plate 2021.

[0043] Both the connecting pipe 302 and the air guide pipe 303 are used to conduct cooling air, allowing the air to be blown out from the air outlet 2014 of the partition 2012 to cool the microcrystalline solder balls, accelerate the cooling and forming of the microcrystalline solder balls, and make their shape more stable.

[0044] Please see Figure 2 , Figure 3 and Figure 4 In this embodiment, one end of the connecting pipe 302 is connected to the bottom of the cooling plate 301, and the other end is fixedly connected to the partition plate 2012. The connecting pipe 302 communicates with the cavity of the cooling plate 301 and the chamber of the partition plate 2012 respectively.

[0045] Please see Figure 4 In this embodiment, one end of the air duct 303 is fixedly connected to the side wall of the cooling plate 301, and the air duct 303 communicates with the cavity of the cooling plate 301. The end of the air duct 303 away from the cooling plate 301 is connected to an air pump 4, which is installed on the side wall of the die-casting machine 1.

[0046] The air pump 4 on the side wall of the die-casting machine 1 can blow out air, which enters the cooling plate 301 through the air guide pipe 303, then enters the partition plate 2012 through the connecting pipe 302, and finally blows out from the air outlet 2014 of the partition plate 2012 to cool the microcrystalline solder balls.

[0047] Please see Figure 2 and Figure 3 In this embodiment, there are several air outlets 2014. The several air outlets 2014 are evenly distributed on the side wall of the partition 2012, and the air outlets 2014 are all located on the partition 2012 at the upper guide plate 2021.

[0048] The air outlet 2014 is located on the upper guide plate 2021. Since the upper guide plate 2021 is designed to be inclined, under the action of gravity, the air will not affect the normal rolling of the microcrystalline solder balls from the upper guide plate 2021 when cooling is blown.

[0049] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A microcrystalline tin ball feeding device, comprising a die-casting machine (1), characterized in that: The die-casting machine (1) is provided with a material guide assembly (2) at the bottom of the material discharge port. The material guide assembly (2) includes a lower material guide part (201) and an upper material guide part (202). The lower guide section (201) includes a lower guide plate (2011) and a partition plate (2012), and the upper guide section (202) includes an upper guide plate (2021). One end of the upper guide plate (2021) is fixedly connected to one end of the lower guide plate (2011). The upper guide plate (2021) is designed to be inclined, and there are several partition plates (2012). Several partition plates (2012) are evenly fixedly installed on the upper guide plate (2021) and the lower guide plate (2011). The partition (2012) has a cavity inside, and air outlets (2014) are evenly provided on the side wall of the partition (2012). The air outlets (2014) are connected to the cavity inside the partition (2012).

2. The microcrystalline solder ball feeding device according to claim 1, characterized in that, The upper guide section (202) also includes a guide block (2022), which is fixedly installed on the top of the upper guide plate (2021), and one side of the guide block (2022) is designed to be arc-shaped.

3. The microcrystalline solder ball feeding device according to claim 1, characterized in that, The lower guide section (201) also includes a discharge port (2013), and the number of discharge ports (2013) is several, and the several discharge ports (2013) are evenly arranged on the top of the lower guide plate (2011).

4. The microcrystalline solder ball feeding device according to claim 1, characterized in that, A cooling section (3) is fixedly installed on the top of the upper guide plate (2021). The cooling section (3) includes a cooling plate (301), a connecting pipe (302), and an air duct (303). The cooling plate (301) has a cavity inside, and the entire cooling plate (301) is fixedly connected to the top surface of the upper guide plate (2021).

5. The microcrystalline solder ball feeding device according to claim 4, characterized in that, One end of the connecting pipe (302) is connected to the bottom of the cooling plate (301), and the other end is fixedly connected to the partition plate (2012). The connecting pipe (302) is connected to the cavity of the cooling plate (301) and the chamber of the partition plate (2012) respectively.

6. The microcrystalline solder ball feeding device according to claim 5, characterized in that, One end of the air duct (303) is fixedly connected to the side wall of the cooling plate (301), and the air duct (303) communicates with the cavity of the cooling plate (301). An air pump (4) is connected to the end of the air duct (303) away from the cooling plate (301), and the air pump (4) is installed on the side wall of the die casting machine (1).

7. The microcrystalline solder ball feeding device according to claim 3, characterized in that, The number of air outlets (2014) is several, and the several air outlets (2014) are evenly distributed on the side wall of the partition (2012), and the air outlets (2014) are all located on the partition (2012) at the upper guide plate (2021).

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