Chip heat dissipation device for generator regulator

By designing a combination of heat spreaders, heat pipes, and fans on the upper and lower surfaces of the chip, the problem of uneven heat dissipation was solved, achieving more efficient heat dissipation and stable connection, thus ensuring the stable operation of the chip.

CN223513962UActive Publication Date: 2025-11-04RUIAN CITY XUCHEN ELECTRONIC CO LTD
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Patent Information

Application Number
CN202422968209.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-03
Publication Date
2025-11-04
Estimated Expiration
2034-12-03

AI Technical Summary

Technical Problem

Existing chip heat dissipation devices only dissipate heat from the chip surface, neglecting the heat dissipation needs at the bottom. This results in uneven heat dissipation, generating thermal stress, which may damage the chip.

Method used

A chip heat dissipation device for generator regulators was designed, which adopts a combination of first and second heat dissipation plates, heat pipes, heat dissipation fins and fans to achieve heat dissipation on the upper and lower surfaces of the chip at the same time, and is connected to the socket through evenly distributed pins to simplify the installation process.

Benefits of technology

This achieves uniform heat dissipation on the upper and lower surfaces of the chip, improving heat dissipation efficiency, preventing detachment and loosening, and enhancing the stability and reliability of the equipment.

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Abstract

The utility model relates to the technical field of chip heat dissipation, in particular to a chip heat dissipation device for a generator regulator. According to the technical scheme, the chip heat dissipation device for the generator regulator comprises a chip, a first vapor chamber is installed on the chip, the chip is installed on a base, a groove is formed in the contact face of the base and the chip, a second vapor chamber is installed on the base through the groove, heat dissipation devices are installed at the two ends of the second vapor chamber, and the heat dissipation devices are installed on the base. A first vapor chamber is installed on the upper surface of the chip, culvert pipes are installed at the two ends of the first vapor chamber, and the radiator corresponds to the culvert pipes in position. Through the synergistic effect of heat dissipation modes such as heat conduction, convection and radiation, the heat dissipation device can effectively dissipate heat generated by the chip to the surrounding environment, and it is ensured that the chip can still keep a low temperature during high-load operation. Therefore, the service life of the chip is prolonged, and the stability and reliability of the system are improved.
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Citation Information

Patent Citations

  • Chip heat dissipation device

    CN117690889A