Open headphone
Open-back headphones, through their suspension design and cone-shaped sound-emitting cap, solve the problems of audio distortion and wearing discomfort of traditional headphones, achieving comfortable long-term use and a high-fidelity sound experience, especially with excellent performance in the high and low frequency ranges.
Patent Information
- Application Number
- CN202423101109.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-16
- Publication Date
- 2025-11-04
- Estimated Expiration
- 2034-12-16
AI Technical Summary
Traditional headphones suffer from audio distortion and discomfort, especially in high-fidelity and low-frequency performance, where they struggle to achieve ideal sound quality. Furthermore, prolonged wear can cause ear fatigue or pressure.
Adopting an open-back headphone design, it combines a headband, earcups, headphone components, and a cone-shaped sound cover. The headphone components are suspended by a support to avoid the physical pressure of traditional headphone and the resonant sound pressure of in-ear headphones. The cone-shaped sound cover reduces audio distortion, and the sound quality is improved through low-frequency, high-frequency, and ultra-high-frequency sound units. The FPC piezoelectric diaphragm enhances ultra-high frequency performance.
It provides a comfortable wearing experience, without feeling pressure during long-term use, and the sound quality is natural and realistic, especially performing well in the high and low frequency ranges. It reduces reflected wave interference and improves the purity and focus of the sound quality.
Smart Images

Figure CN223515032U_ABST