Polished quartz wafer shallow scratch detection device

Abstract

The utility model discloses a polished quartz wafer shallow scratch detection device which comprises a detection unit which comprises a box body, the inner bottom wall of the box body is fixedly connected with a detection table, the two sides of the upper surface of the detection table are fixedly connected with electric guide rails, the upper surfaces of the electric guide rails are provided with rotating assemblies, and the rotating assemblies are connected with the detection table. A fixing plate is arranged on the upper surface of the rotating assembly, an electric telescopic rod is fixedly connected to the interior of the fixing plate, a clamping plate is fixedly connected to the output end of the electric telescopic rod, a detection head is arranged on the upper portion of the inner wall of the box body, and moving assemblies are arranged on the outer surfaces of the two sides of the box body. The wafer can be controlled to move left and right through the arrangement of the electric guide rail, the wafer can be controlled to move front and back through the electric telescopic rod, the position of the wafer can be changed through the rotating assembly, the time for changing the position is shortened, the detection efficiency is improved, and meanwhile damage to the wafer is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to scratch detection technical field especially, relates to a kind of shallow scratch detection device of polishing quartz wafer. BACKGROUND

[0002] The main component of quartz wafer is silicon dioxide, and like glass, it is called wafer because the arrangement of silicon dioxide is ordered, thereby forming crystal. This material has directionality and stable properties, so it is widely used. During the manufacturing process of the wafer, it is usually mechanically cut, and then the cut wafer is coarsely ground, finely ground and mechanically polished. However, scratches may be left on the surface of the wafer during polishing, and then a detector may be used to detect the scratches. Most of the current detection equipment uses a camera to take pictures, enlarges the pictures, and then uses image recognition technology to identify shallow scratches, damage and other defects.

[0003] When the device is detecting, the wafer needs to be fixed. After taking a picture, the position of the wafer needs to be adjusted. However, manual adjustment is slow and may cause secondary damage to the wafer. SUMMARY

[0004] This section aims to outline some aspects of the embodiments of the utility model and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and the abstract of the specification and the utility model name to avoid obscuring the purpose of this section, the abstract of the specification and the utility model name. Such simplifications or omissions cannot be used to limit the scope of the utility model.

[0005] In view of the above problems of the existing shallow scratch detection device for polishing quartz wafer, the utility model is proposed.

[0006] Therefore, the utility model aims to provide a shallow scratch detection device for polishing quartz wafer, which solves the problem of "the device needs to fix the wafer during detection, and the position of the wafer needs to be adjusted after taking a picture. However, manual adjustment is slow and may cause secondary damage to the wafer".

[0007] To solve the above technical problems, the utility model provides the following technical scheme: a shallow scratch detection device for polishing quartz wafer, comprising:

[0008] The detection unit comprises a box body, a detection table is fixedly connected to the inner bottom wall of the box body, electric guide rails are fixedly connected to the upper surface of the detection table on both sides, a rotating assembly is arranged on the upper surface of the electric guide rails, a fixed plate is arranged on the upper surface of the rotating assembly, an electric telescopic rod is fixedly connected to the inside of the fixed plate, a clamping plate is fixedly connected to the output end of the electric telescopic rod, a detection head is arranged on the inner wall of the box body, and a moving assembly is arranged on the outer surface of both sides of the box body.

[0009] As a preferred scheme of the polishing quartz wafer shallow scratch detection device, the inner wall upper portion of the box is fixedly connected with a mounting plate, the inside of the mounting plate is fixedly connected with a lifter, and the outer surface of the detection head is fixedly connected to the lower end of the lifter.

[0010] As a preferred scheme of the polishing quartz wafer shallow scratch detection device, the front side outer surface of the box is rotatably connected with a door plate, an observation window is formed in the middle of the outer surface of the door plate, a transparent plate is fixedly connected to the inside of the observation window, and a handle is arranged on one side of the front side outer surface of the door plate.

[0011] As a preferred scheme of the polishing quartz wafer shallow scratch detection device, the rotating assembly comprises a fixed seat, the lower surface of the fixed seat is slidably connected to the upper surface of the electric guide rail, the inside of the fixed seat is fixedly connected with a driving motor, the output end of the driving motor is fixedly connected with a gear, the outer surface of the gear is meshingly connected with a gear ring, the outer surface of the gear ring is fixedly connected with a rotating table, and the outer surface of the rotating table is rotatably connected to the inside of the fixed seat.

[0012] As a preferred scheme of the polishing quartz wafer shallow scratch detection device, the lower surface of the fixed plate is fixedly connected to the upper surface of the rotating table, the inside of the clamping plate is fixedly connected with a buffer pad, the rear side outer surface of the clamping plate is fixedly connected with a slide rod on both sides, and the outer surface of the slide rod is slidably connected to the inside of the fixed plate.

[0013] As a preferred scheme of the polishing quartz wafer shallow scratch detection device, the moving assembly comprises a fixed frame, one side of the fixed frame is fixedly connected to the outer surface of the box, the inner wall upper portion of the fixed frame is fixedly connected with a mounting frame, the inside of the mounting frame is fixedly connected with a hydraulic cylinder, and the output end of the hydraulic cylinder is fixedly connected with a universal wheel.

[0014] The polishing quartz wafer shallow scratch detection device has the advantages that the electric guide rail can control the wafer to move left and right, the electric telescopic rod can control the wafer to move forward and backward, the rotating assembly can change the position of the wafer, the time for changing the position is reduced, the detection efficiency is improved, and the damage to the wafer is reduced.

[0015] The electric guide rail can control the wafer to move left and right, the electric telescopic rod can control the wafer to move forward and backward, the rotating assembly can change the position of the wafer, the time for changing the position is reduced, the detection efficiency is improved, and the damage to the wafer is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed in the embodiment description. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained from these drawings without creative labor. Among them:

[0017] Figure 1 A perspective view of a polishing quartz wafer shallow scratch detection device is provided in the present application;

[0018] Figure 2 For Figure 1 The internal schematic diagram is shown in the figure.

[0019] Figure 3 For Figure 1 The rotating assembly schematic diagram is shown in the figure.

[0020] Figure 4 For Figure 1 The clamping plate schematic diagram is shown in the figure.

[0021] In the figure: 100, detection unit; 101, box body; 102, detection table; 103, electric guide rail; 104, rotating assembly; 104a, fixed seat; 104b, driving motor; 104c, gear; 104d, gear ring; 104e, rotating table; 105, fixed plate; 106, electric telescopic rod; 107, clamping plate; 108, buffer pad; 109, sliding rod; 110, mounting plate; 111, lifter; 112, detection head; 113, moving assembly; 113a, fixed frame; 113b, mounting frame; 113c, hydraulic cylinder; 113d, universal wheel; 114, door plate; 115, observation window. DETAILED DESCRIPTION

[0022] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific embodiments of the present application will be described in detail below with reference to the drawings of the specification.

[0023] In the following description, many specific details are set forth in order to provide a thorough understanding of the present application, but the present application can also be implemented in other ways different from those described herein, and those skilled in the art can make similar generalizations without departing from the connotation of the present application, therefore the present application is not limited by the specific embodiments disclosed below.

[0024] Secondly, the "one embodiment" or "embodiment" referred to herein means that the specific features, structures or characteristics can be included in at least one implementation of the present application. In this specification, "in one embodiment" does not mean the same embodiment, nor is it an independent or alternative embodiment that excludes other embodiments.

[0025] Thirdly, the utility model in combination with the schematic diagram is described in detail, in detail the utility model embodiment, for easy to illustrate, the section view of device structure will not be enlarged locally according to general proportion, and the schematic diagram is only example, it should not limit the range of the utility model protection here. In addition, three-dimensional spatial dimensions of length, width and depth should be contained in actual manufacture.

[0026] Referring to Figures 1-4 The utility model provides a kind of polished quartz wafer shallow scratch detection device, comprising:

[0027] Detection unit 100, including box 101, the inner bottom wall of box 101 is fixedly connected with detection table 102, the upper surface both sides of detection table 102 are fixedly connected with electric guide rail 103, the upper surface of electric guide rail 103 is provided with rotating assembly 104, the upper surface of rotating assembly 104 is provided with fixed plate 105, the inside of fixed plate 105 is fixedly connected with electric telescopic rod 106, the output end of electric telescopic rod 106 is fixedly connected with clamping plate 107, the inner wall upper portion of box 101 is provided with detection head 112, the both sides outer surfaces of box 101 are provided with moving assembly 113.Detection unit 100 in box 101 is the main body structure of device, the detection head 112 of inner wall upper portion is responsible for scanning and scratch detection to wafer surface, electric guide rail 103 and rotating assembly 104 are common to detection table 102, so that quartz wafer can keep stable and carry out accurate positioning during detection process, the movement of electric guide rail 103 and the rotation of rotating assembly 104, so that clamping plate 107 can be gradually scanned on quartz wafer surface, whether there is shallow scratch on surface is automatically detected, the position of clamping plate 107 is adjusted by electric telescopic rod 106, ensure that clamping plate 107 can firmly hold wafer, simultaneously avoid that wafer is deformed or damaged by clamping too tightly, clamping plate 107 is guaranteed that wafer is not interfered by external force during detection process, help to improve the accuracy of detection.

[0028] The inner wall upper portion of the box body 101 is fixedly connected with a mounting plate 110, the inside of the mounting plate 110 is fixedly connected with a lifter 111, and the outer surface of the detection head 112 is fixedly connected to the lower end of the lifter 111. The front outer surface of the box body 101 is rotatably connected with a door plate 114, the middle of the outer surface of the door plate 114 is provided with an observation window 115, the inside of the observation window 115 is fixedly connected with a transparent plate, and the front outer surface of the door plate 114 is provided with a handle on one side. The outer surface of the detection head 112 is fixedly connected to the lower end of the lifter 111, and through the up-down movement of the lifter 111, the detection head 112 can accurately align the surface of the wafer, ensure that the detection range covers the entire wafer working area, improve the precision and efficiency of the shallow scratch detection, and the setting of the observation window 115 enables the operator to observe the detection condition inside the device without opening the door plate 114. The design of the transparent plate not only ensures the clarity of observation, but also effectively isolates the external environment, avoids dust or pollutants from entering the inside of the box body 101, and ensures the cleanliness of the detection environment and the reliability of the detection result.

[0029] Further, the rotating assembly 104 includes a fixed seat 104a, the lower surface of the fixed seat 104a is slidably connected to the upper surface of the electric guide rail 103, the inside of the fixed seat 104a is fixedly connected with a driving motor 104b, the output end of the driving motor 104b is fixedly connected with a gear 104c, the outer surface of the gear 104c is meshingly connected with a gear ring 104d, the outer surface of the gear ring 104d is fixedly connected with a rotating table 104e, and the outer surface of the rotating table 104e is rotatably connected to the inside of the fixed seat 104a. The lower surface of the fixed plate 105 is fixedly connected to the upper surface of the rotating table 104e, the inside of the clamping plate 107 is fixedly connected with a buffer pad 108, the rear outer surface of the clamping plate 107 is fixedly connected with a slide rod 109 on both sides, and the outer surface of the slide rod 109 is slidably connected to the inside of the fixed plate 105. The fixed seat 104a is slidably connected to the upper surface of the electric guide rail 103, and the fixed seat 104a is driven to move in the horizontal direction by the electric guide rail 103, so as to realize the horizontal position adjustment of the workpiece. The driving motor 104b fixedly connected in the fixed seat 104a drives the gear ring 104d to rotate through the gear 104c at the output end, the gear ring 104d is fixedly connected with the rotating table 104e, the movement of the driving motor 104b is finally transmitted to the rotating table 104e, so as to drive the workpiece to rotate or realize accurate angle adjustment, and the buffer pad 108 installed in the clamping plate 107 can effectively protect the surface of the workpiece and prevent scratches or damage during clamping.

[0030] Further, the moving assembly 113 comprises a fixed frame 113a, one side of the fixed frame 113a is fixedly connected to the outer surface of the box body 101, a mounting frame 113b is fixedly connected to the inner wall upper portion of the fixed frame 113a, a hydraulic cylinder 113c is fixedly connected to the inside of the mounting frame 113b, and a universal wheel 113d is fixedly connected to the output end of the hydraulic cylinder 113c. The extension and contraction of the universal wheel 113d are controlled through the hydraulic cylinder 113c, so that the device can be conveniently carried, the universal wheel 113d is pushed out when it is necessary to move, and then the device can be lifted, the device is placed down when it is used, and the flexibility of the device can be improved.

[0031] In use, the workpiece is placed on the rotating table 104e, the electric telescopic rod 106 is started to push the clamping plate 107 to fix the wafer, the buffer pad 108 is installed in the clamping plate 107, the surface of the workpiece can be effectively protected, and scratches or damage in the clamping process can be prevented, the position of the detection head 112 is adjusted by starting the lifter 111, the fixed seat 104a is driven to move in the horizontal direction through the electric guide rail 103, so that the horizontal position adjustment of the workpiece is realized, the gear 104c at the output end of the driving motor 104b drives the gear ring 104d to rotate, the gear ring 104d drives the rotating table 104e to rotate, rotation or accurate angle adjustment is realized, the detection accuracy is improved, and the use convenience is improved.

[0032] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present application and are not limited. Although the present application has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solutions of the present application can be modified or replaced equivalently without departing from the spirit and scope of the technical solutions of the present application, and all should be covered in the scope of the claims of the present application.

Claims

1. A device for detecting shallow scratches on polished quartz wafers, characterized in that: Include: Detection unit (100), including box (101), the inner bottom wall of the box (101) is fixedly connected with detection table (102), the upper surface of the detection table (102) is fixedly connected with electric guide rail (103), the upper surface of the electric guide rail (103) is provided with rotating assembly (104), the upper surface of the rotating assembly (104) is provided with fixed plate (105), the inside of the fixed plate (105) is fixedly connected with electric telescopic rod (106), the output end of the electric telescopic rod (106) is fixedly connected with clamping plate (107), the inner wall upper portion of the box (101) is provided with detection head (112), and the outer surface of the both sides of the box (101) is provided with moving assembly (113).

2. A shallow scratch detection apparatus for polished quartz wafers as defined in claim 1, wherein: The inner wall upper portion of the box (101) is fixedly connected with the mounting plate (110), the inside of the mounting plate (110) is fixedly connected with the lifter (111), and the outer surface of the detection head (112) is fixedly connected to the lower end of the lifter (111).

3. The apparatus for detecting shallow scratches on a polished quartz wafer as defined in claim 1, wherein: The front outer surface of the box (101) is rotatably connected with door plate (114), the outer surface of the door plate (114) is provided with observation window (115), the inside of the observation window (115) is fixedly connected with transparent plate, and the front outer surface of the door plate (114) is provided with handle.

4. The apparatus for detecting shallow scratches on a polished quartz wafer as defined in claim 1, wherein: The rotating assembly (104) includes a fixed seat (104a), the lower surface of the fixed seat (104a) is slidably connected to the upper surface of the electric guide rail (103), the inside of the fixed seat (104a) is fixedly connected with a drive motor (104b), the output end of the drive motor (104b) is fixedly connected with a gear (104c), the outer surface of the gear (104c) is meshingly connected with a gear ring (104d), the outer surface of the gear ring (104d) is fixedly connected with a rotating table (104e), and the outer surface of the rotating table (104e) is rotatably connected to the inside of the fixed seat (104a).

5. The apparatus for detecting shallow scratches on a polished quartz wafer as defined in claim 1, wherein: The lower surface of the fixed plate (105) is fixedly connected to the upper surface of the rotating table (104e), the inside of the clamping plate (107) is fixedly connected with a buffer pad (108), the rear outer surface of the clamping plate (107) is fixedly connected with a slide rod (109) on both sides, and the outer surface of the slide rod (109) is slidably connected to the inside of the fixed plate (105).

6. The apparatus for detecting shallow scratches on a polished quartz wafer of claim 1 wherein: The moving assembly (113) includes a fixed frame (113a), one side of the fixed frame (113a) is fixedly connected to the outer surface of the box (101), the inner wall upper portion of the fixed frame (113a) is fixedly connected with mounting frame (113b), the inside of the mounting frame (113b) is fixedly connected with hydraulic cylinder (113c), and the output end of the hydraulic cylinder (113c) is fixedly connected with universal wheel (113d).

Images