Test board and test device

Abstract

The utility model discloses a test board and a test device, and relates to the technical field of chip testing. The test board comprises a test board body, a wafer placement position, a plurality of golden fingers and a plurality of test bonding pads, the wafer placement position, the plurality of golden fingers and the plurality of test bonding pads are all arranged on the test board body, and the golden fingers are located between the test bonding pads and the wafer placement position; wherein the wafer is provided with a plurality of connecting bonding pads, each connecting bonding pad is correspondingly connected with one golden finger, and each golden finger is correspondingly connected with one test bonding pad; through the above design, the signal integrity is ensured, and the cost is reduced.

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