Epoxy AB glue production raw material mixing device

Abstract

The utility model discloses an epoxy AB glue production raw material mixing device which comprises a mixing barrel, a placing mechanism is arranged above the mixing barrel, an auxiliary mechanism is arranged on the placing mechanism and the mixing barrel, a cleaning mechanism is installed on the auxiliary mechanism, and a constant temperature mechanism is arranged on the surface of the mixing barrel. Each corner in the mixing cylinder can be thoroughly cleaned, the influence of residual raw materials on subsequent production is avoided, meanwhile, the constant temperature mechanism arranged in the mixing cylinder can ensure that the epoxy AB glue is always kept in the optimal temperature range in the mixing process, so that the performance of the epoxy AB glue is ensured, and the placing mechanism arranged in the mixing cylinder is used for placing the epoxy AB glue. The two raw materials can be accurately and separately stored before being mixed, performance reduction caused by mixing in advance is avoided, meanwhile, an auxiliary mechanism is arranged between the placing mechanism and the mixing cylinder, complete mixing of the raw materials is ensured, and the mixing efficiency and the product quality of epoxy AB glue are improved.

Description

Technical Field

[0001] This utility model relates to the field of mixing technology, and more specifically, to a mixing device for raw materials in the production of epoxy AB adhesive. Background Technology

[0002] Epoxy AB adhesive is a two-component adhesive, typically consisting of component A (such as epoxy resin) and component B (such as curing agent). When producing this adhesive, it is crucial to ensure that components A and B are precisely mixed in the correct proportions. Therefore, in industrial production, the use of specially designed raw material mixing equipment can improve efficiency and product quality.

[0003] However, existing epoxy AB adhesive production raw material mixing devices have some shortcomings in actual use. First, the cleaning process after mixing is not thorough enough, which makes the residual raw materials affect subsequent production. In addition, the epoxy AB adhesive raw materials are easily affected by the external weather temperature during the mixing process, which makes the temperature control not precise enough and affects the performance of epoxy AB adhesive. Utility Model Content

[0004] In view of the problems in the related technologies, this utility model proposes a mixing device for raw materials in the production of epoxy AB glue, so as to overcome the above-mentioned technical problems existing in the existing related technologies.

[0005] Therefore, the specific technical solution adopted by this utility model is as follows:

[0006] An epoxy AB adhesive production raw material mixing device includes a mixing cylinder, a placement mechanism above the mixing cylinder, an auxiliary mechanism on the placement mechanism and the mixing cylinder, and a cleaning mechanism installed on the auxiliary mechanism. The cleaning mechanism includes a cleaning pipe connected to one end of the auxiliary mechanism via a rotary joint, a delivery pump connected to one end of the cleaning pipe, an input pipe connected to one end of the delivery pump, a filter box connected to one end of the input pipe, an inlet pipe connected to one side of the filter box, and a control valve installed at the other end of the inlet pipe and the input pipe. Several spray heads are provided on the surface of the auxiliary mechanism, and a temperature control mechanism is provided on the surface of the mixing cylinder.

[0007] Furthermore, in order to better place the epoxy AB adhesive raw materials separately, the placement mechanism includes a fixed frame fixedly connected above the mixing cylinder, placement cylinders fixed on both sides of the fixed frame, a metering pump passing through the bottom of the placement cylinder, an output pipe connected to one end of the metering pump, and an output pipe connected to the top of the mixing cylinder.

[0008] Furthermore, in order to better and more thoroughly mix the epoxy AB adhesive, the auxiliary mechanism includes a hollow motor mounted on a fixed frame. One end of the hollow motor passes through the mixing cylinder and is connected to a mixing rod. A cleaning pipe is installed at the end of the hollow motor away from the mixing rod via a rotary joint. The surface of the mixing rod is provided with multiple stirring rods. A spray head is installed on the surface of the stirring rods. One end of the multiple stirring rods is fixed with a scraper, and one side of the scraper contacts the inner wall of the mixing cylinder.

[0009] Furthermore, in order to better ensure that the epoxy AB glue is kept at a constant temperature during mixing, the temperature control mechanism includes a heat insulation cover set on the surface of the mixing cylinder. Multiple semiconductor cooling chips are penetrated through the surface of the heat insulation cover. The cold ends of the multiple semiconductor cooling chips are located inside the heat insulation cover, and the hot ends of the semiconductor cooling chips are located outside the heat insulation cover. Heating wires are wound inside the heat insulation cover and on the surface of the mixing cylinder. The heating wires and semiconductor cooling chips are electrically connected to a controller, which is installed on the outer wall of the heat insulation cover.

[0010] Furthermore, in order to better monitor the mixing temperature of epoxy AB glue, the controller is electrically connected to multiple temperature sensors, which are respectively installed on the inner wall of the mixing drum and the outer wall of the insulation cover.

[0011] Furthermore, in order to better filter impurities in the cleaning solution, a filter screen and an activated carbon screen are installed on one side of the inner wall of the filter box. One end of the filter screen and the activated carbon screen is fixed to a limiting plate through the filter box, and the lower part of the limiting plate is in contact with the upper part of the filter box.

[0012] Furthermore, in order to better place the epoxy AB adhesive raw materials, a placement opening is provided at the top of the placement cylinder, and a sealing cap is hinged to the inner wall of the placement opening.

[0013] Furthermore, to further improve the sealing performance of the sealing cap, there are multiple latches on one side of the sealing cap, and one side of the latches is fixedly connected to one side of the placement cylinder.

[0014] Furthermore, a second control valve runs through the bottom of the mixing cylinder, and one end of the second control valve is connected to a delivery pipe.

[0015] Furthermore, multiple support columns are fixed below the mixing cylinder, and support bases are fixed below the multiple support columns.

[0016] The beneficial effects of this utility model are:

[0017] (1) By setting up a cleaning mechanism in the auxiliary mechanism, it is ensured that every corner inside the mixing drum can be thoroughly cleaned, avoiding the impact of residual raw materials on subsequent production. At the same time, the constant temperature mechanism set up in the mixing drum can ensure that the epoxy AB glue is always kept within the optimal temperature range during the mixing process, thereby ensuring the performance of the epoxy AB glue.

[0018] (2) The placement mechanism set in the mixing cylinder ensures that the two raw materials can be accurately stored separately before mixing, avoiding the performance degradation caused by premature mixing. At the same time, the auxiliary mechanism set in the placement mechanism and the mixing cylinder ensures complete mixing of the raw materials, improving the mixing efficiency of epoxy AB glue and product quality. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the main body and controller structure of an epoxy AB adhesive production raw material mixing device according to an embodiment of the present utility model;

[0021] Figure 2 This is a side view of a raw material mixing device for epoxy AB adhesive production according to an embodiment of the present utility model;

[0022] Figure 3 This is a schematic diagram of the placement mechanism of a raw material mixing device for epoxy AB adhesive production according to an embodiment of the present utility model;

[0023] Figure 4 This is a partial schematic diagram of the auxiliary structure and constant temperature mechanism of an epoxy AB adhesive production raw material mixing device according to an embodiment of the present utility model;

[0024] Figure 5 This is a schematic diagram of the cleaning mechanism of a raw material mixing device for epoxy AB adhesive production according to an embodiment of the present invention.

[0025] Figure label:

[0026] 1. Mixing cylinder; 2. Placement mechanism; 201. Fixing frame; 202. Placement cylinder; 203. Metering pump; 204. Output pipe; 3. Auxiliary mechanism; 301. Hollow motor; 302. Mixing rod; 303. Stirring rod; 304. Scraper; 4. Cleaning mechanism; 401. Cleaning pipe; 402. Transfer pump; 403. Input pipe; 404. Filter box; 405. Liquid inlet pipe; 406. Control valve one; 407. Spray head; 5. Thermostatic mechanism; 501. Insulation cover; 502. Semiconductor cooling chip; 503. Heating wire; 504. Controller; 6. Temperature sensor; 7. Filter screen; 8. Activated carbon screen; 9. Limiting plate; 10. Sealing cover; 11. Lock; 12. Control valve two; 13. Transfer pipe; 14. Support column; 15. Support base. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] Example 1:

[0029] Please see Figures 1-5 An epoxy AB adhesive production raw material mixing device includes a mixing cylinder 1, a container for mixing epoxy AB adhesive raw materials. The inner wall of the mixing cylinder 1 is equipped with an ultrasonic defoamer (not shown in the figure) during actual use. The ultrasonic defoamer is existing technology and will not be described in detail. It is used to remove bubbles generated during the mixing of epoxy AB adhesive raw materials, which is beneficial to improving the quality of epoxy AB adhesive. A control valve 2 12 passes through the bottom of the mixing cylinder 1. One end of the control valve 2 12 is connected to a conveying pipe 13. Multiple support columns 14 are fixed at the bottom of the mixing cylinder 1. There are three support columns 14. Support seats 15 are fixed at the bottom of the multiple support columns 14.

[0030] A placement mechanism 2 is provided above the mixing cylinder 1. The placement mechanism 2 includes a fixed frame 201 fixedly connected above the mixing cylinder 1. Placement cylinders 202 are fixed on both sides of the fixed frame 201. A placement opening is provided above the placement cylinder 202. A sealing cover 10 is hinged to the inner wall of the placement opening. There are multiple latches 11 on one side of the sealing cover 10. There are two latches 11. One side of the latches 11 is fixedly connected to one side of the placement cylinder 202. A metering pump 203 passes through the bottom of the placement cylinder 202. One end of the metering pump 203 is connected to an output pipe 204. One end of the output pipe 204 is connected through the top of the mixing cylinder 1.

[0031] An auxiliary mechanism 3 is provided on the placement mechanism 2 and the mixing cylinder 1. The auxiliary mechanism 3 includes a hollow motor 301 mounted on a fixing frame 201. One end of the hollow motor 301 passes through the mixing cylinder 1 and is connected to a mixing rod 302. The surface of the mixing rod 302 is provided with multiple stirring rods 303. The stirring rods 303 and the mixing rod 302 are hollow structures and are internally connected. There are twelve stirring rods 303, which are used to mix epoxy AB glue raw materials. One end of each stirring rod 303 is fixed with a scraper 304. One side of the scraper 304 is in contact with the inner wall of the mixing cylinder 1.

[0032] Example 2:

[0033] Please see Figures 1-5An epoxy AB adhesive production raw material mixing device includes a cleaning mechanism 4 installed on an auxiliary mechanism 3. The cleaning mechanism 4 includes a cleaning pipe 401 connected to the auxiliary mechanism 3 at one end via a rotary joint. One end of the cleaning pipe 401 is mounted on the end of a hollow motor 301 away from the mixing rod 302 via the rotary joint. A delivery pump 402 is connected to one end of the cleaning pipe 401, and an input pipe 403 is connected to one end of the delivery pump 402. A filter box 404 is connected to one end of the input pipe 403. A filter screen 7 and an activated carbon filter are installed on one side of the inner wall of the filter box 404. One end of the activated carbon mesh plate 8 and filter mesh plate 7 passes through the filter box 404 and is fixed with a limiting plate 9. The lower part of the limiting plate 9 contacts the upper part of the filter box 404. One side of the filter box 404 is connected to an inlet pipe 405. The other end of the inlet pipe 405 and the input pipe 403 is equipped with a control valve 406. One end of the control valve 406 is connected to a cleaning solvent container and a cleaning liquid container (not shown in the figure) during actual use. Several spray heads 407 are provided on the surface of the auxiliary mechanism 3. The spray heads 407 are installed on the surface of the stirring rod 303.

[0034] A temperature control mechanism 5 is provided on the surface of the mixing cylinder 1. The temperature control mechanism 5 includes a heat insulation cover 501 disposed on the surface of the mixing cylinder 1. The heat insulation cover 501 is made of heat insulation material, which is existing technology and will not be described in detail. Multiple semiconductor cooling chips 502 penetrate the surface of the heat insulation cover 501. The number of semiconductor cooling chips 502 is six, but can also be other numbers, depending on the actual situation. The cold ends of the multiple semiconductor cooling chips 502 are located inside the heat insulation cover 501, and the hot ends of the semiconductor cooling chips 502 are located outside the heat insulation cover 501. Heating wire 503 is wound inside and on the surface of mixing cylinder 1. Heating wire 503 is electrically connected to semiconductor cooling chip 502 and controller 504 is used to control electrical components. Controller 504 is preset with temperature (high temperature and low temperature value) during actual use. The specific temperature value is adjusted and set according to the actual situation. Controller 504 is installed on the outer wall of insulation cover 501. Controller 504 is electrically connected to multiple temperature sensors 6. There are two temperature sensors 6. Temperature sensors 6 are installed on the inner wall of mixing cylinder 1 and the outer wall of insulation cover 501, respectively.

[0035] The controller 504 is electrically connected to control valve 1 406, delivery pump 402, hollow motor 301, metering pump 203, and control valve 2 12. The controller 504 is also electrically connected to heating wire 503, semiconductor cooling chip 502, control valve 1 406, delivery pump 402, hollow motor 301, metering pump 203, and control valve 2 12, and is powered by an external power source (not shown in the figure).

[0036] In summary, with the help of the above-mentioned technical solution of this utility model, the working principle of the epoxy AB glue production raw material mixing device is as follows: During processing, component A, such as epoxy resin, and component B, such as curing agent, are first placed into the placement cylinder 202 respectively. The placement opening above the placement cylinder 202 is sealed by the sealing cap 10, which is fixed by the locking buckle 11 to ensure that the raw materials do not leak during the addition process. Then, the metering pump 203 is installed below the placement cylinder 202, and the raw materials are transported to the mixing cylinder 1 through the output pipe 204. The metering pump 203 can accurately control the amount of raw materials delivered to ensure that component A and component B are mixed in the correct ratio. Then, after the hollow motor 301 is started, it drives the mixing rod 302 to rotate, and the stirring rod 303 rotates accordingly to fully stir the raw materials in the mixing cylinder 1. The scraper 304 rotates... During the mixing process, the raw materials adhering to the inner wall of the mixing drum 1 are scraped off to ensure uniform mixing. During mixing, the controller 504 electrically connects the heating wire 503 and the semiconductor cooling chip 502. Temperature sensor 6 monitors the temperature inside the mixing drum 1 and outside the insulation cover 501. When the temperature is lower than the set value, the controller 504 activates the heating wire 503 to heat; when the temperature is higher than the set value, the controller 504 activates the semiconductor cooling chip 502 to cool, ensuring the raw materials inside the mixing drum 1 remain at a constant temperature. After mixing is complete, control valve 12 is opened, and the mixed epoxy AB adhesive is discharged through the delivery pipe 13. When cleaning is required after mixing, the cleaning solution is delivered by the delivery pump 402 through the input pipe 403 to the cleaning pipe 401. The cleaning solution is sprayed into the mixing drum 1 through the spray head 407 to clean it. The cleaning solution is filtered through the filter box 404 and then recycled.

[0037] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A mixing device for raw materials in the production of epoxy AB adhesive, characterized in that, The system includes a mixing cylinder (1), a placement mechanism (2) above the mixing cylinder (1), an auxiliary mechanism (3) on the placement mechanism (2) and the mixing cylinder (1), a cleaning mechanism (4) on the auxiliary mechanism (3), and a cleaning pipe (401) connected to one end of the auxiliary mechanism (3) via a rotary joint. One end of the cleaning pipe (401) is connected to a delivery pump (402), one end of the delivery pump (402) is connected to an input pipe (403), one end of the input pipe (403) is connected to a filter box (404), one side of the filter box (404) is connected to an inlet pipe (405), and the other end of the inlet pipe (405) and the input pipe (403) is equipped with a control valve (406). The surface of the auxiliary mechanism (3) is provided with several spray heads (407), and the surface of the mixing cylinder (1) is provided with a constant temperature mechanism (5).

2. The epoxy AB adhesive production raw material mixing device according to claim 1, characterized in that, The placement mechanism (2) includes a fixed frame (201) fixedly connected above the mixing cylinder (1), placement cylinders (202) fixed on both sides of the fixed frame (201), a metering pump (203) passing through the bottom of the placement cylinder (202), an output pipe (204) connected to one end of the metering pump (203), and one end of the output pipe (204) passing through the top of the mixing cylinder (1).

3. The epoxy AB adhesive production raw material mixing device according to claim 2, characterized in that, The auxiliary mechanism (3) includes a hollow motor (301) mounted on a fixed frame (201). One end of the hollow motor (301) passes through the mixing cylinder (1) and is connected to a mixing rod (302). The cleaning pipe (401) is installed at the end of the hollow motor (301) away from the mixing rod (302) via a rotary joint. The surface of the mixing rod (302) is provided with multiple stirring rods (303). The spray head (407) is installed on the surface of the stirring rods (303). One end of the multiple stirring rods (303) is fixed with a scraper (304). One side of the scraper (304) is in contact with the inner wall of the mixing cylinder (1).

4. The epoxy AB adhesive production raw material mixing device according to claim 3, characterized in that, The constant temperature mechanism (5) includes a heat insulation cover (501) disposed on the surface of the mixing cylinder (1). Multiple semiconductor cooling chips (502) penetrate the surface of the heat insulation cover (501). The cold ends of the multiple semiconductor cooling chips (502) are located inside the heat insulation cover (501), and the hot ends of the semiconductor cooling chips (502) are located outside the heat insulation cover (501). Heating wires (503) are wound around the inside of the heat insulation cover (501) and the surface of the mixing cylinder (1). The heating wires (503) and the semiconductor cooling chips (502) are electrically connected to a controller (504). The controller (504) is installed on the outer wall of the heat insulation cover (501).

5. The epoxy AB adhesive production raw material mixing device according to claim 4, characterized in that, The controller (504) is electrically connected to a plurality of temperature sensors (6), which are respectively installed on the inner wall of the mixing drum (1) and the outer wall of the insulation cover (501).

6. The epoxy AB adhesive production raw material mixing device according to claim 5, characterized in that, A filter screen plate (7) and an activated carbon screen plate (8) are installed on one side of the inner wall of the filter box (404). One end of the filter screen plate (7) and the activated carbon screen plate (8) passes through the filter box (404) and is fixed with a limiting plate (9). The lower part of the limiting plate (9) is in contact with the upper part of the filter box (404).

7. The epoxy AB adhesive production raw material mixing device according to claim 6, characterized in that, The placement tube (202) has a placement opening at the top, and a sealing cap (10) is hinged to the inner wall of the placement opening.

8. The epoxy AB adhesive production raw material mixing device according to claim 7, characterized in that, The sealing cover (10) has multiple latches (11) on one side, and one side of the latches (11) is fixedly connected to one side of the placement tube (202).

9. The epoxy AB adhesive production raw material mixing device according to claim 8, characterized in that, A control valve (12) is inserted through the bottom of the mixing cylinder (1), and one end of the control valve (12) is connected to a conveying pipe (13).

10. The epoxy AB adhesive production raw material mixing device according to claim 9, characterized in that, A plurality of support columns (14) are fixed below the mixing cylinder (1), and a support base (15) is fixed below the plurality of support columns (14).

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