Pixel-level packaging structure and uncooled infrared detector

Abstract

The utility model discloses a pixel-level packaging structure and an uncooled infrared detector, and relates to the technical field of uncooled infrared detectors. The pixel-level packaging structure comprises a pixel structure and a packaging structure, and the pixel structure comprises a readout circuit substrate, a metal reflecting layer and a micro-bridge structure, wherein the metal reflecting layer and the micro-bridge structure are arranged on the readout circuit substrate. The bridge surface is suspended above the metal reflecting layer, the bridge pier is arranged on the side edge of the bridge surface and connected with the reading circuit substrate, and the bridge legs are connected with the bridge surface and the bridge pier. The packaging structure comprises an anti-reflection layer, the anti-reflection layer is arranged on the reading circuit substrate and covers the pixel structure in a sealing mode, the anti-reflection layer is provided with through exhaust holes located above the bridge pier, the packaging structure further comprises a sealing anti-reflection layer, and the sealing anti-reflection layer covers the exhaust holes and blocks the exhaust holes. According to the pixel-level packaging structure provided by the utility model, the pixel packaging structure and the packaging process of the uncooled infrared detector are simplified, and the packaging cost is reduced.

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