Wafer clamp

Abstract

The utility model discloses a wafer clamp which is used in the technical field of wafer processing. The device comprises a wafer clamp body, wherein the wafer clamp body is provided with a first accommodating groove for accommodating wafers in a horizontal state and a plurality of second accommodating grooves for accommodating wafers in a vertical state; the first containing groove is formed in the upper surface of the wafer clamp body, the first containing groove is matched with the front face or the back face of a wafer in shape, and when the first containing groove abuts against the wafer, a gap is reserved between the bottom face of at least part of the wafer and the inner bottom face of the first containing groove; the plurality of second accommodating grooves are formed in the inner bottom surface of the first accommodating groove, and the second accommodating grooves are matched with the circumferential side surface of the wafer in shape. According to the wafer clamp, the wafer can be placed horizontally and vertically, the working efficiency is effectively improved, the contact area of the wafer and the wafer clamp body is small, the situation of uneven scratching or corrosion is avoided, and the wafer yield is improved.

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