Flexible circuit board laminated structure with high-precision impedance control

Abstract

The utility model discloses a flexible circuit board laminated structure with high-precision impedance control, which comprises a first circuit board, a toughness reinforcing plate for increasing impedance and a second circuit board, and impedance structures are arranged at the top and the bottom of the toughness reinforcing plate; movable positioning assemblies are arranged at the positions, close to the side faces and staggered with the impedance structures, of the top and the bottom of the toughness reinforcing plate. According to the utility model, through the arrangement of the impedance structure, when the first circuit board and the second circuit board are bent by impedance force, the toughness reinforcing plate is driven to bend, after the toughness reinforcing plate is bent, the impedance structure is driven to bend, and after the impedance structure is bent, the impedance force is buffered through the rubber connecting strip, so that the purpose of releasing force is achieved; the problem that in the prior art, the resistance strength is improved through a fixing plate in the arrangement that a multi-layer flexible circuit board is stacked on a multi-layer structure, but the fixing plate is too hard, cannot release force and can be directly bent or even broken when the pressure is too large is solved.

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