Distributed IO module

Abstract

The utility model relates to a distributed IO module. The distributed IO module comprises an interface board, a control board and a power board which are connected in sequence, the interface board is provided with an IO input terminal and a first IO output terminal. The IO input terminal is used for receiving external signal input; the first IO output terminal is used for outputting a first voltage signal outwards; the power board is provided with a first isolation element, a first transistor and a first connecting piece, the first isolation element is used for providing electrical isolation for the first IO output terminal, the first transistor has a first rated current, the first rated current is greater than a rated current threshold value, and the first connecting piece is connected with the first isolation element. The first connecting piece is connected with the first IO output terminal and is used for controlling the first IO output terminal to output the first voltage signal; and the control board is used for controlling the signal input of the IO input terminal and the signal output of the first IO output terminal. The distributed IO module is suitable for use requirements of large current and high frequency.

Description

Technical Field

[0001] This application relates to the field of industrial automation and control technology, and specifically to a distributed I / O module. Background Technology

[0002] Distributed I / O modules are devices used in industrial automation control systems. Existing distributed I / O modules have at least the following technical problems: on the one hand, they cannot meet the requirements of high current and high frequency operation; on the other hand, they are also large in size and have limited installation methods. Utility Model Content

[0003] To address the limitations of existing distributed I / O modules in meeting the demands of high-current and high-frequency applications, as well as their large size and limited installation methods, this application provides a distributed I / O module comprising an interface board, a control board, and a power board connected in sequence. The interface board is provided with I / O input terminals and a first I / O output terminal. The I / O input terminals are used to receive external signal inputs. The first I / O output terminal is used to output a first voltage signal. The power board is provided with a first isolation element, a first transistor, and a first connector. The first isolation element provides electrical isolation to the first I / O output terminal. The first transistor has a first rated current greater than a rated current threshold. The first connector is connected to the first I / O output terminal to control the first I / O output terminal to output the first voltage signal. The control board controls the signal inputs of the I / O input terminals and the signal outputs of the first I / O output terminals.

[0004] In one embodiment of this application, the first isolation element is a first optocoupler, and the response speed of the first optocoupler is greater than a preset response speed.

[0005] In one embodiment of this application, the interface board is further provided with a second IO output terminal, which is used to output a second voltage signal; the power board is further provided with a second transistor and a second connector, the second transistor has a second rated current, which is less than the first rated current, and the second connector is electrically connected to the second IO output terminal to control the second IO output terminal to output the second voltage signal.

[0006] In one embodiment of this application, a second isolation element is provided on the interface board, the second isolation element being used to provide electrical isolation for the second IO output terminal.

[0007] In one embodiment of this application, the second isolation element is a second optocoupler, and the response speed of the second optocoupler is less than that of the first optocoupler.

[0008] In one embodiment of this application, the first voltage signal is used to transmit to a light source device, the light source device having an operating current and an operating frequency, the operating current being greater than an operating current threshold and the operating frequency being greater than an operating frequency threshold.

[0009] In one embodiment of this application, the operating current threshold is greater than or equal to 2A.

[0010] In one embodiment of this application, the operating frequency threshold is greater than or equal to 100kHz.

[0011] In one embodiment of this application, the interface board is further provided with a network input terminal and a network output terminal.

[0012] In one embodiment of this application, the IO input terminals include: analog input terminals and digital input terminals.

[0013] This application enables the distributed I / O module to meet the requirements of high current and high frequency signals by setting a first connector on the power board to directly connect the first connector to the first I / O output terminal; by setting a first transistor with a large first rated current to make the first voltage signal suitable for external devices with high current requirements; and by setting a first isolation element to make the first voltage signal suitable for external devices with high frequency requirements. Attached Figure Description

[0014] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, the specific embodiments of this application will be described in detail below with reference to the accompanying drawings, wherein:

[0015] Figure 1 This is an exploded view of a distributed I / O module according to an embodiment of this application;

[0016] Figure 2 yes Figure 1 The main view of the distributed I / O module in the illustrated embodiment;

[0017] Figure 3 yes Figure 1 The right view of the distributed I / O module in the illustrated embodiment;

[0018] Figure 4 A front view of a distributed I / O module according to another embodiment of this application is shown;

[0019] Figure 5 yes Figure 1 The rear view of the distributed I / O module in the illustrated embodiment; and

[0020] Figure 6 This is a rear view of a distributed I / O module according to another embodiment of this application;

[0021] Figure 7 A front view of a distributed I / O module 100 according to another embodiment of this application is shown. Detailed Implementation

[0022] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, the specific embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0023] Many specific details are set forth in the following description in order to provide a full understanding of this application. However, this application may also be implemented in other ways different from those described herein, and therefore this application is not limited to the specific embodiments disclosed below.

[0024] As indicated in this application and claims, unless the context clearly indicates otherwise, the words "a," "an," "an," and / or "the" are not specifically singular and may include plural forms. Generally speaking, the terms "comprising" and "including" only indicate the inclusion of explicitly identified steps and elements, which do not constitute an exclusive list, and the method or apparatus may also include other steps or elements.

[0025] In the description of this application, it should be understood that the orientation or positional relationship indicated by directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" is usually based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this application and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this application; the directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.

[0026] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, these terms have no special meaning and therefore should not be construed as limiting the scope of protection of this application. In addition, although the terminology used in this application is selected from commonly known and used terms, some terms mentioned in this application's specification may have been chosen by the applicant according to his or her judgment, and their detailed meanings are explained in the relevant sections of this description. Moreover, this application should be understood not only through the actual terms used, but also through the meaning implied by each term.

[0027] The embodiments of this application are described below based on the accompanying drawings. However, the embodiments shown below are examples of distributed I / O modules used to embody the technical concept of this application, and the distributed I / O module of this application is not specifically defined as follows. Furthermore, in order to facilitate understanding of the scope of the claims, the components corresponding to the components shown in the embodiments are assigned numbers to the components shown in the "Claims" and "Utility Model Content" columns. However, the components shown in the claims are not intended to be specific to the components of the embodiments. In particular, the dimensions, materials, shapes, and relative arrangements of the constituent components described in the embodiments are not intended to limit the scope of this application unless specifically stated, but are merely illustrative examples.

[0028] However, the dimensions or positional relationships of the components shown in the accompanying drawings are sometimes exaggerated for clarity. Therefore, in the following description, detailed descriptions of the same names and symbols representing the same or homogeneous components are appropriately omitted. Furthermore, the elements constituting this application may be multiple elements composed of the same components, thus allowing one component to function as multiple elements; conversely, multiple components may share the function of one component. Additionally, the content described in some embodiments and implementations can be applied to other embodiments and implementations. Furthermore, in this specification, "upper" is not limited to the case of being formed in contact with an upper surface, but also includes the case of being formed separately on top, and also includes the meaning of an intermediate layer between layers.

[0029] Distributed I / O modules are devices used in industrial automation control systems, characterized by their proximity to the host computer. However, existing distributed I / O modules still face several technical challenges. Firstly, they lack a dedicated structure for outputting high currents. Under high-current conditions, the heat dissipation and stability of existing distributed I / O modules face severe challenges, easily leading to overheating, performance degradation, or even damage. In high-frequency applications, signal integrity is difficult to guarantee, making them prone to interference and data transmission errors, affecting their reliability and accuracy. Secondly, distributed I / O modules suffer from large size and limited installation methods. This makes installation and layout difficult in space-constrained industrial settings, failing to meet users' installation needs across various spatial and usage scenarios.

[0030] Figure 1 An exploded view of a distributed I / O module 100 according to an embodiment of this application is shown. Figure 1As shown, the distributed I / O module 100 includes an interface board 110, a control board 120, and a power board 130 connected in sequence. The interface board 110 is provided with an I / O input terminal and a first I / O output terminal 112a. The I / O input terminal is used to receive external signal input. The first I / O output terminal 112a is used to output a first voltage signal. The power board 130 is provided with a first connector 131, which is connected to the first I / O output terminal 112a and is used to control the first I / O output terminal 112a to output the first voltage signal. The control board 120 is used to control the signal input of the I / O input terminal 111 and the signal output of the first I / O output terminal 112a.

[0031] like Figure 1 As shown, the power board 130 is also provided with a first isolation element 132 and a first transistor (not shown). The first isolation element 132 is used to provide electrical isolation for the first IO output terminal 112a. The first transistor has a first rated current, which is greater than the rated current threshold.

[0032] This application achieves control over the first voltage signal output from the first IO output terminal 112a by providing a first connector 131 on the power board 130, directly connecting the first connector 131 to the first IO output terminal 112a; by providing a first transistor with a large first rated current, the first voltage signal is made suitable for external devices with high current requirements; by providing a first isolation element 132, the first voltage signal is made suitable for external devices with high frequency requirements, thereby enabling the distributed IO module 100 of this application to meet the usage requirements of high current and high frequency signals. In some embodiments, the first voltage signal is used to output to an external device for controlling the external device. This external device is, for example, a light source device with high current and high frequency application requirements, such as an LED lamp.

[0033] Next, we will combine Figures 1-3 This section describes in detail the structure of the distributed I / O module 100 of this application. Specifically, Figure 2 yes Figure 1 The main view of the distributed I / O module in the illustrated embodiment; Figure 3 yes Figure 1 Right view of the distributed I / O module 100 in the illustrated embodiment.

[0034] like Figure 1 and Figure 3 As shown, the distributed I / O module 100 includes an interface board 110, a control board 120, and a power board 130 connected sequentially from top to bottom.

[0035] Among them, such as Figure 1 and Figure 2As shown, the interface board 110 includes I / O input terminals. In some embodiments, the I / O input terminals include: an analog input terminal 111a (AI, Analog Input) and a digital input terminal 111b (DI, Digital Input). The analog input terminal 111a is used to receive external analog signals, and the digital input terminal 111b is used to receive external digital signals.

[0036] In some embodiments, the positions of analog input terminals 111a and digital input terminals 111b can be set according to actual layout requirements, and this application does not impose any restrictions on this.

[0037] like Figure 1 and Figure 2 As shown, the interface board 110 also has a first IO output terminal 112a, which is used to output a first voltage signal to the outside.

[0038] In some embodiments, such as Figure 1 and Figure 2 As shown, the interface board 110 is also provided with a network input terminal 113a and a network output terminal 113b for connecting to the control device and transmitting data. Data from the control device is input through the network input terminal 113a, and the interface board 110 then outputs the data to the external device through the network output terminal 113b. In some embodiments, the control device is a host computer or other control terminal. In some embodiments, the control device is a PLC.

[0039] In some embodiments, such as Figure 1 As shown, network input terminal 113a and network output terminal 113b can be configured as large network ports.

[0040] Figure 4 A front view of a distributed I / O module 100 according to another embodiment of this application is shown. Figure 4 As shown, in some embodiments, the network input terminal 113c and the network output terminal 113d can be configured as small network ports to save space.

[0041] In some embodiments, a USB interface terminal 114 is provided on the network output terminal 113b side for data transmission.

[0042] In some embodiments, the interface board 110 also has a power terminal 115 for connecting an external power source to provide power to the distributed I / O module.

[0043] In some embodiments, the terminals described above in this application can be connected to external devices via cables.

[0044] In some embodiments, the terminals of this application are soldered or snapped onto the interface board.

[0045] By setting the aforementioned multiple terminals in the distributed I / O module 100, the distributed I / O module 100 can adapt to data transmission methods of various communication transmission protocols, thereby improving the layout flexibility of the distributed I / O module 100 and saving cables.

[0046] like Figure 1 As shown, in some embodiments, a control chip 121 is provided on the control board 120 for controlling the signal input of the IO input terminal 111 and the signal output of the first IO output terminal 112a. In some embodiments, the control chip 121 includes an MCU chip.

[0047] like Figure 1 As shown, the power board 130 is provided with a plurality of first connectors 131, each of which is needle-shaped, and the plurality of first connectors 131 are arranged in a row evenly along the F1 direction.

[0048] In some embodiments, the shape and position of the first connector 131 can be set according to actual practical needs.

[0049] like Figure 1 As shown, the interface board 110 is also provided with a plurality of through holes 116 for connecting to the first connector 131. When the distributed I / O module 100 is used, the first connector 131 is connected to the through holes 116 on the interface board 110, and there is also an electrical connection between the first connector 131 and the first I / O output terminal 112a. This allows the control board 120 to control the first I / O output terminal 112a to output a first voltage signal.

[0050] The first connector 131 of this application provides a current-carrying function for the first voltage signal output by the first IO output terminal 112a, so as to obtain a better high current effect.

[0051] When used in high-current, high-frequency applications, the first transistor and the first isolation element 132 have high heat dissipation requirements. Placing the first transistor and the first isolation element 132 on the power board 130, closer to the bottom heat sink 140, can improve heat dissipation.

[0052] In some embodiments, the first isolation element 132 includes a first optocoupler, the first optocoupler having a response speed greater than a preset response speed. Specifically, the first optocoupler can be a high-speed optocoupler, whose response time, referring to the time required from a change in the input signal to a stable output signal, is typically on the order of nanoseconds (ns), and can even reach the sub-nanosecond level. It is understood that the shorter the response time, the greater the response speed. By setting a first optocoupler with a large response speed, the distributed I / O module of this application can be applied to external devices with high operating frequencies, such as light source devices.

[0053] In some embodiments, the operating frequency of the light source device is greater than the operating frequency threshold.

[0054] In some embodiments, the operating frequency threshold is greater than or equal to 100 kHz.

[0055] By designing the first isolation element 132, the distributed I / O module 100 can allow the first voltage signal to be suitable for higher frequency application scenarios.

[0056] In some embodiments, the first transistor is a MOS transistor.

[0057] In some embodiments, the operating current of the light source device is greater than the operating current threshold.

[0058] In some embodiments, the operating current threshold is greater than or equal to 2A.

[0059] This application enables the distributed I / O module 100 to allow the first voltage signal to be suitable for high-current application scenarios by setting a first transistor with a large rated current.

[0060] By simultaneously setting the first isolation element 132 and the first transistor, a large current signal is allowed to pass through without damaging the circuit. This ensures the integrity of the high-frequency signal while outputting a high-frequency signal, reduces interference and data transmission errors, and improves the reliability and accuracy of the distributed I / O module 100.

[0061] In some embodiments, the distributed I / O module 100 of this application can also output a low-current, low-frequency signal.

[0062] like Figure 1 As shown, in some embodiments, the interface board 110 is further provided with a second IO output terminal 112b, which is used to output a second voltage signal; the power board 130 is further provided with a second transistor (not shown) and a second connector 133, which is connected to the second IO output terminal 112b to control the second IO output terminal 112b to output the second voltage signal. The second transistor has a second rated current, which is less than the first rated current.

[0063] In some embodiments, the second transistor is a MOS transistor.

[0064] like Figure 1 As shown, the second IO output terminal 112b and the first IO output terminal 112a share a single terminal. In some embodiments, the first IO output terminal 112a and the second IO output terminal 112b may also be configured as two independent terminals.

[0065] like Figure 1As shown, a second connector 133 is provided on the power board 130. The second connector 133 is close to the first connector 131, and multiple second connectors 133 are evenly arranged in a row along the F1 direction.

[0066] like Figure 1 As shown, the interface board 110 has multiple through holes 117, and the control board 120 has multiple through holes 122. When the distributed I / O module 100 is used, the second connector 133 is sequentially connected to the through holes 122 on the control board 120 and the through holes 117 on the interface board 110, thereby electrically connecting the interface board 110, the control board 120, and the power board 130 to each other, indirectly realizing the electrical connection between the second connector 133 and the second I / O output terminal 112b. Furthermore, the control board 120 can control the signal output of the second I / O output terminal 112b.

[0067] like Figure 1 As shown, in some embodiments, the interface board 110 is provided with a second isolation element 118, which is used to provide electrical isolation for the second IO output terminal 112b.

[0068] It is understandable that when the second IO output terminal 112b outputs a second voltage signal suitable for low current and low frequency, the second isolation element 118 does not have high heat dissipation requirements. Therefore, the second isolation element 118 can be placed on the interface board 110 instead of the power board 130. Furthermore, placing the second isolation element 118 on the interface board 110 also saves the layout area of ​​the power board 130. By designing the second isolation element 118, the reliability and accuracy of the low-current, low-frequency signal output by the distributed IO module 100 are improved.

[0069] In some embodiments, the second isolation element 118 is a second optocoupler, and the response speed of the second optocoupler is slower than that of the first optocoupler. Because it is suitable for low-frequency applications, the second optocoupler does not need to be a high-speed optocoupler, but rather an optocoupler with a normal response speed.

[0070] In some embodiments, such as Figure 1 As shown, the distributed I / O module 100 also includes a heat sink 140 disposed below the power board 130, and the heat sink 140 has a protruding platform 141. By providing the heat sink 140, this application can effectively reduce the temperature of the device, further ensuring the stable output of the first voltage signal and the second voltage signal.

[0071] Figure 3 It shows Figure 1 Right view of the distributed I / O module 100 in the illustrated embodiment.

[0072] like Figure 3As shown, the protruding platform 141 of the heat sink 140 contacts the power board 130 for heat dissipation of the power board, which improves the overall stability of the distributed I / O module and meets the heat dissipation requirements of high current scenarios.

[0073] like Figure 1 and Figure 3 As shown, the protruding platform 141 is generally rectangular and has a height h protruding from the upper surface of the heat sink 140. Figure 1 In the compact structure of the distributed I / O module 100 shown, the heat dissipation boss 141 is in contact with the lower surface of the power board 130, thereby effectively transferring heat from the power board 130 and the components above it to the heat dissipation plate 140, which is beneficial for further heat dissipation. Figure 1 and Figure 3 The illustration is merely an example and is not intended to limit the specific number, size, shape, or distribution of the protruding platforms 141. It is understood that the larger the contact area between the protruding platforms 141 and the lower surface of the power board 130, the better the heat dissipation effect. In some embodiments, to accommodate the structures of the upper surface of the heat sink 140 and the lower surface of the power board 130, the heat dissipation protrusions 141 may also be irregularly shaped to maximize the contact area with the lower surface of the power board 130.

[0074] To improve the availability of the distributed I / O module 100, this application also provides two methods for installing the distributed I / O module 100.

[0075] Figure 4 It shows Figure 1 The main view of the distributed I / O module 100 in the illustrated embodiment. Figure 5 It shows Figure 1 The rear view of the distributed I / O module 100 in the illustrated embodiment.

[0076] like Figure 2 , Figure 4 and Figure 5 As shown, the heat sink 140 also has a protrusion 142 along the width direction F2 of the interface board 110. The protrusion 142 protrudes from the interface board 110, the control board 120 and the power board 130. The protrusion 142 is provided with a mounting hole 143 for fixing the distributed IO module 100 to an external device.

[0077] Figures 1-5 In the embodiments shown, the distributed I / O module 100 is mounted upright, that is, from the F3 direction, screws are driven from top to bottom to install the distributed I / O module 100. In this assembly method, the heat sink 140 has a protrusion 142 to facilitate the installation of the distributed I / O module 100.

[0078] Figure 6A rear view of a distributed I / O module 100 according to another embodiment of this application is shown. Figure 7 A front view of a distributed I / O module 100 according to another embodiment of this application is shown. Figure 6 and Figure 7 As shown, when using the inverted mounting method, i.e., viewed from the F3 direction, screws are driven from bottom to top to install the distributed I / O module 100. The inverted heat sink 140 is connected to the power board 130 through holes 144. In this case, the heat sink 140 and the power board 130 can be mounted parallel to each other, i.e., the heat sink 140 does not have... Figure 2 and Figure 5 The protrusion 142 protrudes from the interface board 110 and the control board 120.

[0079] The distributed I / O module 100 of this application can be installed either upright or upside down according to the actual space scenario, which enriches the user's installation options in a variety of space scenarios, reduces installation costs to a certain extent, and improves the availability of the distributed I / O module.

[0080] In addition, such as Figure 1 and 3 As shown, the distributed I / O module 100 also has a cover plate 150 and a third connector 160. In this application, the third connector 160 is used to connect the cover plate 150, the interface board 110, the control board 120, the power board 130, and the heat sink 140 in sequence.

[0081] In some embodiments, the third connector 160 includes a bolt structure.

[0082] By setting the first connector 131, the second connector 133, the third connector 160, and the through holes 116 and 117, a compact connection is achieved between the cover plate 150, the interface board 110, the control board 120, the power board 130, and the heat sink 140.

[0083] like Figure 4 and Figure 5 As shown, in some embodiments, the length D1, width D2, and height D3 of the distributed I / O module of this application are approximately 75mm, 55mm, and 35mm, respectively. Compared to traditional distributed I / O modules, the distributed I / O module of this application can achieve a miniaturized design.

[0084] Next, combined Figure 1This application explains the usage method of the distributed I / O module 100. In some embodiments, the control device inputs an analog signal through the analog input terminal 111a, or a digital signal through the digital input terminal 111b, and transmits instructions to the control chip 121 of the control board 120 through the network input terminal 113a. The control chip 121 controls the power board 130 to transmit the output signal to the first I / O output terminal 112a through the first connector 131, or to the second I / O output terminal 112b through the second connector 133. Then, the first I / O output terminal 112a outputs a first voltage signal suitable for high current and high frequency, and the second I / O output terminal 112b outputs a second voltage signal suitable for low current and low frequency. The arrangement of the first transistor and the second transistor makes the distributed I / O module suitable for both high-current and low-current applications. The first isolation element 132 and the second isolation element 118 are suitable for high-frequency and low-frequency applications, respectively, and can ensure the stability of the output signal. Simultaneously, the heat from the power board 130 is dissipated through the heat sink 140, improving the stability of the output voltage signal of the distributed I / O module 100.

[0085] This application achieves control over the output of a first voltage signal from the first IO output terminal 112a by providing a first connector 131 on the power board 130, connecting the first connector 131 to the first IO output terminal 112a; by providing a first isolation element 132, the distributed IO module 100 is suitable for high-frequency applications; and by providing a first transistor, the distributed IO module 100 is suitable for high-current signal applications. The distributed IO module 100 of this application can be applied to high-current, high-frequency applications and has high reliability and accuracy. By providing a heat sink 140, with the heat sink protrusion 141 contacting the lower surface of the power board 130, this application further improves the heat dissipation and stability of the distributed IO module 100 in high-current, high-frequency applications. The distributed IO module 100 of this application can be installed using either upright or inverted mounting methods, improving its usability.

[0086] While the foregoing disclosure has discussed various examples of utility model embodiments that are currently considered useful, it should be understood that such details are for illustrative purposes only, and the appended claims are not limited to the disclosed embodiments. Rather, the claims are intended to cover all modifications and equivalent combinations that conform to the spirit and scope of the embodiments of this application. For example, although the system components described above can be implemented by hardware devices, they can also be implemented solely by software solutions, such as installing the described system on existing servers or mobile devices.

[0087] Similarly, it should be noted that, in order to simplify the description of the present application and thus aid in the understanding of one or more embodiments of the utility model, the foregoing description of the embodiments of the present application sometimes combines multiple features into a single embodiment, drawing, or description thereof. However, this disclosure method does not imply that the subject matter of the present application requires more features than those mentioned in the claims. In fact, the embodiments contain fewer features than all the features of the single embodiments disclosed above.

[0088] In some embodiments, numbers describing the quantity of components and attributes are used. It should be understood that such numbers used in the description of embodiments are modified in some examples with the terms "approximately," "approximately," or "generally." Unless otherwise stated, "approximately," "approximately," or "generally" indicates that the numbers are allowed to vary by ±20%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximate values, which may be changed depending on the characteristics required by individual embodiments. In some embodiments, numerical parameters should take into account specified significant digits and employ a general method of digit reservation. Although the numerical ranges and parameters used to confirm their breadth of scope in some embodiments of this application are approximate values, in specific embodiments, such values ​​are set as precisely as feasible.

[0089] Although this application has been described with reference to specific embodiments, those skilled in the art should recognize that the above embodiments are only used to illustrate this application, and various equivalent changes or substitutions can be made without departing from the spirit of this application. Therefore, any changes or modifications to the above embodiments within the essential spirit of this application will fall within the scope of the claims of this application.

Claims

1. A distributed IO module, characterized by, The interface plate, the control plate and the power plate are sequentially connected; the IO input terminal and the first IO output terminal are arranged on the interface plate; The IO input terminal is used for receiving external signal input; The first IO output terminal is used for outputting a first voltage signal to the outside; The power plate is provided with a first isolation element, a first transistor and a first connecting piece; the first isolation element is used for providing electrical isolation for the first IO output terminal; the first transistor has a first rated current, which is greater than a rated current threshold; the first connecting piece is connected with the first IO output terminal, and is used for controlling the first IO output terminal to output the first voltage signal; The control plate is used for controlling signal input of the IO input terminal and signal output of the first IO output terminal.

2. The distributed IO module of claim 1, wherein, The first isolation element is a first optocoupler, and a response speed of the first optocoupler is greater than a preset response speed.

3. The distributed IO module of claim 1, wherein, The interface plate is further provided with a second IO output terminal, which is used for outputting a second voltage signal to the outside; the power plate is further provided with a second transistor and a second connecting piece; the second transistor has a second rated current, which is less than the first rated current; the second connecting piece is electrically connected with the second IO output terminal, and is used for controlling the second IO output terminal to output the second voltage signal.

4. The distributed IO module of claim 3, wherein, The interface plate is provided with a second isolation element, which is used for providing electrical isolation for the second IO output terminal.

5. The distributed IO module of claim 4, wherein, The second isolation element is a second optocoupler, and a response speed of the second optocoupler is less than a response speed of the first optocoupler.

6. The distributed IO module of claim 1, wherein, The first voltage signal is used for transmission to a light source device; the light source device has a working current and a working frequency; the working current is greater than a working current threshold; and the working frequency is greater than a working frequency threshold.

7. The distributed IO module of claim 6, wherein, The working current threshold is greater than or equal to 2A.

8. The distributed IO module of claim 6, wherein, The working frequency threshold is greater than or equal to 100KHz.

9. The distributed IO module of claim 1, wherein, The interface plate is further provided with a network input terminal and a network output terminal.

10. The distributed IO module of claim 1, wherein, The IO input terminal comprises an analog input terminal and a digital input terminal.

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