Adsorption device and semiconductor equipment

By using a double-layer nested adsorption device design, the adsorption problem of warped substrates is solved, achieving stable adsorption and reducing adsorption marks, thereby improving the product yield in the semiconductor manufacturing process.

CN224084041UActive Publication Date: 2026-04-03SEMICON MFG ELECTRONICS (SHAOXING) CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-03-27
Publication Date
2026-04-03

AI Technical Summary

Technical Problem

Existing adsorption devices are difficult to adapt effectively to warped substrates, leading to adsorption failure and substrate damage. Furthermore, increasing the vacuum level can cause adsorption imprinting.

Method used

The device employs a double-layer nested adsorption design, with the first and second adsorption elements located at different heights. Stable adsorption of the warped substrate is achieved through a negative pressure environment, avoiding the need to increase the vacuum level and reducing human intervention.

Benefits of technology

This improved the applicability and stability of the adsorption device, reduced adsorption marks, lowered manufacturing costs, and increased product yield.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of semiconductor manufacturing, and provides an adsorption device and semiconductor equipment, which comprise a first adsorption piece and a second adsorption piece, the first adsorption part is provided with a first cavity, one end of the first adsorption part in the first direction is a first adsorption end, and the first cavity penetrates through the first adsorption end; the second adsorption part is provided with a second cavity, one end, in the first direction, of the second adsorption part is a second adsorption end, and the second cavity penetrates through the second adsorption end; the second adsorption part is located in the first cavity, and the second adsorption end faces the first adsorption end and is lower than the first adsorption end. The adsorption device is improved to adapt to adsorption of a substrate with large warping, and meanwhile, the phenomenon that adsorption marks are generated on the substrate can be improved.
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Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to an adsorption device and semiconductor equipment. Background Technology

[0002] The adsorption of substrates (such as wafers) plays a crucial role in semiconductor manufacturing. Whether in etching, deposition, or photolithography, the substrate needs to be stably and precisely adsorbed and fixed in the correct position to ensure efficient production. Furthermore, adsorption devices are required between different processing steps to adsorb, fix, and transfer the substrate.

[0003] Vacuum adsorption is widely used in wafer adsorption. It creates a negative pressure environment and utilizes a vacuum adsorption disk to provide uniform adsorption force to the substrate, thereby fixing the adsorbed substrate. This adsorption method is highly reliable, ensuring the stability of the substrate during processing. It is also highly versatile, suitable for adsorbing substrates of different sizes and types, and relatively simple to maintain.

[0004] With the continuous advancement of semiconductor technology, the thickness of substrates is gradually decreasing. With the development of more advanced manufacturing processes, the thickness of substrates has been further reduced while maintaining good mechanical strength and heat dissipation performance.

[0005] Reducing the substrate thickness often leads to increased warpage. When the warpage exceeds the adsorption capacity of the existing adsorption device, it can cause the adsorption function to fail, resulting in transfer or fixation failure. Currently, common solutions to this problem include increasing the vacuum level of the adsorption device or manually adjusting the substrate angle to accommodate larger warpages. Manually rotating the substrate can easily cause contamination and damage. Increasing the vacuum level leads to increased adsorption force, which can stretch the metal grains of the substrate, resulting in adsorption marks.

[0006] Therefore, this utility model provides an adsorption device and a semiconductor device. By improving the adsorption device, it can be adapted to the adsorption of substrates with large warpage, and at the same time, it helps to improve the phenomenon of adsorption marks on the substrate. Utility Model Content

[0007] The purpose of this invention is to provide an adsorption device and a semiconductor device. By improving the adsorption device, it can be adapted to the adsorption of substrates with large warpage, and at the same time, it can help to improve the phenomenon of adsorption marks on the substrate.

[0008] This utility model provides an adsorption device, comprising: a first adsorption element and a second adsorption element;

[0009] The first adsorption element has a first chamber, and one end of the first adsorption element along a first direction is a first adsorption end, with the first chamber extending through the first adsorption end;

[0010] The second adsorption element has a second chamber, and one end of the second adsorption element along the first direction is a second adsorption end, with the second chamber extending through the second adsorption end;

[0011] The second adsorption element is located in the first chamber, and the second adsorption end faces the first adsorption end and is lower than the first adsorption end.

[0012] Optionally, the first adsorption element and / or the second adsorption element are made of an elastic material.

[0013] Optionally, the first adsorption member is divided into a first adsorption part and a second adsorption part along the first direction. One end of the first adsorption part along the first direction is connected to the second adsorption part, and the other end of the first adsorption part along the first direction serves as the first adsorption end. The elastic modulus of the material of the first adsorption part is greater than the elastic modulus of the material of the second adsorption part.

[0014] Optionally, the second adsorption element is divided into a third adsorption section and a fourth adsorption section along the first direction. One end of the third adsorption section along the first direction is connected to the fourth adsorption section, and the other end of the third adsorption section along the first direction serves as the second adsorption end. The elastic modulus of the material of the third adsorption section is greater than that of the material of the fourth adsorption section.

[0015] Optionally, a first groove is provided on the inner and / or outer peripheral surfaces of the first adsorption element;

[0016] And / or, a second groove is provided on the inner and / or outer peripheral surfaces of the second adsorption member.

[0017] Optionally, the adsorption device further includes an adsorption body, wherein the end of the first adsorption element away from the first adsorption end along the first direction is connected to the adsorption body, and the end of the second adsorption element away from the second adsorption end along the first direction is connected to the adsorption body.

[0018] The adsorption body is provided with a vacuum hole, which is connected to the first chamber or the second chamber.

[0019] Optionally, the second chamber extends through the second adsorption element along the first direction, and the second adsorption element is arranged around the vacuum hole.

[0020] Optionally, the height difference between the second adsorption end and the first adsorption end along the first direction is 0.3 mm to 0.5 mm.

[0021] Optionally, the first adsorption element and the second adsorption element are in the form of a ring structure, and the first adsorption element and the second adsorption element are coaxially arranged;

[0022] When a vacuum hole is provided on the adsorption body, the vacuum hole is coaxially arranged with the first adsorption element and the second adsorption element.

[0023] This invention also provides a semiconductor device, which includes the adsorption device described above.

[0024] In summary, the adsorption device includes: a first adsorption element and a second adsorption element; the first adsorption element has a first chamber, one end of the first adsorption element along a first direction is a first adsorption end, and the first chamber is connected to the first adsorption end; the second adsorption element has a second chamber, one end of the second adsorption element along the first direction is a second adsorption end, and the second chamber is connected to the second adsorption end; the second adsorption element is located in the first chamber, and the second adsorption end faces the first adsorption end and is lower than the first adsorption end.

[0025] In this configuration, the adsorption device employs a double-layer nested arrangement for the first and second adsorption elements. When a negative pressure environment is formed within the first and second chambers, either the first or second adsorption end can adhere to the substrate, creating a closed space and thus adsorbing the substrate. When the substrate has minimal warping, the first adsorption end contacts the substrate surface, creating a closed negative pressure environment within the first chamber, at which point the first adsorption element performs adsorption. When the substrate has significant warping, the warped portion protrudes into the first chamber, and the substrate surface contacts the second adsorption end, creating a closed negative pressure environment within the second chamber, at which point the second adsorption element performs adsorption. If the substrate warping causes the substrate surface to perfectly align with both the first and second adsorption ends, then both ends may simultaneously contact the substrate surface, creating a closed negative pressure environment within both chambers, at which point both the first and second adsorption elements work together to adsorb the substrate. Therefore, by setting the height difference between the adsorption ends of the first and second adsorption elements, the warpage of the substrate can be better adapted. Under the same vacuum conditions, it has better adsorption capacity than existing adsorption devices. This adsorption device does not require increasing the vacuum to increase the suction force to adapt to the warpage of the substrate, which helps to improve the adsorption mark residue phenomenon caused by excessive suction force. It also helps to increase the vacuum fluctuation range of the adsorption device, which helps to expand its application range, avoids product abnormalities caused by vacuum fluctuations, reduces the contamination and damage to the product caused by human intervention during the adsorption process, and helps to improve product yield. Compared with the multi-ring nested structure of existing adsorption devices, the adsorption device in this embodiment has a simple structure and lower manufacturing cost.

[0026] Furthermore, in the aforementioned adsorption device, the second adsorption element and the second adsorption end located inside are positioned relatively low. When the first adsorption end of the first adsorption element located outside contacts the substrate surface, the first chamber and the second chamber are still essentially interconnected due to the height difference between the substrate and the second adsorption end. Therefore, this adsorption device only needs to be configured with a vacuum hole connected to the second chamber to provide a vacuum degree. Thus, only one vacuum hole is needed to meet all the adsorption requirements of the adsorption device, which helps to reduce the configuration of the vacuum channel of the adsorption device and simplify the structure of the adsorption device. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the planar structure of the adsorption device according to some embodiments of the present invention;

[0028] Figure 2 This is a partial cross-sectional view of the adsorption device according to some embodiments of the present invention;

[0029] Figure 3 This is a three-dimensional structural schematic diagram of the adsorption device according to some embodiments of the present invention;

[0030] Figure 4 This is a top view schematic diagram of the adsorption device according to some embodiments of the present invention;

[0031] Figure 5 This is a side view of the adsorption device according to some embodiments of the present invention.

[0032] In the attached diagram:

[0033] 10-First adsorption element; 101-First adsorption section; 102-Second adsorption section;

[0034] 11-First chamber; 12-First adsorption end; 13-First groove;

[0035] 20 - Second adsorption element; 201 - Third adsorption section; 202 - Fourth adsorption section;

[0036] 21-Second chamber; 22-Second adsorption end; 23-Second groove;

[0037] 30 - Adsorption body; 31 - Vacuum pore;

[0038] a - First direction. Detailed Implementation

[0039] The adsorption device proposed in this utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. The advantages and features of this utility model will become clearer from the following description. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the illustration of the embodiments of this utility model.

[0040] As used in this invention, the singular forms “a,” “an,” and “the” include plural objects; the term “or” is generally used to mean “and / or”; the term “a number” is generally used to mean “at least one”; and the terms “at least two” or “more than” are generally used to mean “two or more”. Furthermore, the terms “first,” “second,” and “third” are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with “first,” “second,” or “third” may explicitly or implicitly include one or at least two of that feature. Furthermore, the terms "installed," "connected," and "attached," as used in this utility model, and the term "set" on one element from another, should be interpreted broadly. They generally only indicate a connection, coupling, cooperation, or transmission relationship between the two elements, which can be direct or indirect through an intermediate element. They should not be construed as indicating or implying a spatial positional relationship between the two elements, meaning one element can be located inside, outside, above, below, or to one side of the other element, unless otherwise explicitly stated. Those skilled in the art can understand the specific meaning of these terms in this utility model according to the specific circumstances. Additionally, directional terms such as above, below, up, down, upward, downward, left, and right are used relative to exemplary embodiments as shown in the figures, with upward or up direction pointing towards the top of the corresponding figure, and downward or down direction pointing towards the bottom of the corresponding figure.

[0041] This utility model proposes an adsorption device, comprising: a first adsorption element 10 and a second adsorption element 20.

[0042] The first adsorption member 10 has a first chamber 11, and one end of the first adsorption member 10 along the first direction a ( Figure 2 and Figure 3 The upper end of the first adsorption element 10 is the first adsorption end 12, and the first chamber 11 extends through the first adsorption end 12.

[0043] The second adsorption member 20 has a second chamber 21, and one end of the second adsorption member 20 along the first direction a ( Figure 2 and Figure 3The upper end of the second adsorption element 20 is the second adsorption end 22, and the second chamber 21 extends through the second adsorption end 22.

[0044] The second adsorption element 20 is located inside the first chamber 11, and the second adsorption end 22 faces the first adsorption end 12, that is, the second adsorption end 22 and the first adsorption end 12 are arranged in the same direction.

[0045] The second adsorption end 22 is lower than the first adsorption end 12, that is, the second adsorption member 20 is entirely located in the first chamber 11 of the first adsorption member 10, and the second adsorption end 22 of the second adsorption member 20 is located in the first chamber 11 and does not extend to the outside of the first chamber 11.

[0046] In the aforementioned adsorption device, the first adsorption element 10 and the second adsorption element 20 are arranged in a double-layer nested manner. When a negative pressure environment is formed in the first chamber 11 and the second chamber 21, they can be attached to the substrate through the first adsorption end 12 or the second adsorption end 22, so that the first chamber 11 or the second chamber 21 forms a closed space, thereby achieving adsorption of the substrate. When the warping of the substrate is small, the first adsorption end 12 can contact the surface of the substrate to form a closed negative pressure environment in the first chamber 11, at which time the first adsorption element 10 plays an adsorption role. When the warping of the substrate is large, the warped part protrudes into the interior of the first chamber 11, and the surface of the substrate contacts the second adsorption end 22 to form a closed negative pressure environment in the second chamber 21, at which time the second adsorption element 20 plays an adsorption role. If the warping of the substrate makes the surface of the substrate just fit with the first adsorption end 12 and the second adsorption end 22, then the first adsorption end 12 and the second adsorption end 22 may also contact the surface of the substrate at the same time, so that the first chamber 11 and the second chamber 21 simultaneously form a closed negative pressure environment, at which time the first adsorption element 10 and the second adsorption element 20 jointly play an adsorption role to adsorb the substrate. Therefore, by setting the height difference between the adsorption ends of the first adsorption element 10 and the second adsorption element 20, the warpage of the substrate can be better adapted. Under the same vacuum condition, it has better adsorption capacity than existing adsorption devices. This adsorption device does not require increasing the vacuum degree to increase the suction force to adapt to the warpage of the substrate, which helps to improve the adsorption mark residue phenomenon caused by excessive suction force. It also helps to increase the vacuum degree fluctuation range of the adsorption device, which helps to increase its applicable range, avoids product abnormalities caused by vacuum fluctuations, reduces the contamination and damage to the product caused by human intervention during the adsorption process, and helps to improve the product yield. Compared with the multi-ring nested structure of existing adsorption devices, which is generally a four-ring structure, the adsorption device in this embodiment has a simple structure and lower manufacturing cost.

[0047] Furthermore, in the aforementioned adsorption device, the second adsorption element 20 and the second adsorption end 22 located internally are positioned relatively low. Therefore, when the first adsorption end 12 of the first adsorption element 10 located externally contacts the substrate surface, the first chamber 11 and the second chamber 21 remain essentially interconnected due to the height difference between the substrate and the second adsorption end 22. Thus, this adsorption device only requires a minimum of one vacuum port connected to the second chamber 21 to provide a vacuum. Therefore, only one vacuum port is needed to meet all the adsorption requirements of the adsorption device, which helps to reduce the configuration of the vacuum channel in the adsorption device and simplify its structure.

[0048] Combination Figure 1 As shown, the first adsorption element 10 and the second adsorption element 20 are in a ring structure and are coaxially arranged, so the first adsorption end 12 and the second adsorption end 22 are also in a ring structure. This adsorption device can be adapted to the adsorption of existing circular substrates, forming a circumferentially uniform adsorption force on the substrate, improving the adsorption effect, and ensuring a relatively stable adsorption effect. In other alternative embodiments, the specific shapes of the first adsorption element 10 and the second adsorption element 20 can be adjusted based on actual adsorption requirements or the shape of the substrate being adsorbed.

[0049] Combination Figure 2 As shown, in this embodiment, the height difference L between the second adsorption end 22 and the first adsorption end 12 along the first direction a is 0.3mm to 0.5mm, for example, 0.4mm. This height difference setting makes the adsorption device more suitable for adsorbing substrates of existing sizes.

[0050] Combination Figures 3 to 5 As shown, in this embodiment, the adsorption device further includes an adsorption body 30, and the end of the first adsorption element 10 located away from the first adsorption end 12 along the first direction a (as shown). Figure 3 The lower end of the first adsorption element 10 is connected to the adsorption body 30, and the end of the second adsorption element 20 away from the second adsorption end 22 along the first direction a ( Figure 3 The lower end of the second adsorption element 20 is connected to the adsorption body 30.

[0051] The adsorption body 30 is provided with a vacuum hole 31, which is connected to the second chamber 21.

[0052] Specifically, in this embodiment, the second chamber 21 extends through the second adsorption member 20 along the first direction a, that is, both ends of the second chamber 21 along the first direction a are open. When the second adsorption member 20 is away from the end of the second adsorption end 22 along the first direction a ( Figure 3 When the lower end of the second adsorption element 20 is connected to the adsorption body 30, Figure 3 The lower opening of the second chamber 21 is sealed by the adsorption body 30, which has a vacuum hole 31. The second adsorption element 20 is arranged around the vacuum hole 31. This arrangement only requires one vacuum hole 31 in the adsorption body 30, allowing it to simultaneously provide vacuum to both the first chamber 11 and the second chamber 21. Furthermore, there is no need for holes communicating with the vacuum hole 31 in the first adsorption element 10 and the second adsorption element 20, simplifying their structure.

[0053] In addition, it is understood that the adsorption body 30 should also have a vacuum channel communicating with the vacuum hole 31. The vacuum channel is connected to an external vacuum device (such as a vacuum pump). The setting of the vacuum channel can be consistent with the existing structure, and will not be described in detail here.

[0054] In this embodiment, the first chamber 11 extends through the first adsorption member 10 along the first direction a, that is, both ends of the first chamber 11 along the first direction a are open. When the first adsorption member 10 is away from the end of the first adsorption end 12 along the first direction a ( Figure 3 When the lower end of the first adsorption element 10 is connected to the adsorption body 30, Figure 3 The lower opening of the first chamber 11 is sealed by the adsorption body 30.

[0055] The first adsorption element 10 and the second adsorption element 20 mentioned above are both configured as a ring structure that runs through the first direction a, ensuring the overall consistency of the two structures and facilitating processing and assembly.

[0056] In other alternative embodiments, the second adsorption member 20 may be configured as a ring structure extending through the first direction a, and the first adsorption member 10 may be configured as a single-opening structure (the end of the first chamber 11 near the first adsorption end 12 is an open structure, and the end away from the first adsorption end 12 is a closed structure, i.e. Figure 3 The first adsorption element 10 is open at the top and closed at the bottom. At this time, the second adsorption element 20 can be installed at the bottom of the first chamber 11, and the vacuum hole 31 can be opened on the first adsorption element 10. The first adsorption element 10 and the second adsorption element 20 can form an adsorption device without relying on the adsorption body 30 (that is, the adsorption device may not include the adsorption body 30), or the adsorption device may still include the adsorption body 30, the vacuum hole 31 is opened on the adsorption body 30, and the first adsorption element 10 has an opening that communicates with the vacuum hole 31.

[0057] In other alternative embodiments, both the first adsorption member 10 and the second adsorption member 20 can be configured as a single-opening structure. Specifically, the first chamber 11 of the first adsorption member 10 has an open structure at the end near the first adsorption end 12 and a closed structure at the end away from the first adsorption end 12. Figure 3 The first adsorption element 10 is open at the top and closed at the bottom. The second chamber 21 of the second adsorption element 20 has an open structure at the end near the second adsorption end 22 and a closed structure at the end away from the second adsorption end 22. Figure 3 The second adsorption element 20 is open at the top and closed at the bottom. Similarly, at this time, the first adsorption element 10 and the second adsorption element 20 can form an adsorption device without relying on the adsorption body 30 (i.e., the adsorption device may not include the adsorption body 30), or the adsorption device may still include the adsorption body 30, and the opening position of the vacuum hole 31 can be adaptively adjusted based on whether the adsorption body 30 is provided.

[0058] In this embodiment, both the first adsorption element 10 and the second adsorption element 20 are configured as annular structures extending along the first direction a, and the second adsorption element 20 is arranged around the vacuum hole 31, meaning the vacuum hole 31 is directly connected to the second chamber 21. In other alternative embodiments, the vacuum hole 31 may be formed on the adsorption body 30 within the annular region between the first adsorption element 10 and the second adsorption element 20. That is, the vacuum hole 31 is directly connected to the annular chamber formed by the first adsorption element 10 and the second adsorption element 20.

[0059] In this embodiment, one vacuum hole 31 is provided. Through the structural configuration of the first adsorption element 10 and the second adsorption element 20, a single vacuum hole 31 can provide a negative pressure environment for both the first adsorption element 10 and the second adsorption element 20. In other alternative embodiments, the number of vacuum holes 31 can be increased. For example, multiple vacuum holes can be provided, with some directly connected to the second chamber 21 of the second adsorption element 20, and some directly connected to the annular chamber between the first adsorption element 10 and the second adsorption element 20.

[0060] In this embodiment, the adsorption body 30 has a plate-like structure. For example... Figures 3 to 5 As shown, the adsorption body 30 is a long strip-shaped plate structure, along its length direction ( Figure 3 and Figure 4 One end of the adsorption body 30 (in the left-right direction) is a straight edge, and the other end is a rounded edge. The first adsorption element 10 and the second adsorption element 20 are disposed near the rounded edge of the adsorption body 30, and the first direction a is perpendicular to the adsorption body 30. In other alternative embodiments, the adsorption body 30 can be configured as a block structure (non-plate structure), and its specific shape can be configured as a Y-shaped support structure or other structures, for example. The shape of the adsorption body 30 can be flexibly adjusted according to actual adsorption needs.

[0061] The first adsorption element 10 and the second adsorption element 20 constitute an adsorption unit. In this embodiment, one adsorption unit is provided on the adsorption body 30. In other alternative embodiments, multiple (two, three or more) adsorption units may be provided on the adsorption body 30 based on actual usage requirements.

[0062] Please refer to Figure 2 As shown, Figure 2 The middle section is a partial cross-sectional view of the first adsorption element 10 and the second adsorption element 20. Figure 2 The straight line pointed to by the first direction 'a' is also the central axis of the first adsorption element 10 and the second adsorption element 20, therefore... Figure 2 The image shows only a partial cross-sectional view of the structure of the first adsorption element 10 and the second adsorption element 20.

[0063] The following is combined Figure 2 The first adsorption element 10 and the second adsorption element 20 will be further described.

[0064] In this embodiment, the first adsorption element 10 and the second adsorption element 20 are made of elastic material. Here, elastic material refers to a material that can elastically deform under force and return to its original shape after the force is removed. For example, the first adsorption element 10 and the second adsorption element 20 can be made of rubber or other chemically stable, high-temperature resistant, and corrosion-resistant elastically deformable materials.

[0065] Both the first adsorption element 10 and the second adsorption element 20 are made of elastic material, which can deform appropriately when adsorbing the substrate to better adapt to the warping deformation of the substrate. At the same time, the deformation of the first adsorption element 10 and the second adsorption element 20 can reduce the deformation of the substrate, thereby improving the substrate warping caused by adsorption, and can transfer the friction between the substrate and the adsorption device, thereby protecting the metal grains on the back of the substrate from being stretched. The adsorption device's ability to adsorb warped substrates is also improved, reducing or even eliminating the phenomenon of transfer failure.

[0066] Furthermore, using elastic materials for both the first adsorption element 10 and the second adsorption element 20 helps them work synergistically. Since the first adsorption element 10 and the second adsorption element 20 can adaptably deform during adsorption, the height difference between the first adsorption end 12 and the second adsorption end 22 can be reduced during deformation, thereby allowing the first adsorption element 10 and the second adsorption element 20 to simultaneously adsorb the substrate, thus improving adsorption stability.

[0067] In other alternative embodiments, one of the first adsorption member 10 and the second adsorption member 20 may be made of an elastic material, for example, the first adsorption member 10 may be made of an elastic material, or the second adsorption member 20 may be made of an elastic material. The specific configuration can be adaptively adjusted based on actual usage requirements.

[0068] Please continue to combine Figure 2As shown, the first adsorption member 10 is divided into a first adsorption section 101 and a second adsorption section 102 along the first direction a. Both the first adsorption section 101 and the second adsorption section 102 are annular structures. One end of the first adsorption section 101 along the first direction a ( Figure 2 The lower end of the first adsorption part 101 is connected to the second adsorption part 102, and the other end of the first adsorption part 101 along the first direction a ( Figure 2 The upper end of the first adsorption part 101 serves as the first adsorption end 12. The elastic modulus of the material of the first adsorption part 101 is greater than that of the material of the second adsorption part 102, meaning that the second adsorption part 102 is more prone to elastic deformation than the first adsorption part 101. This arrangement primarily utilizes the second adsorption part 102, which has better elastic properties, to provide elastic deformation for the entire first adsorption component 10. The direct contact between the relatively less elastic and more rigid first adsorption part 101 and the substrate facilitates a sealed fit, thereby creating a negative pressure sealing environment in the first chamber 11 to ensure the stability of the adsorption capacity of the first adsorption component 10.

[0069] In this embodiment, the first adsorption part 101 may be made of fluororubber (FKM) and the second adsorption part 102 may be made of silicone rubber.

[0070] In other alternative embodiments, the materials of the first adsorption part 101 and the second adsorption part 102 can be selected based on actual needs, as long as the elastic deformation capacity of the first adsorption part 101 is less than that of the second adsorption part 102.

[0071] Similarly, the second adsorption element 20 is divided into a third adsorption section 201 and a fourth adsorption section 202 along the first direction a, and both the third adsorption section 201 and the fourth adsorption section 202 are annular structures. One end of the third adsorption section 201 along the first direction a ( Figure 2 The lower end of the third adsorption section 201 is connected to the fourth adsorption section 202, and the other end of the third adsorption section 201 along the first direction a ( Figure 2 The upper end of the third adsorption part 201 serves as the second adsorption end 22; the elastic modulus of the material of the third adsorption part 201 is greater than that of the material of the fourth adsorption part 202. That is, the fourth adsorption part 202 is more prone to elastic deformation than the third adsorption part 201. This arrangement primarily utilizes the fourth adsorption part 202, with its superior elasticity, to provide elastic deformation for the entire second adsorption member 20. The third adsorption part 201, with its relatively lower elasticity and higher stiffness, directly contacts the substrate, facilitating a sealed fit with the substrate. This, in turn, creates a negative pressure sealing environment in the second chamber 21, ensuring the stability of the adsorption capacity of the second adsorption member 20.

[0072] In this embodiment, the third adsorption part 201 may be made of fluororubber (FKM) and the fourth adsorption part 202 may be made of silicone rubber.

[0073] In other alternative embodiments, the materials of the third adsorption part 201 and the fourth adsorption part 202 can be selected based on actual needs, as long as the elastic deformation capacity of the third adsorption part 201 is less than that of the fourth adsorption part 202.

[0074] Please continue to refer to this. Figure 2 As shown, in this embodiment, the cross-sections of the first adsorption part 101 and the second adsorption part 102 are both equilateral trapezoids, wherein the cross-section of the second adsorption part 102 is an upright trapezoid (narrow end facing upwards), and the cross-section of the first adsorption part 101 is an inverted trapezoid (narrow end facing downwards). The narrow end of the first adsorption part 101 ( Figure 2 The width (radial dimension) of the lower middle part and the narrow end of the second adsorption part 102 ( Figure 2 The width (radial dimension) of the upper and middle sections is the same, and the two sections are conformally aligned and connected.

[0075] The wide end of the first adsorption section 101 ( Figure 2 The upper end of the first adsorption element 10 (the middle and upper part) serves as the upper end of the first adsorption element 10 and also as the first adsorption end 12. The wide end of the second adsorption part 102 ( Figure 2 The lower end of the first adsorption part 101 is the middle and lower end. Figure 2 The width (radial dimension) of the upper middle part is smaller than the width of the wide end of the second adsorption part 102. Figure 2 The width (radial dimension) of the lower middle section. Figure 2 The upper end of the first adsorption element 10 has a smaller wall thickness than the lower end. The upper end of the first adsorption element 10 is used to adhere to the substrate, and the lower end of the first adsorption element 10 is used to connect to the adsorption body 30. This end also serves as the base of the first adsorption element 10. The thicker wall thickness allows the lower end of the first adsorption element 10 to have a larger contact area with the adsorption body 30, thereby improving the overall stability of the first adsorption element 10.

[0076] The above arrangement ensures that the first adsorption element 10 is positioned on its inner circumferential surface ( Figure 2 (middle right side) and outer peripheral side ( Figure 2 Triangular first grooves 13 are formed on the left side of the first adsorption element 10. That is, the cross-section of the first adsorption element 10 forms a structure that is wide at both ends and narrow in the middle along the first direction a. The narrower middle part also helps to guide the first adsorption element 10 to deform along the first direction a, thereby better adapting to the warping deformation of the substrate.

[0077] In this embodiment, both the first adsorption portion 101 and the second adsorption portion 102 are configured as isosceles trapezoidal structures, thereby forming triangular first grooves 13 on both the inner and outer circumferential surfaces of the first adsorption member 10. In other alternative embodiments, the first adsorption portion 101 and the second adsorption portion 102 can be configured as right-angled trapezoids, so that the triangular first groove 13 is formed only on one side of the inner or outer circumferential surface of the first adsorption member 10. Furthermore, in other alternative embodiments, the cross-sectional shape of the first adsorption portion 101 and the second adsorption portion 102 can be changed, for example, configured as a semi-circle, a semi-ellipse, etc. The cross-sectional shape of the first adsorption portion 101 and the second adsorption portion 102 can be adjusted based on actual usage requirements.

[0078] In this embodiment, the first groove 13 is a triangular groove. In other alternative embodiments, the first groove 13 can be set as an arc-shaped or other shaped groove, and the specific shape of the first groove 13 can be adjusted based on the actual elastic deformation requirements.

[0079] In this embodiment, the shape configuration of the first adsorption part 101 and the second adsorption part 102 causes the first adsorption member 10 to form an annular first groove 13 on its inner or outer circumferential surface. That is, the first groove 13 is a closed groove that extends circumferentially along the first adsorption member 10 to form an annular groove. In other alternative embodiments, the first groove 13 may also be a non-annular groove, and multiple grooves may be evenly distributed along the circumferential direction of the first adsorption member 10.

[0080] Please continue to refer to this. Figure 2 As shown, in this embodiment, the cross-sections of both the third adsorption section 201 and the fourth adsorption section 202 are equilateral trapezoids, wherein the cross-section of the fourth adsorption section 202 is an upright trapezoid (narrow end facing upwards), and the cross-section of the third adsorption section 201 is an inverted trapezoid (narrow end facing downwards). The narrow end of the third adsorption section 201 ( Figure 2 The width (radial dimension) of the lower middle part and the narrow end of the fourth adsorption part 202 ( Figure 2 The width (radial dimension) of the upper and middle sections is the same, and the two sections are conformally aligned and connected.

[0081] The wide end of the third adsorption section 201 ( Figure 2 The upper end) serves as the upper end of the second adsorption member 20, and also as the second adsorption end 22, and the wide end of the fourth adsorption part 202. Figure 2 The lower end of the third adsorption part 201 is the lower end of the second adsorption member 20. Figure 2 The width (radial dimension) of the upper middle part is smaller than the width of the fourth adsorption part 202. Figure 2 The width (radial dimension) of the lower middle section, i.e. Figure 2The upper wall thickness of the second adsorption element 20 is less than that of the lower wall thickness. The upper end of the second adsorption element 20 is used to adhere to the substrate, and the lower end of the second adsorption element 20 is used to connect to the adsorption body 30. This lower end also serves as the base of the second adsorption element 20. The thicker wall thickness allows for a larger contact area between the lower end of the second adsorption element 20 and the adsorption body 30, thereby improving the overall stability of the second adsorption element 20.

[0082] The above arrangement ensures that the second adsorption element 20 is positioned on its inner circumferential surface ( Figure 2 (middle right side) and outer peripheral side ( Figure 2 Triangular second grooves 23 are formed on the left side of the middle section. That is, the cross-section of the second adsorption member 20 forms a structure that is wide at both ends and narrow in the middle along the first direction a. The narrower middle section also helps to guide the second adsorption member 20 to deform along the first direction a, thereby better adapting to the warping deformation of the substrate.

[0083] In this embodiment, both the third adsorption portion 201 and the fourth adsorption portion 202 are configured as isosceles trapezoidal structures, thereby forming triangular second grooves 23 on both the inner and outer circumferential surfaces of the second adsorption member 20. In other alternative embodiments, the third adsorption portion 201 and the fourth adsorption portion 202 can be configured as right-angled trapezoids, so that the triangular second groove 23 is formed only on one side of the inner or outer circumferential surface of the second adsorption member 20. Furthermore, in other alternative embodiments, the cross-sectional shape of the third adsorption portion 201 and the fourth adsorption portion 202 can be changed, for example, configured as a semi-circle, a semi-ellipse, etc. The cross-sectional shape of the third adsorption portion 201 and the fourth adsorption portion 202 can be adjusted based on actual usage requirements.

[0084] In this embodiment, the second groove 23 is a triangular groove. In other alternative embodiments, the second groove 23 can be set as an arc-shaped or other shaped groove, and the specific shape of the second groove 23 can be adjusted based on the actual elastic deformation requirements.

[0085] In this embodiment, the shape configuration of the third adsorption portion 201 and the fourth adsorption portion 202 causes the second adsorption member 20 to form an annular second groove 23 on its inner or outer circumferential surface. That is, the second groove 23 is a closed annular groove extending circumferentially along the second adsorption member 20. In other alternative embodiments, the second groove 23 may also be a non-closed annular groove, and multiple grooves may be evenly distributed along the circumferential direction of the second adsorption member 20.

[0086] In this embodiment, grooves are provided on both the first adsorption member 10 and the second adsorption member 20. In other alternative embodiments, grooves may be provided on either the first adsorption member 10 or the second adsorption member 20, for example, the first groove 13 may be provided only on the surface of the first adsorption member 10 or the second groove 23 may be provided only on the surface of the second adsorption member 20.

[0087] In this embodiment, a semiconductor device is also provided, which includes the adsorption device described above.

[0088] Semiconductor equipment, such as etching equipment, deposition equipment, photolithography equipment, or other semiconductor equipment equipped with a vacuum adsorption device, differs from existing equipment only in the replacement of the adsorption device; other structures remain the same as existing structures and will not be elaborated here.

[0089] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0090] The above description is only a description of the preferred embodiment of the present utility model and is not intended to limit the scope of the present utility model in any way. Any changes or modifications made by those skilled in the art based on the above disclosure shall fall within the protection scope of the claims.

Claims

1. An adsorption device, characterized in that, include: First adsorption element and second adsorption element; The first adsorption element has a first chamber, and one end of the first adsorption element along a first direction is a first adsorption end, with the first chamber extending through the first adsorption end; The second adsorption element has a second chamber, and one end of the second adsorption element along the first direction is a second adsorption end, with the second chamber extending through the second adsorption end; The second adsorption element is located in the first chamber, and the second adsorption end faces the first adsorption end and is lower than the first adsorption end.

2. The adsorption device as described in claim 1, characterized in that, The first adsorption element and / or the second adsorption element are made of elastic material.

3. The adsorption device as described in claim 2, characterized in that, The first adsorption element is divided into a first adsorption part and a second adsorption part along the first direction. One end of the first adsorption part along the first direction is connected to the second adsorption part, and the other end of the first adsorption part along the first direction serves as the first adsorption end. The elastic modulus of the material in the first adsorption section is greater than that of the material in the second adsorption section.

4. The adsorption device as described in claim 2, characterized in that, The second adsorption element is divided into a third adsorption part and a fourth adsorption part along the first direction. One end of the third adsorption part along the first direction is connected to the fourth adsorption part, and the other end of the third adsorption part along the first direction serves as the second adsorption end. The elastic modulus of the material in the third adsorption section is greater than that of the material in the fourth adsorption section.

5. The adsorption device as described in claim 1, characterized in that, The first adsorption element has a first groove on its inner and / or outer peripheral surfaces; And / or, a second groove is provided on the inner and / or outer peripheral surfaces of the second adsorption member.

6. The adsorption device as described in claim 1, characterized in that, The adsorption device further includes an adsorption body, wherein the end of the first adsorption element away from the first adsorption end along the first direction is connected to the adsorption body, and the end of the second adsorption element away from the second adsorption end along the first direction is connected to the adsorption body. The adsorption body is provided with a vacuum hole, which is connected to the first chamber or the second chamber.

7. The adsorption device as described in claim 6, characterized in that, The second chamber extends through the second adsorption element along the first direction, and the second adsorption element is arranged around the vacuum hole.

8. The adsorption device as described in claim 1, characterized in that, The height difference between the second adsorption end and the first adsorption end along the first direction is 0.3 mm to 0.5 mm.

9. The adsorption device as described in claim 6, characterized in that, The first adsorption element and the second adsorption element are in a ring structure and are coaxially arranged. The vacuum hole is coaxially arranged with the first adsorption element and the second adsorption element.

10. A semiconductor device, characterized in that, The semiconductor device includes the adsorption device as described in any one of claims 1 to 9.