Rapid molding equipment for chip packaging

Abstract

The utility model provides a chip packaging rapid prototyping device, relates to mechanical engineering and electronic engineering technical field, and comprises a work bench and a clamping structure, the top end of the work bench is fixedly connected with a fixed box, the inner wall of the fixed box is fixedly connected with a motor, the driving end of the motor is fixedly connected with a threaded rod, and the threaded rod is fixedly connected with the clamping structure. The outer wall of the threaded rod is rotationally connected to the inner wall of the fixing box, the outer wall of the threaded rod is in threaded connection with an adjuster, the inner walls of the two sides of the adjuster are symmetrically and rotationally connected with adjusting rods, and the outer wall of the end of one side of each adjusting rod is rotationally connected with a clamping structure. According to the utility model, the clamping structure and the clamping fixer structure are adopted, so that not only can the chip be fixedly packaged, but also the chip can be quickly taken out after the packaging is completed, meanwhile, the device cannot be damaged by the chip with higher temperature, and the leakage-proof soft cushion structure is adopted, so that materials for packaging the chip are prevented from flowing out of the device.

Description

Technical Field

[0001] This utility model relates to the fields of mechanical engineering and electronic engineering technology, and in particular to a chip packaging rapid prototyping equipment. Background Technology

[0002] As electronic products evolve towards higher performance, miniaturization, and multifunctionality, the demands on chip packaging technology are also increasing. Traditional packaging methods can no longer meet the needs of modern electronic products, leading to the emergence of new packaging technologies such as System-in-Package (SIP), 3D stacked packaging, and flip-chip packaging. These new technologies not only improve packaging density and performance but also reduce costs and power consumption, driving the rapid development of the chip packaging industry.

[0003] In the prior art, such as the chip packaging device disclosed in Chinese Patent Publication No. CN118558542A, a base and a table are included. The table slides up and down on the upper side of the base, and a limiting mechanism is provided between the table and the base to prevent the table from separating from the base. A vibration motor is fixedly connected to the lower end face of the table. The above patent has the following problems:

[0004] (1) The above scheme preheats the filling mechanism before filling the filling glue, which facilitates the flow of the filling glue during filling. During the filling process, the substrate is shaken slightly to facilitate the shaking and flow of the filling glue in the cofferdam glue. However, after the chip is packaged, it is not easy to quickly form and remove the chip, resulting in low work efficiency.

[0005] (2) It does not have the ability to press and cool the material wrapped around the chip, which will result in a slower chip packaging speed and overheating will affect the overall device, shorten the device's service life, and cause unnecessary material loss. Utility Model Content

[0006] The purpose of this invention is to solve the problem of low work efficiency caused by the difficulty in quickly molding and removing chips after they have been packaged in the prior art. Therefore, this invention proposes a chip packaging rapid prototyping device.

[0007] To achieve the above objectives, the present invention adopts the following technical solution: a chip packaging rapid prototyping device, comprising a worktable and a clamping structure, wherein a fixed box is fixedly connected to the top of the worktable, a motor is fixedly connected to the inner wall of the fixed box, a threaded rod is fixedly connected to the drive end of the motor, the outer wall of the threaded rod is rotatably connected to the inner wall of the fixed box, an adjuster is threadedly connected to the outer wall of the threaded rod, adjusting rods are symmetrically rotatably connected to the inner walls on both sides of the adjuster, and a clamping structure is rotatably connected to the outer wall of one end of the adjusting rod;

[0008] The clamping structure consists of a clamping arm rotatably connected to the outer wall of one end of the adjusting rod, a limiter fixedly connected to the inner wall of the clamping arm, the outer wall of the limiter rotatably connected to the inner wall of the worktable, and a clamping retainer fixedly connected to the outer wall of one end of the clamping arm.

[0009] Preferably, a heat-resistant pad is fixedly connected to the inner outer wall of the clamping fixture, two leak-proof soft pads are fixedly connected to the outer wall of the clamping fixture, the outer wall of the leak-proof soft pad is fixedly connected to the outer wall of the heat-resistant pad, and a material pad is fixedly connected to the bottom outer wall of one of the clamping fixtures.

[0010] Preferably, a support bar is fixedly connected to the outer wall of the top of the workbench, and a fan is fixedly connected to the outer wall of the support bar.

[0011] Preferably, a support is fixedly connected to the outer wall of the top of the workbench, and an electric push rod is fixedly connected to the outer wall of the support.

[0012] Preferably, a presser is fixedly connected to the outer wall of the bottom end of the electric push rod.

[0013] Preferably, a condenser tube is fixedly connected to the inner wall of the press, and a heat-conducting pad is fixedly connected to the outer wall of the bottom end of the press.

[0014] Compared with the prior art, the advantages and positive effects of this utility model are as follows:

[0015] 1. In this utility model, a clamping structure and a clamping fixer structure are adopted, which can not only fix and encapsulate the chip, but also allow the chip to be quickly removed after encapsulation. At the same time, the chip with a high temperature will not damage the device. Secondly, a leak-proof soft pad structure is adopted to prevent the material used for encapsulating the chip from flowing out of the device.

[0016] 2. In this utility model, a condenser tube and a thermal pad structure are adopted. During the pressing and molding process of the chip, the chip is cooled and molded by the thermal pad and the condenser tube. In addition, a fan structure is added to cool and cool both the press and the chip. This not only improves the working efficiency of the device, but also prevents the device from being damaged by high temperature. Attached Figure Description

[0017] Figure 1 This utility model provides a three-dimensional structural schematic diagram of a chip packaging rapid prototyping device;

[0018] Figure 2 This utility model provides a schematic diagram of the clamping structure of a chip packaging rapid prototyping device;

[0019] Figure 3 This utility model provides a detailed drawing of a clamping and fixing device for a chip packaging rapid prototyping equipment;

[0020] Figure 4 This utility model provides a cross-sectional schematic diagram of the press of a chip packaging rapid prototyping device.

[0021] Legend: 1. Workbench; 2. Fixed box; 3. Motor; 4. Threaded rod; 5. Adjuster; 6. Adjusting rod; 7. Clamping arm; 8. Limiter; 9. Clamping fixture; 10. Material pad; 11. Heat-resistant pad; 12. Leak-proof soft pad; 13. Support bar; 14. Fan; 15. Support; 16. Electric push rod; 17. Press; 18. Condenser; 19. Thermal conductive pad. Detailed Implementation

[0022] To better understand the above-mentioned objectives, features, and advantages of this utility model, the present utility model will be further described below with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0023] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the present invention is not limited to the specific embodiments disclosed in the following specification.

[0024] Example 1: As Figures 1-4 As shown, this utility model provides a technical solution: a chip packaging rapid prototyping device, including a worktable 1 and a clamping structure. A fixed box 2 is fixedly connected to the top of the worktable 1. A motor 3 is fixedly connected to the inner wall of the fixed box 2. A threaded rod 4 is fixedly connected to the drive end of the motor 3. The outer wall of the threaded rod 4 is rotatably connected to the inner wall of the fixed box 2. An adjuster 5 is threadedly connected to the outer wall of the threaded rod 4. Adjusting rods 6 are symmetrically rotatably connected to the inner walls on both sides of the adjuster 5. A clamping structure is rotatably connected to the outer wall of one end of the adjusting rod 6. The clamping structure is... A clamping arm 7 is rotatably connected to the outer wall of one end of the adjusting rod 6. A limiter 8 is fixedly connected to the inner wall of the clamping arm 7. The outer wall of the limiter 8 is rotatably connected to the inner wall of the workbench 1. A clamping fixture 9 is fixedly connected to the outer wall of one end of the clamping arm 7. A heat-resistant pad 11 is fixedly connected to the outer wall of the inner side of the clamping fixture 9. Two leak-proof soft pads 12 are fixedly connected to the outer wall of the clamping fixture 9. The outer wall of the leak-proof soft pad 12 is fixedly connected to the outer wall of the heat-resistant pad 11. A material pad 10 is fixedly connected to the outer wall of the bottom end of one of the clamping fixtures 9.

[0025] In this embodiment, motor 3 is first started. The drive end of motor 3 rotates, thereby driving the threaded rod 4 to rotate on the inner wall of the fixed box 2. The rotation of the threaded rod 4 drives the adjuster 5 to move along the surface of the threaded rod 4. The movement of the adjuster 5 drives the two adjusting rods 6 to move. The movement of the adjusting rods 6, under the action of the limiter 8, drives the two clamping arms 7 to rotate towards clamping. The movement of the clamping arms 7 drives the two clamping retainers 9 to move towards the closed state. When the leak-proof soft pads 12 on the surface of the two clamping retainers 9 come into contact with each other and press together, motor 3 is turned off. Then, the chip and material are placed along the material pad 10 and the heat-resistant pad 11 for encapsulation. After encapsulation is completed, motor 3 is simply reversed to separate the two clamping retainers 9, and the chip can be easily removed. This part mainly introduces the working principle of the clamping structure. By using the clamping structure and clamping retainer structure, not only can the chip be fixed and encapsulated, but the chip can also be quickly removed after encapsulation. At the same time, the high temperature of the chip will not damage the device. Secondly, the leak-proof soft pad structure is used to prevent the material used for encapsulating the chip from flowing out of the device.

[0026] Example 2: As Figures 1-4 As shown, a support rod 13 is fixedly connected to the outer wall of the top of the workbench 1, a fan 14 is fixedly connected to the outer wall of the support rod 13, a support 15 is fixedly connected to the outer wall of the top of the workbench 1, an electric push rod 16 is fixedly connected to the outer wall of the support 15, a presser 17 is fixedly connected to the outer wall of the bottom end of the electric push rod 16, a condenser 18 is fixedly connected to the inner wall of the presser 17, and a heat-conducting pad 19 is fixedly connected to the outer wall of the bottom end of the presser 17.

[0027] In this embodiment, the condenser 18 is first activated to cool the press 17. Then, the electric push rod 16 is activated to push the press 17 towards the chip and material surface to press and encapsulate the chip. At the same time, the temperature generated by the condenser 18 is transferred to the chip surface along the thermal pad 19 to cool the chip and accelerate the chip encapsulation process. Simultaneously, the fan 14 is activated to cool the surface of the press 17 and the chip surface. This part mainly introduces the working principle of the pressing structure and the condensing structure. By using the condenser and thermal pad structure, the chip is cooled and formed during the pressing process. Secondly, the fan structure is added to cool both the press and the chip, which not only improves the working efficiency of the device but also prevents damage to the device caused by high temperature.

[0028] The working principle of this embodiment is as follows: First, start motor 3. The drive end of motor 3 rotates, thereby driving the threaded rod 4 to rotate on the inner wall of the fixed box 2. The rotation of the threaded rod 4 drives the adjuster 5 to move along the surface of the threaded rod 4. The movement of the adjuster 5 drives the two adjusting rods 6 to move. The movement of the adjusting rods 6, under the action of the limiter 8, drives the two clamping arms 7 to rotate towards the clamping position. The movement of the clamping arms 7 drives the two clamping fixtures 9 to move towards the closed state. When the leak-proof soft pads 12 on the surface of the two clamping fixtures 9 come into contact with each other and press together, motor 3 is turned off. Then, along the material... The chip and materials are placed in pad 10 and heat-resistant pad 11 for encapsulation. Then, the condenser 18 is activated to condense and cool the press 17. Next, the electric push rod 16 is activated to push the press 17 toward the surface of the chip and materials to press and encapsulate the chip. At the same time, the temperature generated by the condenser 18 is transferred to the chip surface along the heat-conducting pad 19 to condense and cool the chip, accelerating the chip encapsulation process. Meanwhile, the fan 14 is activated to cool the surface of the press 17 and the chip surface. After encapsulation is completed, simply reverse the motor 3 to separate the two clamping retainers 9, and the chip can be easily removed.

[0029] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments for application in other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present utility model without departing from the technical solution of the present utility model shall still fall within the protection scope of the technical solution of the present utility model.

Claims

1. A chip packaging rapid prototyping device, comprising a worktable (1) and a clamping structure, characterized in that: The top of the workbench (1) is fixedly connected to a fixed box (2), the inner wall of the fixed box (2) is fixedly connected to a motor (3), the drive end of the motor (3) is fixedly connected to a threaded rod (4), the outer wall of the threaded rod (4) is rotatably connected to the inner wall of the fixed box (2), the outer wall of the threaded rod (4) is threadedly connected to an adjuster (5), the inner walls on both sides of the adjuster (5) are symmetrically rotatably connected to adjusting rods (6), and the outer wall of one end of the adjusting rod (6) is rotatably connected to a clamping structure; The clamping structure is such that a clamping arm (7) is rotatably connected to the outer wall of one end of the adjusting rod (6), a limiter (8) is fixedly connected to the inner wall of the clamping arm (7), the outer wall of the limiter (8) is rotatably connected to the inner wall of the workbench (1), and a clamping fixer (9) is fixedly connected to the outer wall of one end of the clamping arm (7).

2. The chip packaging rapid prototyping equipment according to claim 1, characterized in that: A heat-resistant pad (11) is fixedly connected to the inner outer wall of the clamping fixture (9), and two leak-proof soft pads (12) are fixedly connected to the outer wall of the clamping fixture (9). The outer wall of the leak-proof soft pad (12) is fixedly connected to the outer wall of the heat-resistant pad (11), and a material pad (10) is fixedly connected to the bottom outer wall of one of the clamping fixtures (9).

3. The chip packaging rapid prototyping equipment according to claim 2, characterized in that: The top outer wall of the workbench (1) is fixedly connected to a support bar (13), and the outer wall of the support bar (13) is fixedly connected to a fan (14).

4. The chip packaging rapid prototyping equipment according to claim 3, characterized in that: The workbench (1) has a support (15) fixedly connected to the outer wall of the top end, and an electric push rod (16) is fixedly connected to the outer wall of the support (15).

5. The chip packaging rapid prototyping equipment according to claim 4, characterized in that: A presser (17) is fixedly connected to the outer wall of the bottom end of the electric push rod (16).

6. The chip packaging rapid prototyping equipment according to claim 5, characterized in that: A condenser tube (18) is fixedly connected to the inner wall of the press (17), and a heat-conducting pad (19) is fixedly connected to the outer wall of the bottom end of the press (17).

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