Wafer cooling device of rapid annealing furnace

Abstract

The utility model relates to the technical field of wafer processing, in particular to a wafer cooling device of a rapid annealing furnace, which comprises a bearing seat. The box opening mechanism is provided with a bottom plate mounted on the bearing seat, a box opening jacking column mounted on the bottom plate and used for jacking an upper box body and a lower box body of the graphite box, and a supporting jacking column mounted on the bottom plate and used for jacking a wafer; and the blowing port is formed in the bearing seat, and the blowing port can blow dry gas to the box opening mechanism. Compared with the prior art, by arranging the box opening mechanism, after the graphite box is input into the cooling device, the lower box body and the upper box body of the graphite box can be jacked open by using the opening and closing jacking column, and a wafer is jacked up through the supporting jacking column; the upper box body and the lower box body of the graphite box are opened in an unpowered self-weight mode, and compared with an air cylinder jacking mode, the smoothness and reliability of opening the upper box body and the lower box body can be improved; and meanwhile, the wafer cannot be scratched in the box clamping process of the upper box body and the lower box body, so that the production yield of the wafer is improved.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing technology, and in particular to a wafer cooling device for a rapid annealing furnace. Background Technology

[0002] Modular wafer fabrication methods require cooling devices to be installed according to processing needs to cool the wafers. During the annealing process, a graphite box is used to support the wafer; after the graphite box is fed into the cooling device, a cylinder or similar driving device is needed as the power source for opening the graphite box. However, in actual production operations, the inventors discovered that during the opening and closing process of the upper and lower boxes of the graphite box, the cylinder is prone to excessive or insufficient lifting force due to unstable air pressure. This can cause wafer misalignment, preventing the upper and lower boxes from opening properly and easily scratching the wafer. Therefore, the structure using a cylinder as the power source for opening the graphite box has poor operational reliability and affects wafer production yield.

[0003] Therefore, a new technical solution needs to be researched to address the above problems. Utility Model Content

[0004] In view of this, the present invention addresses the deficiencies of the existing technology and its main objective is to provide a rapid annealing furnace wafer cooling device, which effectively solves the technical defects in the existing technology where the use of a cylinder as the power source for opening the graphite box results in poor reliability of the graphite box and affects the wafer production yield.

[0005] To achieve the above objectives, this utility model adopts the following technical solution: a rapid annealing furnace wafer cooling device, comprising...

[0006] Support;

[0007] The box-opening mechanism includes a base plate mounted on a support, an upper box body and a lower box body mounted on the base plate for opening the graphite box, and a support top column mounted on the base plate for lifting the wafer; and,

[0008] An air inlet is located on the support base; the air inlet can blow dry gas to the box opening mechanism.

[0009] The beneficial effects of the rapid annealing furnace wafer cooling device provided in this application are as follows: Compared with the prior art, on the one hand, by setting an opening mechanism, after the graphite box is input into the cooling device, the lower and upper boxes of the graphite box can be opened by using the opening and closing top column, and the wafer can be lifted by the supporting top column; the upper and lower boxes of the graphite box can be opened by gravity without power, which can improve the smoothness and reliability of opening the upper and lower boxes compared with the method of using cylinder lifting; at the same time, it can avoid the problem of excessive or insufficient lifting force due to unstable air pressure, thereby ensuring that the wafer is not scratched during the process of the upper and lower boxes being clamped, thus improving the wafer production yield;

[0010] On the other hand, by setting an air outlet on the carrier that can blow dry gas to the unpacking mechanism, the wafer can be quickly cooled by the dry gas after the unpacking mechanism opens the graphite box, thereby reducing the wafer cooling time and improving the wafer cooling efficiency.

[0011] As a preferred embodiment, there are at least three top posts for opening the box, which are installed on the upper surface of the base plate and arranged in a triangular spacing.

[0012] As a preferred embodiment, there are at least three support columns, which are installed on the upper surface of the base plate and arranged in a triangular spacing, with the three support columns located inside the three opening top columns.

[0013] As a preferred embodiment, the top post of the box includes a lower post mounted on the base plate and an upper post integrally formed on the upper surface of the lower post, wherein the diameter of the upper post is smaller than the diameter of the lower post.

[0014] The lower body of the graphite box has a first through hole that runs through its upper and lower surfaces and is used for inserting the upper column. The diameter of the first through hole is larger than the diameter of the upper column and smaller than the diameter of the lower column.

[0015] When the graphite box is fed into the opening mechanism, the upper column can be inserted into the first perforation from bottom to top and lift the upper box, so that the lower box is supported by the lower column.

[0016] As a preferred embodiment, the upper surface of the lower box of the graphite box is provided with a first receiving recess for storing wafers, and the lower box is provided with a second through hole penetrating the upper and lower surfaces in the area where the first receiving recess is located.

[0017] When the support pillar passes through the second perforation from bottom to top, it can lift the wafer in the first receiving recess and remove it from the first receiving recess.

[0018] As a preferred embodiment, the lower body of the graphite box has a first positioning notch on the upper surface edge, and the upper body has a first positioning post on the lower surface edge.

[0019] After the lower and upper boxes are closed, the first positioning pin can be inserted into the first positioning notch.

[0020] As a preferred embodiment, the carrier includes a first substrate and first support plates mounted on the left and right sides of the first substrate. There are several opening mechanisms, which are installed on the first support plates from bottom to top at intervals.

[0021] As a preferred embodiment, a photoelectric transmitter is installed on the first support plate on the left, and a photoelectric receiver is installed on the first support plate on the right. The photoelectric transmitter and the photoelectric receiver at the same height constitute a set of detection units, and each box opening mechanism is equipped with a set of detection units.

[0022] As a preferred embodiment, the photoelectric transmitter is installed on the left side of the first support plate on the left, and the photoelectric receiver is installed on the right side of the first support plate on the right.

[0023] Both the left and right first support plates are provided with photoelectric apertures that penetrate their left and right sides, allowing the light from the photoelectric emitter to pass through the photoelectric apertures for reception by the photoelectric receiver.

[0024] As a preferred embodiment, both the left first support plate and the right first support plate are equipped with protective covers, which can conceal the detection unit.

[0025] The air inlet extends through the left and / or right sides of the first support plate. The air inlet can be connected to a gas generator through a pipe to blow dry gas to the box opening mechanism. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a three-dimensional structural diagram of the support base and the box opening mechanism of the rapid annealing furnace wafer cooling device provided in the embodiments of this application;

[0028] Figure 2 yes Figure 1 A schematic diagram of the specific structure of the support base and the box opening mechanism of the rapid annealing furnace wafer cooling device shown;

[0029] Figure 3 This is a schematic diagram of the opening mechanism of the rapid annealing furnace wafer cooling device provided in the embodiments of this application;

[0030] Figure 4 yes Figure 3 A top view of the box-opening mechanism shown;

[0031] Figure 5 yes Figure 4 The front view of the box-opening mechanism shown;

[0032] Figure 6 yes Figure 1 A cross-sectional view of the support base and opening mechanism of the wafer cooling device in the rapid annealing furnace shown.

[0033] The following are the labeling elements in the figure:

[0034] 100. Rapid annealing furnace wafer cooling device;

[0035] 10. Bearing base; 11. First substrate; 12. First support plate; 121. Photoelectric aperture; 122. Protective cover; 123. Air outlet; 13. Detection unit; 131. Photoelectric transmitter; 132. Photoelectric receiver;

[0036] 20. Box opening mechanism; 21. Base plate; 22. Box opening top column; 221. Lower column; 222. Upper column; 23. Supporting top column; 231. First clamping block; 232. Second clamping block;

[0037] 200. Graphite box; 2001. Upper box body; 2002. Lower box body; 2003. First perforation; 2004. First receiving recess; 2005. Second perforation; 2006. First positioning notch; 2007. First positioning post;

[0038] 300. Wafer. Detailed Implementation

[0039] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0040] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0041] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0042] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0043] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments.

[0044] Please refer to the following: Figures 1 to 6 The rapid annealing furnace wafer cooling device 100 provided in the embodiments of this application will now be described. The rapid annealing furnace wafer cooling device 100 includes: a support base 10 and an opening mechanism 20.

[0045] The box-opening mechanism 20 includes a base plate 21, a box-opening top column 22, and a supporting top column 23. The base plate 21 is fixedly installed on the support base 10, and the box-opening top column 22 and the supporting top column 23 are both installed on the upper surface of the base plate 21. When the graphite box 200 is input into the box-opening mechanism 20, the box-opening top column 22 can push open the upper box body 2001 and the lower box body 2002 of the graphite box 200, and the supporting top column 23 can push the wafer 300 out of the graphite box 200, so that the upper box body 2001, the wafer 300, and the lower box body 2002 are spaced apart from top to bottom. The support base 10 is provided with an air blowing port 123, which can be connected to an external gas generator through a pipe to blow dry gas into the box-opening mechanism 20.

[0046] Specifically, on the one hand, by setting up the box opening mechanism 20, after the graphite box 200 is fed into the cooling device, the lower box body 2002 and the upper box body 2001 of the graphite box 200 can be opened by using the opening and closing top column, and the wafer 300 can be lifted by the support top column 23; the upper box body 2001 and the lower box body 2002 of the graphite box 200 can be opened by their own weight without power, which can improve the smoothness and reliability of opening the upper box body 2001 and the lower box body 2002 compared with the method of using cylinder lifting; at the same time, it can avoid the problem of excessive or insufficient lifting force due to unstable air pressure, thereby ensuring that the upper box body 2001 and the lower box body 2002 will not scratch the wafer 300 during the opening process, thereby improving the production yield of the wafer 300;

[0047] On the other hand, by setting an air outlet on the carrier that can blow dry gas to the unpacking mechanism, the wafer can be quickly cooled by the dry gas after the unpacking mechanism opens the graphite box, thereby reducing the wafer cooling time and improving the wafer cooling efficiency.

[0048] In some embodiments, there are at least three opening top posts 22, which are mounted on the upper surface of the base plate 21 and arranged at a triangular interval. There are at least three support top posts 23, which are mounted on the upper surface of the base plate 21 and arranged at a triangular interval, and the three support top posts 23 are located inside the three opening top posts 22.

[0049] Specifically, by setting the opening and closing top pillars with triangular spacing and the supporting top pillars 23 with triangular spacing, it is beneficial to improve the lifting of the upper box 2001 by the opening top pillar 22, so that the lower box 2002 can move smoothly when it separates from the upper box 2001 by its own weight, reduce the deviation problem that occurs during the movement of the lower box 2002, and thus prevent the upper box 2001 and the lower box 2002 from scratching the wafer 300 during the opening process, thereby improving the production yield of the wafer 300.

[0050] Preferably, the top post 22 for opening the box includes a lower post 221 mounted on the base plate 21 and an upper post 222 integrally formed on the upper surface of the lower post 221. The diameter of the upper post 222 is smaller than the diameter of the lower post 221. The lower box body 2002 of the graphite box 200 is provided with a first through hole 2003 that penetrates its upper and lower surfaces for the upper post 222 to be inserted. The diameter of the first through hole 2003 is larger than the diameter of the upper post 222 and smaller than the diameter of the lower post 221. When the graphite box 200 is fed into the box opening mechanism 20, the upper post 222 can be inserted into the first through hole 2003 from bottom to top and lift the upper box body 2001, so that the lower box body 2002 is supported by the lower post 221.

[0051] Specifically, the overall length of the supporting top post 23 is greater than the overall length of the lower post 221, but the overall length of the supporting top post 23 is less than the overall length of the opening top post 22. This allows the lower post 2002 to move down by its own weight and abut against the upper surface of the lower post 221 after the upper post 222 lifts the upper box 2001. The supporting top post 23 lifts the wafer 300, and the upper box 2001, wafer 300 and lower box 2002 are spaced apart from top to bottom, allowing the wafer 300 to escape the residual heat of the graphite box 200. In conjunction with the air blowing port, dry gas is blown out to the opening mechanism to improve the wafer cooling efficiency. Furthermore, by setting the first perforation 2003 for the upper column 222 to be inserted and lift the upper box 2001, the lower box 2002 can be restricted to move downwards only by its own weight, thereby further improving the ability to restrict the displacement of the lower box 2002, so that the lower box 2002 will not scratch the wafer 300 during the opening operation of the upper box 2001.

[0052] Furthermore, the upper surface of the lower box body 2002 of the graphite box 200 is provided with a first receiving recess 2004 for storing the wafer 300, and the lower box body 2002 is provided with a second through hole 2005 penetrating its upper and lower surfaces in the area where the first receiving recess 2004 is located; when the supporting top post 23 passes through the second through hole 2005 from bottom to top, it can lift the wafer 300 in the first receiving recess 2004 and remove it from the first receiving recess 2004. The upper edge of the upper surface of the lower box body 2002 of the graphite box 200 is provided with a first positioning notch 2006, and the lower edge of the upper box body 2001 is provided with a first positioning post 2007; when the lower box body 2002 and the upper box body 2001 are closed, the first positioning post 2007 can be inserted into the first positioning notch 2006.

[0053] More specifically, the base plate 21 is provided with through holes that penetrate the upper and lower surfaces of the base plate 21; the top post 22 has screw holes at the bottom of the lower post 221, part of which is adapted to install the top post 22 and the other part is adapted to install the support post 23; by using screws to pass through the through holes from the bottom of the base plate 21 and screw them into the screw holes, the entire top post 22 can be fixedly installed on the upper surface of the base plate 21; the support post 23 is clamped by the first clamping block 231 and the second clamping block 232, wherein the first clamping block 231 is screwed through the through holes and screwed into the second clamping block 231, and the support post 23 is clamped by screwing the second clamping block 232 into the first clamping block 231.

[0054] In other embodiments, the carrier 10 includes a first substrate 11 and first support plates 12 mounted on the left and right sides of the first substrate 11. Several opening mechanisms 20 are provided, and these mechanisms are spaced apart from bottom to top on the first support plates 12. A photoelectric transmitter 131 is mounted on the left first support plate 12, and a photoelectric receiver 132 is mounted on the right first support plate 12. Photoelectric transmitters 131 and photoelectric receivers 132 at the same height constitute a set of detection units 13, and each opening mechanism 20 is correspondingly equipped with a set of detection units 13.

[0055] Specifically, the photoelectric transmitter 131 is installed on the left side of the left first support plate 12, and the photoelectric receiver 132 is installed on the right side of the right first support plate 12. Both the left and right first support plates 12 are provided with photoelectric apertures 121 penetrating their left and right sides, allowing the light from the photoelectric transmitter 131 to pass through the photoelectric apertures 121 and be received by the photoelectric receiver 132. Both the left and right first support plates 12 are equipped with protective covers 122, which can conceal the detection unit 13.

[0056] More specifically, each box-opening mechanism 20 is equipped with a set of detection units 13, which emit light through a photoelectric transmitter 131 and receive it through a photoelectric receiver 132 to detect whether the graphite box 200 is placed in place and whether the box opening is normal. This improves the overall intelligence of the rapid annealing furnace wafer 300 cooling device 100, reduces the number of times operators need to intervene, and not only improves production efficiency, but also ensures the reliability of wafer 300 cooling operation.

[0057] Furthermore, the air blowing port is located on the left first support plate and / or the right first support plate, and extends through the left and right sides of the left first support plate and the right first support plate. The number of air blowing ports is set according to the number of box opening mechanisms. The gas generating device can blow dry gas through the pipe and air blowing port to the location of the box opening mechanism to assist the wafer in cooling operations.

[0058] The above are merely preferred embodiments of the present utility model, and only specifically describe the technical principles of the present utility model. These descriptions are only for explaining the principles of the present utility model and should not be construed as limiting the scope of protection of the present utility model in any way. Based on this explanation, any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model, as well as other specific embodiments of the present utility model that can be conceived by those skilled in the art without creative effort, should be included within the scope of protection of the present utility model.

Claims

1. A wafer cooling apparatus for a rapid annealing furnace, characterized in that, include Support base (10); The box-opening mechanism (20) includes a base plate (21) mounted on a support (10), a box-opening top post (22) mounted on the base plate (21) for opening the upper box body (2001) and the lower box body (2002) of the graphite box (200), and a support top post (23) mounted on the base plate (21) for lifting the wafer (300); and, An air outlet (123) is provided on the support base (10); the air outlet (123) can blow dry gas to the box opening mechanism (20).

2. The rapid annealing furnace wafer cooling apparatus according to claim 1, characterized in that, There are at least three top posts (22) for opening the box. The three top posts (22) are installed on the upper surface of the base plate (21) and are arranged in a triangular spacing.

3. The rapid annealing furnace wafer cooling apparatus according to claim 2, characterized in that, There are at least three support top posts (23), which are installed on the upper surface of the base plate (21) and arranged in a triangular spacing, and the three support top posts (23) are located inside the three box-opening top posts (22).

4. The rapid annealing furnace wafer cooling apparatus according to claim 2 or 3, characterized in that, The top post (22) includes a lower post (221) installed on the base plate (21) and an upper post (222) integrally formed on the upper surface of the lower post (221). The diameter of the upper post (222) is smaller than the diameter of the lower post (221). The lower box body (2002) of the graphite box (200) is provided with a first through hole (2003) that runs through its upper and lower surfaces and is used for the insertion of the upper column (222). The diameter of the first through hole (2003) is larger than the diameter of the upper column (222) and smaller than the diameter of the lower column (221). When the graphite box (200) is fed into the box opening mechanism (20), the upper column (222) can be inserted into the first through hole (2003) from bottom to top and lift the upper box (2001), so that the lower box (2002) is supported by the lower column (221).

5. The rapid annealing furnace wafer cooling apparatus according to claim 4, characterized in that, The upper surface of the lower box body (2002) of the graphite box (200) is provided with a first receiving recess (2004) for storing a wafer (300), and the lower box body (2002) is provided with a second through hole (2005) penetrating its upper and lower surfaces in the area where the first receiving recess (2004) is located. When the support top post (23) passes through the second through hole (2005) from bottom to top, it can lift the wafer (300) in the first receiving recess (2004) and remove it from the first receiving recess (2004).

6. The rapid annealing furnace wafer cooling apparatus according to claim 1, 2, 3, or 5, characterized in that, The lower box body (2002) of the graphite box (200) has a first positioning notch (2006) on the upper edge of its upper surface, and the lower surface of the upper box body (2001) has a first positioning post (2007). After the lower box (2002) and the upper box (2001) are closed, the first positioning post (2007) can be inserted into the first positioning notch (2006).

7. The rapid annealing furnace wafer cooling apparatus according to claim 1, 2, 3, or 5, characterized in that, The carrier (10) includes a first substrate (11) and a first support plate (12) installed on the left and right sides of the first substrate (11). There are several opening mechanisms (20), and the several opening mechanisms (20) are installed on the first support plate (12) from bottom to top.

8. The rapid annealing furnace wafer cooling apparatus according to claim 7, characterized in that, A photoelectric transmitter (131) is installed on the first support plate (12) on the left side, and a photoelectric receiver (132) is installed on the first support plate (12) on the right side. The photoelectric transmitter (131) and the photoelectric receiver (132) at the same height constitute a set of detection units (13). Each box opening mechanism (20) is equipped with a set of detection units (13).

9. The rapid annealing furnace wafer cooling apparatus according to claim 8, characterized in that, The photoelectric transmitter (131) is installed on the left side of the first support plate (12) on the left side, and the photoelectric receiver (132) is installed on the right side of the first support plate (12) on the right side; The left first support plate (12) and the right first support plate (12) are both provided with photoelectric holes (121) that penetrate through their left and right sides. The light from the photoelectric transmitter (131) can pass through the photoelectric holes (121) and be received by the photoelectric receiver (132).

10. The rapid annealing furnace wafer cooling apparatus according to claim 9, characterized in that, Both the left first support plate (12) and the right first support plate (12) are equipped with protective covers (122), which can hide the detection unit (13); The air inlet (123) extends through the left and right sides of the first support plate (12) on the left and / or the first support plate (12) on the right. The air inlet (123) can be connected to the gas generating device through a pipe so as to blow dry gas to the box opening mechanism through the air inlet (123).

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