Silicon carbide ceramic carrier plate

Abstract

The utility model belongs to the technical field of ceramic carrying discs, and particularly relates to a silicon carbide ceramic carrying disc which comprises a face disc, a disc seat is arranged on the lower side of the face disc, inserting columns are fixedly arranged on the lower side of the face disc at equal intervals in a surrounding mode, inserting holes are formed in the upper side face of the disc seat corresponding to the inserting columns, the inserting columns are connected with the inserting holes in an inserted mode, and notches are evenly formed in the upper side face of the face disc in a penetrating mode. Unit groove body discs are arranged on the inner sides of the groove openings in an inserted mode. According to the technical scheme, only the unit groove body disc and the disc seat which influence the bonding effect with the wafer play a role in bearing the unit groove body disc, the surface disc plays a role in limiting the unit groove body disc, and even if the surface disc and the disc seat warp, the surface disc and the disc seat can be continuously used as long as the normal effect of the surface disc and the disc seat on the unit groove body disc is not influenced; when the unit groove body disc is warped, the bonding effect with the wafer can be influenced, only the warped unit groove body disc needs to be replaced, the unit groove body discs do not influence each other, the whole unit groove body disc does not need to be replaced, and waste is avoided.

Description

Technical Field

[0001] This utility model belongs to the field of ceramic carrier technology, specifically relating to a silicon carbide ceramic carrier. Background Technology

[0002] Silicon carbide ceramic carriers are high-performance support tools made of silicon carbide ceramic materials. They are mainly used in industrial scenarios such as semiconductor manufacturing, photovoltaic cell production, and high-temperature heat treatment. Their core function is to support wafers, solar cells, or other precision components in high-temperature, highly corrosive environments or environments requiring high cleanliness.

[0003] Silicon carbide ceramic carriers are typically disc-shaped or rectangular, with a precision-polished surface and designed with positioning grooves or vacuum adsorption holes to ensure stable workpiece fixation. During use, the carrier is placed in a high-temperature furnace, and a robotic arm or automated transfer system precisely places the wafer onto the carrier surface. The high thermal conductivity of silicon carbide enables rapid and uniform heat transfer during the process, while its acid and alkali resistance prevents corrosion from process gases. After use, surface residues are generally removed with deionized water or a specialized cleaning agent; in some cases, nitrogen purging is used to maintain cleanliness.

[0004] Silicon carbide ceramic disks primarily rely on the superior properties of their material, utilizing their high thermal conductivity to rapidly conduct heat to the wafer surface. However, due to the high-temperature baking process in the furnace, the disks tend to warp after a period of time, causing deformation of the positioning grooves and affecting the adhesion of the disks to the wafers. Currently, silicon carbide ceramic disks are generally single-layer integral structures, meaning that positioning grooves are created on a single disk. Once the disk warps, it becomes unusable and must be replaced, which is wasteful. Furthermore, the positioning grooves on current disks are generally of the same type, making it impossible to simultaneously mount wafers of different types. Utility Model Content

[0005] To address the above problems, the purpose of this utility model is to provide a silicon carbide ceramic carrier disk, which solves the problem that current silicon carbide ceramic disks are generally only single-layer integral structures, that is, positioning grooves are opened on a single disk. If the disk warps, it will be scrapped as a whole and can only be replaced, which is wasteful. In addition, the positioning grooves of current carrier disks are generally of the same type, which cannot simultaneously support different types of wafers.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a silicon carbide ceramic carrier disk, comprising a face disk, a disk base disposed on the lower side of the face disk, and insert posts fixedly disposed at equal intervals around the lower side of the face disk. Insertion holes are formed on the upper side of the disk base corresponding to the insert posts, and the insert posts are inserted into the insertion holes. A slot is uniformly and through-circumferentially disposed on the upper side of the face disk, and unit slot disks are inserted into the inner side of each slot. The unit slot disks are placed on the upper side of the disk base, and positioning grooves are formed on the upper side of each unit slot disk.

[0007] The beneficial effects of this utility model are as follows: In this technical solution, only the unit slot disk affects the bonding effect with the wafer. The disk holder only serves to support the unit slot disk, and the face disk serves to restrict the unit slot disk. Even if the face disk and disk holder warp, they can continue to be used as long as they do not affect the normal function of the unit slot disk. Only when the unit slot disk warps will it affect the bonding effect with the wafer. Only the warped unit slot disk needs to be replaced. The unit slot disks do not affect each other and there is no need to replace them as a whole, thus avoiding waste.

[0008] To increase the stability between the face plate and the base of the unit slot plate;

[0009] As a further improvement to the above technical solution: each of the upper edges of the unit groove is provided with a pressing groove, and the plate seat is pressed against the unit groove through the pressing groove.

[0010] The beneficial effect of this improvement is that it increases the stability between the face plate and the base of the unit slot plate.

[0011] To increase the heat conduction and heat dissipation effect of the tray;

[0012] As a further improvement to the above technical solution: the upper side of the disk base is uniformly provided with honeycomb holes.

[0013] The beneficial effects of this improvement are: increased heat conduction and heat dissipation of the tray.

[0014] To facilitate operation of the control panel;

[0015] As a further improvement to the above technical solution: ear blocks are symmetrically fixed on both sides of the dial.

[0016] The beneficial effect of this improvement is that it makes the control panel easier to operate.

[0017] To accommodate different types of wafers;

[0018] As a further improvement to the above technical solution: an inner ring is embedded in the inner side of each positioning groove, and a positioning hole is opened through the upper side of each inner ring. The inner diameter of the positioning hole of different inner rings is different.

[0019] The beneficial effect of this improvement is that different types of wafers can be mounted by using positioning holes with different inner diameters of different embedded rings.

[0020] To facilitate wafer removal;

[0021] As a further improvement to the above technical solution: an ear groove is provided on the inner side of both the positioning groove and the positioning hole.

[0022] The beneficial effect of this improvement is that the wafer is easier to remove through the ear slot.

[0023] The parts of the device not covered herein are the same as or can be implemented using existing technologies. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the structure of this utility model;

[0025] Figure 2 This is a schematic diagram of the structure of the faceplate in this utility model;

[0026] Figure 3 This is a schematic diagram of the structure of the plate base of this utility model;

[0027] Figure 4 This is a schematic diagram of the structure of the unit slotted disk in this utility model;

[0028] In the diagram: 1. Face plate; 101. Slot; 102. Insert post; 103. Ear block; 2. Plate base; 201. Insertion hole; 3. Unit slot plate; 301. Positioning slot; 302. Pressing slot; 303. Inset ring; 304. Positioning hole. Detailed Implementation

[0029] To enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be described in detail below with reference to the accompanying drawings. The description in this part is only exemplary and explanatory, and should not be used to limit the scope of protection of the present invention in any way.

[0030] like Figure 1 — Figure 4As shown: A silicon carbide ceramic carrier includes a faceplate 1, a carrier base 2 on the lower side of the faceplate 1, and insert posts 102 fixedly arranged equidistantly around the lower side of the faceplate 1. Insertion holes 201 are formed on the upper side of the carrier base 2 corresponding to the insert posts 102, and the insert posts 102 are inserted into the insertion holes 201. Grooves 101 are uniformly and through-shaped on the upper side of the faceplate 1, and unit grooved trays 3 are inserted into the inner sides of each groove 101. The unit grooved trays 3 are placed on the carrier base 2. On the upper side, the upper surface of the unit slot disk 3 is provided with positioning grooves 301. In this technical solution, only the unit slot disk 3 affects the bonding effect with the wafer. The disk base 2 only serves to support the unit slot disk 3, and the face disk 1 serves to restrict the unit slot disk 3. Even if the face disk 1 and the disk base 2 warp, they can continue to be used as long as it does not affect their normal function of the unit slot disk 3. Only when the unit slot disk 3 warps will it affect the bonding effect with the wafer. Only the warped unit slot disk 3 needs to be replaced. The unit slot disks 3 do not affect each other and do not need to be replaced as a whole, avoiding waste. The upper edge of the unit slot disk 3 is provided with pressing grooves 302. The disk base 2 is pressed against the unit slot disk 3 through the pressing grooves 302 to increase the stability between the face disk 1 and the disk base 2 of the unit slot disk 3. The upper side of the disk base 2 is uniformly provided with honeycomb holes to increase the heat conduction and heat dissipation effect of the disk base 2. The two sides of the face disk 1 are symmetrically fixed with Ear blocks 103 facilitate operation of the control panel 1. An inner ring 303 is embedded in the inner side of each positioning groove 301. A positioning hole 304 is opened through the upper side of each inner ring 303. The inner diameter of the positioning hole 304 of different inner rings 303 is different. Different types of wafers can be mounted through the positioning holes 304 of different inner diameters of different inner rings 303. Ear slots are opened on one side of the inner side of the positioning groove 301 and the positioning hole 304. The wafers are easily removed through the ear slots.

[0031] Working principle and usage process of this utility model:

[0032] In use, unit cell trays 3 are evenly inserted into the slots 101 of the faceplate 1. The faceplate 1 is connected to the tray base 2 via insert pins 102. The tray base 2 supports the unit cell trays 3. Wafers can be placed in the positioning slots 301 of the unit cell trays 3. After a period of time, partial warping occurs in the faceplate 1, tray base 2, and unit cell trays 3. Unlike existing integrated designs, in this technical solution, only the unit cell trays 3 affect the wafer bonding effect. The tray base 2 only serves to support the unit cell trays 3, and the faceplate 1 serves to restrict the unit cell trays 3. Even if the faceplate 1 and tray base 2 warp, they can continue to be used as long as it does not affect their normal function on the unit cell trays 3. Only when the unit cell trays 3 warp... If the warped unit slot disk 3 is not replaced, it will affect the bonding effect with the wafer. Only the warped unit slot disk 3 needs to be replaced. The unit slot disks 3 do not affect each other and do not need to be replaced as a whole, thus avoiding waste. In addition, the disk holder 2 is pressed to the unit slot disk 3 through the pressure groove 302 to increase the stability between the face disk 1 of the unit slot disk 3 and the disk holder 2. In addition, the upper side of the disk holder 2 is evenly provided with honeycomb holes to increase the heat conduction and heat dissipation effect of the disk holder 2. In addition, the face disk 1 is symmetrically fixed with ear blocks 103 on both sides for easy operation of the face disk 1. In addition, different types of wafers can be mounted through the positioning holes 304 with different inner diameters of different embedded rings 303. In addition, the inner side of the positioning groove 301 and the positioning hole 304 is provided with ear grooves to facilitate the removal of wafers.

[0033] It should be noted that, in this document, the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0034] This article uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are only for the purpose of helping to understand the method and core ideas of the present invention. The above descriptions are only preferred embodiments of the present invention. It should be noted that due to the limitations of textual expression, there are objectively infinite specific structures. For those skilled in the art, several improvements, modifications, or changes can be made without departing from the principles of the present invention, and the above technical features can also be combined in an appropriate manner. These improvements, modifications, changes, or combinations, or the direct application of the inventive concept and technical solution to other situations without modification, should all be considered within the scope of protection of the present invention.

Claims

1. A silicon carbide ceramic carrier disk, characterized in that: The device includes a faceplate (1), a base (2) is provided on the lower side of the faceplate (1), and inserts (102) are fixedly arranged around the lower side of the faceplate (1) at equal intervals. Insertion holes (201) are opened on the upper side of the base (2) corresponding to the inserts (102). The inserts (102) are inserted into the insertion holes (201). The upper side of the faceplate (1) is uniformly provided with slots (101). Unit slot plates (3) are inserted into the inner side of each slot (101). The unit slot plates (3) are placed on the upper side of the base (2). Positioning slots (301) are opened on the upper side of each unit slot plate (3).

2. The silicon carbide ceramic carrier disk according to claim 1, characterized in that: The upper edge of the unit groove plate (3) is provided with a pressing groove (302), and the plate seat (2) is pressed to the unit groove plate (3) through the pressing groove (302).

3. The silicon carbide ceramic carrier disk according to claim 1, characterized in that: The upper side of the plate base (2) is uniformly provided with honeycomb holes.

4. The silicon carbide ceramic carrier disk according to claim 1, characterized in that: Ear blocks (103) are symmetrically fixed on both sides of the faceplate (1).

5. A silicon carbide ceramic carrier disk according to claim 1, characterized in that: The inner side of each positioning groove (301) is fitted with an inner ring (303), and the upper side of each inner ring (303) is provided with a positioning hole (304). The inner diameter of the positioning hole (304) of different inner rings (303) is different.

6. The silicon carbide ceramic carrier disk according to claim 1, characterized in that: The inner side of both the positioning groove (301) and the positioning hole (304) is provided with an ear groove.

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