Rapid heat dissipation structure of MOS (Metal Oxide Semiconductor) tube

Abstract

The utility model relates to the technical field of MOS (Metal Oxide Semiconductor) tubes, and provides a quick heat dissipation structure of an MOS tube, which comprises a radiator, the MOS tube, an insulating heat-conducting fin and a PCB (Printed Circuit Board), the MOS tube is arranged at the top of the radiator, the insulating heat-conducting fin is arranged between the MOS tube and the radiator, the PCB is arranged on the upper side of the MOS tube and is connected with pins of the MOS tube, and the quick heat dissipation structure of the MOS tube further comprises a transistor seat which is arranged on the lower side of the PCB. And the transistor seat is connected to the top of the radiator through a fastener, so that the transistor seat tightly presses the MOS tube on the radiator. The quick heat dissipation structure of the MOS tube has the advantages that (1) in the quick heat dissipation structure of the MOS tube, the MOS tube, the insulating heat-conducting fin positioned below the MOS tube and the radiator are tightly attached to avoid gaps, heat dissipation resistance is reduced, heat dissipation efficiency is improved, and normal operation of a product where the MOS tube is positioned is ensured; and (2) the fastener directly acts on the transistor seat instead of the PCB, so that the fastening and pressure effects are improved. And (3) the whole structure is compact, the size is small, and the flexibility is higher.

Description

Technical Field

[0001] This utility model relates to the field of MOSFET technology, and more specifically, to a fast heat dissipation structure for MOSFETs. Background Technology

[0002] A photovoltaic (PV) inverter is a device used in a photovoltaic (PV) power generation system to convert direct current (DC) into alternating current (AC) of appropriate voltage. It can be fed back into commercial transmission systems or supplied to off-grid power grids. PV inverters are one of the important balance of systems (BOS) components in a PV array system and can be used in conjunction with general AC power supply equipment. With the continuous development of the new energy industry, the specifications of various inverters are constantly increasing, and users are increasingly demanding higher cost-effectiveness from inverters. The compact size, portability, and reliable performance of inverters are also becoming more important to users.

[0003] Photovoltaic inverters generate a significant amount of heat during operation. To ensure their proper functioning, this heat must be dissipated promptly to maintain the inverter's operating environment within a normal temperature range. However, current technology, which uses a MOSFET bonded to an insulating thermal pad, is prone to breakage during installation. Tiny air gaps between the MOSFET and the pad result in low thermal conductivity and slow heat dissipation. Furthermore, the instantaneous energy can potentially damage the insulating pad, posing a considerable risk. Consequently, the low heat dissipation efficiency necessitates increasing the weight and size of the heat sink to ensure normal operation, impacting the overall cost and weight of the device. Utility Model Content

[0004] The present invention aims to overcome at least one defect (deficiency) of the prior art and provide a fast heat dissipation structure for MOS transistors to improve heat dissipation efficiency.

[0005] The technical solution adopted by this utility model is to provide a fast heat dissipation structure for a MOSFET, including: a heat sink, a MOSFET, an insulating heat-conducting sheet, and a PCB board. The MOSFET is mounted on the top of the heat sink, the insulating heat-conducting sheet is disposed between the MOSFET and the heat sink, the PCB board is disposed on the upper side of the MOSFET and connected to its pins, and also includes a transistor socket, which is disposed on the lower side of the PCB board. The transistor socket is connected to the top of the heat sink by a fastener so that the transistor socket presses the MOSFET tightly onto the heat sink.

[0006] In this technical solution, the transistor holder pressing the MOSFET firmly onto the heat sink can be understood as applying downward pressure to the MOSFET when it is placed on the heat sink, which is considered as pressing. This prevents gaps between the MOSFET, the insulating thermal pad below it, and the heat sink, resulting in a tighter fit, reduced thermal resistance, and improved heat dissipation efficiency, thereby ensuring the normal operation of the product containing the MOSFET.

[0007] The fasteners in this solution act directly on the transistor socket, rather than on the PCB board, thereby improving the fastening and pressure effect. Furthermore, if the fasteners act on the PCB board, they may damage the PCB board when the fastening force is large. However, by acting the fasteners on the transistor socket, this solution can avoid the above problems and reduce the probability of damage while improving heat dissipation efficiency.

[0008] The transistor socket in this solution is a pressure-down structure that is at least partially located between the PCB board and the MOSFET, so that it can press down the MOSFET when it is fastened. Its position setting eliminates the need to occupy too much space in the heat dissipation structure, making the overall structure compact, small in size, and more flexible. It can be applied to a variety of scenarios and is also convenient for users to install. In addition, it is lightweight, reducing transportation costs.

[0009] In this solution, the fasteners pass through the transistor socket and act directly on the heat sink without passing through the MOSFET. The MOSFET does not require an opening, thus saving production steps, improving production efficiency, and avoiding the impact of the fasteners on the MOSFET.

[0010] Furthermore, the transistor socket includes a cover and a spring, the cover being disposed on the upper side of the spring, the spring including a fixed part and an elastic part connected together, the fastener passing through the cover and the fixed part in sequence to connect the transistor socket to the top of the heat sink, so that the elastic part presses the MOSFET tightly onto the heat sink.

[0011] In this technical solution, the cover and the spring can be integrally connected or detachably connected. When the fastener secures the transistor holder to the heat sink, the fixing part is subjected to downward pressure, and the elastic part is pressed downward due to deformation, thereby applying a downward force to the MOSFET, pressing the MOSFET tightly onto the insulating heat-conducting plate. The fixing part and the elastic part are preferably integrally connected; the fixing part can have different shapes, as long as it can cooperate with the fastener to secure the transistor holder to the heat sink.

[0012] Furthermore, the cover is provided with a protruding ring, which extends through the PCB board to the upper side of the PCB board, and the cover is connected to the PCB board through the protruding ring; the cover is connected to the spring contact.

[0013] In this technical solution, the PCB board is provided with a connection hole corresponding to the raised ring, so that the raised ring can pass through the connection hole and extend to the upper side of the PCB board. The connection between the cover and the PCB board allows the cover to be pressed down under the action of fasteners, which can drive the PCB board to be pressed down synchronously. This avoids the connection between the pins of the MOSFET and the PCB board being affected by the downward movement of the MOSFET, and at the same time, it can make the overall structure more compact and improve the overall stability.

[0014] The convex ring is a ring-shaped structure with a central hollow core. Both the cover and the fixing part have through holes that match the fasteners, and the fasteners pass through the through holes for fastening. The hollow area of ​​the convex ring corresponds to the through holes, thus providing operating space for the fasteners to be tightened. This ensures that the fastening is not affected when the cover is connected to the PCB board.

[0015] Furthermore, the outer wall of the convex ring is provided with at least one protrusion, and the PCB board is provided with a recess, the protrusion and the recess are matched to make the convex ring snap into the PCB board; the upper side of the protrusion is provided with a chamfer to form a guide surface.

[0016] In this technical solution, the connection method using the interlocking of the protrusion and concave is simple to operate, eliminating the need for additional connecting structures and improving production efficiency. The chamfered design saves on materials and reduces production costs. Furthermore, the guide surface acts as a guide when the protruding ring is interlocked with the PCB board, reducing the difficulty of aligning the protruding ring with the connecting holes on the PCB board, thereby further improving production efficiency.

[0017] Furthermore, the cover covers the fixing portion and at least a portion of the elastic portion. The cover covers the fixing portion and extends in the direction of the elastic portion; preferably, the cover completely covers the entire spring.

[0018] Furthermore, the front and rear sides of the cover are provided with extended vertical plates, the bottom of which abuts against the insulating heat-conducting sheet.

[0019] In this technical solution, the extended vertical plate is preferably located on the side of the cover away from the convex ring, and its bottom is completely in contact with the insulating heat-conducting sheet. When the fastener is tightened and the transistor seat is pressed down, the extended vertical plate also exerts a downward pressing force on the insulating heat-conducting sheet, making it fit more tightly with the heat sink and further improving the heat dissipation efficiency.

[0020] Furthermore, the fixing part includes a fixing plate and a support plate. One end of the fixing plate is connected to the elastic part, and the other end is connected to the support plate. The bottom of the support plate abuts against the heat sink. The fastener passes through the cover and the fixing part in sequence to connect the transistor seat to the top of the heat sink.

[0021] In this technical solution, both the fixing plate and the heat sink are provided with through holes corresponding to the fasteners. The fasteners pass through the through holes of the fixing part and the heat sink in sequence for fastening. For example, the fixing plate and the support plate are connected to form an "L"-shaped structure. Compared with the support plate being inclined to the fixing plate, the fixing part structure of this solution has better stability, and the fasteners are not easy to break when pressed downward.

[0022] Furthermore, the elasticity includes a slant, one end of which is connected to a fixing part, and the other end is integrally connected to an extension piece. The slant gradually slopes downward from the end near the fixing part to the end away from the fixing piece, and abuts against the MOS transistor through the extension piece.

[0023] In this technical solution, the inclined plate is a resilient structure, and the extension plate is a horizontally arranged structure. By setting the extension plate, the contact area between the spring and the MOSFET is increased. When the spring is pressed down under the fastening action, only a small fastening force is needed to press the spring onto the MOSFET, thus achieving a labor-saving effect.

[0024] Furthermore, the extension length of the extension piece is 1 / 6 to 1 / 3 of the length of the oblique piece.

[0025] In this technical solution, the appropriate ratio between the extension length of the extension plate and the length of the bevel plate ensures that the bevel plate has a proper springback effect while also providing a large contact area between the extension plate and the MOSFET, thus ensuring a labor-saving effect.

[0026] Furthermore, the top of the radiator is provided with a positioning groove, and the insulating heat-conducting sheet is disposed in the positioning groove.

[0027] In this technical solution, the positioning groove can prevent the insulating heat-conducting sheet from shifting, thereby further ensuring effective heat dissipation.

[0028] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0029] (1) In the MOS transistor rapid heat dissipation structure of this utility model, the MOS transistor, the insulating heat-conducting plate below it and the heat sink are in close contact to avoid the generation of gaps, reduce heat dissipation thermal resistance, improve heat dissipation efficiency, and thus ensure the normal operation of the product containing the MOS transistor.

[0030] (2) The fastener of this utility model acts directly on the transistor socket, rather than on the PCB board, thereby improving the fastening and pressure effect; and if the fastener acts on the PCB board, it may damage the PCB board when the fastening force is large. However, this solution can avoid the above problems by acting the fastener on the transistor socket, thereby reducing the probability of damage while improving heat dissipation efficiency.

[0031] (3) The transistor socket position setting of this utility model eliminates the need to occupy too much space of the heat dissipation structure. The overall structure is compact, small in size, and more flexible, making it suitable for a wide range of scenarios and easy for users to install. It is also lightweight, reducing transportation costs.

[0032] (4) The fastener of this utility model acts directly on the heat sink after passing through the transistor base, without passing through the MOS transistor. The MOS transistor does not need to be drilled, thus saving production and processing steps, improving production efficiency, and avoiding the influence of the fastener on the MOS transistor. Attached Figure Description

[0033] Figure 1 This is a schematic diagram of the overall structure of the MOS transistor rapid heat dissipation structure of this utility model.

[0034] Figure 2 This is a cross-sectional view of the MOS transistor rapid heat dissipation structure of this utility model.

[0035] Figure 3 This is an exploded view of the structure of the novel transistor socket used in this invention.

[0036] Reference numerals: 100 heat sink, 200 MOSFET, 300 insulating heat-conducting sheet, 400 PCB board, 500 transistor socket, 600 cover, 610 protruding ring, 611 protrusion, 612 guide surface, 620 extension vertical plate, 700 spring sheet, 710 fixing part, 711 fixing plate, 712 support plate, 720 elastic part, 721 inclined plate, 722 extension plate, 800 positioning groove, 900 fastener. Detailed Implementation

[0037] The accompanying drawings are for illustrative purposes only and should not be construed as limiting the scope of this invention. To better illustrate the following embodiments, some components in the drawings may be omitted, enlarged, or reduced, and do not represent the actual dimensions of the product; it is understandable to those skilled in the art that some well-known structures and their descriptions may be omitted in the drawings.

[0038] Example 1

[0039] Combination Figures 1 to 3 This embodiment provides a rapid heat dissipation structure for a MOSFET, including: a heat sink 100, a MOSFET 200, an insulating heat-conducting sheet 300, and a PCB board 400. The MOSFET 200 is mounted on the top of the heat sink 100, the insulating heat-conducting sheet 300 is disposed between the MOSFET 200 and the heat sink 100, the PCB board 400 is disposed on the upper side of the MOSFET 200 and connected to its pins, and also includes a transistor socket 500, which is disposed on the lower side of the PCB board 400. The transistor socket 500 is connected to the top of the heat sink 100 by a fastener 900 so that the transistor socket 500 presses the MOSFET 200 tightly onto the heat sink 100.

[0040] For example, the pins of the MOSFET 200 are bent upwards at 90° and pass through the PCB board 400. The insulating heat-conducting sheet 300 is an alumina ceramic sheet with a thermal conductivity of 28 W / mK, far exceeding the thermal conductivity of thermally conductive silicone cloth, further improving the thermal conductivity efficiency. The fastener 900 is an M3*14 round head combination screw.

[0041] The transistor holder 500 includes a cover 600 and a spring 700, wherein the cover 600 is disposed on the upper side of the spring 700.

[0042] Includes a fixed part 710 and an elastic part 720 connected together.

[0043] The fastener 900 passes sequentially through the cover 600 and the fixing part 710 to connect the transistor holder 500 to the top of the heat sink 100, so that the elastic part 720 presses the MOSFET 200 tightly onto the heat sink 100. For example, the cover 600 is made of insulating plastic, and the spring 700 is made of high-strength stainless steel.

[0044] The cover 600 is provided with a protruding ring 610, which extends through the PCB board 400 to the upper side of the PCB board 400. The cover 600 is connected to the PCB board 400 through the protruding ring 610. The cover 600 is connected to the spring piece 700. For example, the protruding ring 610 is provided on one side of the top of the cover 600. The outer wall of the protruding ring is provided with at least one protrusion 611, and the PCB board 400 is provided with a recess. The protrusion 611 matches the recess so that the protruding ring 610 is engaged with the PCB board 400. The upper side of the protrusion 611 is provided with a chamfer to form a guide surface 612.

[0045] Specifically, the PCB board 400 is provided with a connection hole corresponding to the protruding ring 610, so that the protruding ring 610 can extend through the connection hole to the upper side of the PCB board 400. The connection between the cover 600 and the PCB board 400 allows the cover 600 to drive the PCB board 400 to press down synchronously when it is pressed down by the fastener 900. This avoids the connection between the pins of the MOSFET 200 and the PCB board 400 being affected by the downward movement of the MOSFET 200, and at the same time, it makes the overall structure more compact and improves the overall stability.

[0046] Specifically, the convex ring 610 is a ring-shaped structure with a central hollow section. Both the cover 600 and the fixing part 710 are provided with through holes that match the fastener 900, and the fastener 900 passes through the through holes for fastening. The hollow area of ​​the convex ring 610 corresponds to the through hole, thereby providing operating space for the fastener 900 to be fastened. This ensures that the fastening is not affected when the cover 600 is connected to the PCB board 400.

[0047] The cover 600 covers the fixing part 710 and at least partially covers the elastic part 720. The cover 600 covers the fixing part 710 and extends in the direction of the elastic part 720. Preferably, the cover 600 completely covers the entire spring sheet 700. The front and rear sides of the cover 600 are provided with extending vertical plates 620, and the bottom of the extending vertical plates 620 abuts against the insulating heat-conducting sheet 300.

[0048] Specifically, the extended vertical plate 620 is preferably located on the side of the cover 600 away from the protruding ring 610, and its bottom is completely in contact with the insulating heat-conducting sheet 300. When the fastener 900 is tightened and the transistor seat 500 is pressed downward, the extended vertical plate 620 also exerts a downward pressing force on the insulating heat-conducting sheet 300, making it more closely attached to the heat sink 100, thereby further improving the heat dissipation efficiency.

[0049] The fixing part 710 includes a fixing plate 711 and a support plate 712. One end of the fixing plate 711 is connected to the elastic part 720, and the other end is connected to the support plate 712. The bottom of the support plate 712 abuts against the heat sink 100. The fastener 900 passes through the cover 600 and the fixing part 710 in sequence to connect the transistor holder 500 to the top of the heat sink 100. The elastic part includes a wedge 721. One end of the wedge 721 is connected to the fixing part 710, and the other end is integrally connected to an extension piece 722. The wedge 721 gradually slopes downward from the end near the fixing part 710 to the end away from the fixing piece, and abuts against the MOSFET 200 through the extension piece 722. The extension length of the extension piece 722 is 1 / 6 to 1 / 3 of the length of the wedge 721, for example, 1 / 5 or 1 / 4.

[0050] Specifically, both the fixing plate 711 and the heat sink 100 are provided with through holes corresponding to the fasteners 900. The fasteners 900 pass through the through holes of the fixing part 710 and the heat sink 100 in sequence for fastening. For example, the fixing plate 711 and the support plate 712 are connected to form an "L"-shaped structure. Compared with the support plate 712 being inclined to the fixing plate 711, the fixing part 710 structure of this solution has better stability, and the fasteners 900 are not easy to break when pressed downward.

[0051] The heat sink 100 has a positioning groove 800 on its top, and the insulating heat-conducting sheet 300 is disposed within the positioning groove 800. The positioning groove 800 prevents the insulating heat-conducting sheet 300 from shifting, thereby further ensuring effective heat dissipation. The insulating heat-conducting sheet 300 has a thermal paste layer on both its upper and lower sides, and the thickness of the thermal paste layer is 0.08–0.2 mm, for example, 0.1 mm or 0.15 mm. The thermal paste is applied to the remaining two sides of the insulating heat-conducting layer to form a thermal paste layer, which further squeezes out air from the gaps, improving heat dissipation efficiency.

[0052] The transistor socket pressing the MOSFET 200 firmly onto the heat sink can be understood as applying downward pressure to the MOSFET 200 when it is placed on the heat sink. This prevents gaps between the MOSFET 200, the insulating thermally conductive plate 300 below it, and the heat sink 100, resulting in a tighter fit, reduced thermal resistance, and improved heat dissipation efficiency, thus ensuring the normal operation of the product containing the MOSFET.

[0053] In this embodiment, the fastener 900 acts directly on the transistor socket 500 instead of the PCB board 400, thereby improving the fastening and pressure effect. Furthermore, if the fastener 900 were to act on the PCB board 400, it might damage the PCB board when the fastening force is too large. However, by acting the fastener 900 on the transistor socket 500 in this solution, the above problem can be avoided, and the probability of damage can be reduced while improving heat dissipation efficiency.

[0054] In this embodiment, the transistor socket 500 is at least partially disposed between the PCB board 400 and the MOSFET 200 as a pressure structure, so that it can press down the MOSFET 200 when it is fastened. Its position setting eliminates the need to occupy too much space in the heat dissipation structure, making the overall structure compact, small in size, and more flexible. It can be applied to a variety of scenarios and is also convenient for users to install. In addition, it is lightweight, reducing transportation costs.

[0055] In this embodiment, the fastener 900 passes through the transistor holder 500 and acts directly on the heat sink 100 without passing through the MOSFET 200. The MOSFET 200 does not need to be drilled, thus saving production and processing steps, improving production efficiency, and avoiding the impact of the fastener on the MOSFET 200.

[0056] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the technical solution of this utility model, and are not intended to limit the specific implementation of this utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the claims of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A MOSFET rapid heat dissipation structure, comprising: The device comprises a heat sink, a MOSFET, an insulating heat-conducting sheet, and a PCB board. The MOSFET is mounted on the top of the heat sink, the insulating heat-conducting sheet is located between the MOSFET and the heat sink, and the PCB board is located on the upper side of the MOSFET and connected to its pins. The device is characterized by further comprising a transistor socket located on the lower side of the PCB board. The transistor socket is connected to the top of the heat sink by a fastener so that the transistor socket presses the MOSFET tightly against the heat sink. The transistor socket includes a cover and a spring. The cover is located on the upper side of the spring. The spring includes a fixed part and an elastic part connected together. The fastener passes through the cover and the fixed part in sequence to connect the transistor socket to the top of the heat sink, so that the elastic part presses the MOSFET tightly onto the heat sink. The front and rear sides of the cover are provided with extended vertical plates, and the bottom of the extended vertical plates abuts against the insulating heat-conducting sheet. The fixing part includes a fixing plate and a support plate. One end of the fixing plate is connected to the elastic part, and the other end is connected to the support plate. The bottom of the support plate abuts against the heat sink. The fastener passes through the cover and the fixing part in sequence to connect the transistor seat to the top of the heat sink.

2. The MOS tube rapid heat dissipation structure according to claim 1, wherein, The cover is provided with a protruding ring, which passes through the PCB board and extends to the upper side of the PCB board. The cover is connected to the PCB board through the protruding ring. The cover is connected to the spring contact.

3. The MOSFET rapid heat dissipation structure of claim 2, wherein, The outer wall of the convex ring is provided with at least one convex part, and the PCB board is provided with a recess. The convex part matches the recess so that the convex ring is snapped into the PCB board. The upper side of the convex part is provided with a chamfer to form a guide surface.

4. The MOSFET rapid heat dissipation structure of claim 2, wherein, The cover covers the fixed part and at least part of the elastic part.

5. The MOSFET rapid heat dissipation structure of claim 2, wherein, The elastic part includes a slanted plate, one end of which is connected to a fixed part, and the other end is integrally connected to an extension plate. The slanted plate gradually slopes downward from the end near the fixed part to the end away from the fixed part, and abuts against the MOS transistor through the extension plate.

6. The MOS tube rapid heat dissipation structure according to claim 5, wherein, The extension length of the extension piece is 1 / 6 to 1 / 3 of the length of the oblique piece.

7. The MOS transistor rapid heat dissipation structure according to any one of claims 1-6, characterized in that, The top of the radiator is provided with a positioning groove, and the insulating heat-conducting sheet is disposed in the positioning groove.

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