Semiconductor packaging structure capable of improving welding fastness and uniformity

Abstract

The utility model belongs to the field of semiconductor manufacturing, and particularly relates to a semiconductor packaging structure capable of improving welding fastness and uniformity, the semiconductor packaging structure comprises a chip, and a first electrode plate and a second electrode plate which are respectively arranged at two sides of the chip, the first electrode plate comprises a welding part and a connecting part, the welding part is provided with a boss facing the chip, and the connecting part is provided with a boss facing the chip. The surface, facing the chip, of the boss is provided with a groove, and the welding part is provided with at least two steps on the two sides of the boss. By means of the groove formed in the boss of the welding part of the first electrode plate, welding flux can enter the groove during tin soldering, welding is firmer, desoldering is avoided, and the service life is prolonged. In addition, the steps are arranged on the two sides of the boss, tin materials can be promoted to be evenly distributed between the welding part and the chip during welding, the boss can be fully welded to the chip, and due to the arrangement of the grooves and the steps, the conditions such as pseudo soldering caused by air hidden in the tin materials between the boss and the chip during welding can be avoided.

Description

Technical Field

[0001] This application belongs to the field of semiconductor manufacturing, and in particular relates to a semiconductor packaging structure that can improve solder joint strength and uniformity. Background Technology

[0002] Semiconductor packaging typically involves soldering a chip onto a surface mount electrode using solder paste, followed by encapsulation with epoxy resin. However, issues such as poor soldering often occur during the soldering process, resulting in gaps between the chip surface and the surface mount electrode. This leads to weak soldering, which can cause the chip to detach easily over time, resulting in a shorter lifespan. Utility Model Content

[0003] To address the technical problem of weak welding in existing technologies, this application provides a semiconductor packaging structure that can improve welding strength and uniformity.

[0004] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is a semiconductor packaging structure that can improve the welding strength and uniformity, including a chip and a first electrode plate and a second electrode plate respectively disposed on both sides of the chip. The first electrode plate includes a welding part and a connecting part. The welding part is provided with a boss facing the chip. The surface of the boss facing the chip is provided with a groove. The welding part is provided with at least two steps on both sides of the boss.

[0005] In some embodiments, the groove is a countersunk hole structure.

[0006] In some embodiments, the groove is a through slot that passes through the boss.

[0007] In some embodiments, the boss is formed by a recess in the welded portion.

[0008] In some embodiments, the number of grooves is multiple.

[0009] In some embodiments, the welded portion is bent at both sides of the boss to form the step.

[0010] In some embodiments, the first electrode sheet further includes a first pin, and a receiving groove is provided at one end of the first pin near the connecting portion, and one end of the first connecting portion is inserted into the receiving groove.

[0011] Beneficial effects: This utility model, by providing a groove on the boss of the first electrode welding part, allows solder to enter the groove during soldering, thereby making the weld stronger, preventing desoldering, and improving service life. In addition, this application also provides steps on both sides of the boss, which can promote the even distribution of solder between the welding part and the chip during soldering, enabling the boss to be fully soldered onto the chip. The groove and steps can prevent air trapped in the solder between the boss and the chip during soldering, resulting in poor solder joints. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the semiconductor packaging structure of this utility model;

[0013] Figure 2 This is a schematic diagram of another semiconductor packaging structure of the present invention;

[0014] In the figure, 1. Packaging layer, 2. Chip, 31. Soldering part, 311. Boss, 312. Step, 313. Groove, 32. Connecting part, 33. First pin, 4. Second electrode plate. Detailed Implementation

[0015] The present application will be further described below with reference to specific embodiments. Obviously, the described embodiments are only a part of the embodiments of the present application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present application without making creative changes are within the protection scope of the present application.

[0016] The solution adopted in this application is as follows: Figure 1 and 2 As shown, a semiconductor packaging structure that improves solder joint strength and uniformity includes a chip 2 and a first electrode plate and a second electrode plate 4 respectively disposed on both sides of the chip 2. The first electrode plate includes a soldering portion 31 and a connecting portion 32. The soldering portion 31 is provided with a boss 311 facing the chip 2, and a groove 313 is provided on the surface of the boss 311 facing the chip 2. The soldering portion 31 has at least two steps 312 on both sides of the boss 311. The soldering portion 31 and the connecting portion 32 are configured as an integral structure. The structure of the boss 311 and the steps 312 is formed in the soldering portion 31. The connecting portion 32 is bent to connect with the pins. The packaging layer 1 is encapsulated outside the semiconductor, only exposing the pin structure for easy connection with other circuits.

[0017] When the chip 2 is soldered to the first electrode sheet, the air trapped in the solder can be discharged into the groove 313 or through the step 312, thereby making the solder evenly distributed in the soldering part 31 of the first electrode sheet. At the same time, it ensures that the boss 311 can be fully soldered, avoiding the situation of cold solder joint. In addition, the solder enters the groove 313 during the soldering process, ensuring the strength of the solder joint, avoiding desoldering, and improving the service life.

[0018] like Figure 1 As shown in one embodiment, the groove 313 is a countersunk hole structure. After the solder enters the countersunk hole and solidifies, it forms an insertion structure, which improves the welding strength.

[0019] like Figure 2 As shown in another embodiment, the groove 313 is a through groove that passes through the boss 311. During soldering, the solder enters the groove 313 and is squeezed out from the upper end of the groove 313. After the solder solidifies, it forms a riveting-like structure, which is more conducive to avoiding desoldering and further improving the firmness.

[0020] like Figure 1 and 2 As shown, more specifically, in some embodiments, the number of grooves 313 is set to multiple, and the multiple grooves 313 can be evenly distributed on the boss 311 to improve the bonding strength between the entire surface of the boss 311 and the chip 2.

[0021] In some embodiments, the boss 311 is formed by a recess in the welding portion 31, and the welding portion 31 is bent at both sides of the boss 311 to form the step 312. Specifically, the structure of the boss 311, the groove 313, and the step 312 of the first electrode sheet can be manufactured by a stamping process.

[0022] like Figure 1 and 2 As shown, in some embodiments, the first electrode sheet further includes a first pin 33, with a receiving groove provided at one end of the first pin 33 near the connecting portion 32, and one end of the first connecting portion 32 inserted into the receiving groove. Setting the connecting portion 32 and the first pin 33 of the first electrode sheet as separate structures helps to release and reduce stress generated during the packaging process, avoiding excessive pressure from the first electrode sheet on the chip 2 and damage to the chip 2. The second electrode sheet 4 can be an integrated structure.

[0023] While the disclosure is as stated above, its scope of protection is not limited thereto. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of this disclosure, and all such changes and modifications will fall within the scope of protection of this application.

Claims

1. A semiconductor packaging structure that improves solder joint strength and uniformity, characterized in that, The chip (2) includes a first electrode plate and a second electrode plate (4) respectively disposed on both sides of the chip (2). The first electrode plate includes a welding part (31) and a connecting part (32). The welding part (31) is provided with a boss (311) facing the chip (2). The surface of the boss (311) facing the chip (2) is provided with a groove (313). The welding part (31) is provided with at least two steps (312) on both sides of the boss (311).

2. The semiconductor package structure capable of improving the welding firmness and uniformity according to claim 1, wherein, The groove (313) is a countersunk hole structure.

3. The semiconductor package structure capable of improving the welding firmness and uniformity according to claim 1, wherein, The groove (313) is a through groove that passes through the boss (311).

4. The semiconductor package structure capable of improving the welding firmness and uniformity according to claim 1, wherein, The boss (311) is formed by the recess of the welded part (31).

5. The semiconductor package structure with improved soldering reliability and uniformity according to any one of claims 1-4, wherein, The number of grooves (313) is multiple.

6. The semiconductor package structure capable of improving the welding firmness and uniformity according to any one of claims 1-4, wherein, The welded portion (31) is bent on both sides of the boss (311) to form the step (312).

7. The semiconductor package structure capable of improving the welding firmness and uniformity according to claim 1, wherein, The first electrode plate also includes a first pin (33), and a receiving groove is provided at one end of the first pin (33) near the connecting part (32), and one end of the connecting part (32) is inserted into the receiving groove.

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