Semiconductor diamond cutting disc structure capable of rapidly cooling

Abstract

The utility model provides a semiconductor diamond cutting disc structure capable of rapidly cooling, and relates to the technical field of diamond cutting discs, the semiconductor diamond cutting disc structure comprises a connecting disc, a diamond cutting disc body is arranged on one side of the connecting disc, and a plurality of heat conduction grooves are formed in the upper portion of the diamond cutting disc body; the diamond cutting disc body and the heat dissipation disc are installed above the connecting disc through the fixing bolts, the connecting disc is fixed above the driving motor, in order to achieve rapid cooling, the unique heat conduction grooves are formed in the upper portion of the diamond cutting disc body, and the heat conduction grooves are evenly distributed in a radial mode and extend from the center of the disc body to the edge. The number of the heat conduction grooves is set according to the size of the disc body, the heat conduction grooves can guarantee efficient heat conduction without affecting the structural strength of the disc body, the groove walls are finely polished to reduce heat resistance, heat generated in the cutting process can be rapidly conducted to the surface of the disc body along the heat conduction grooves, and favorable conditions are created for follow-up heat dissipation.

Description

Technical Field

[0001] This utility model relates to the field of diamond cutting disc technology, and in particular to a semiconductor diamond cutting disc structure that can be rapidly cooled. Background Technology

[0002] In semiconductor manufacturing, diamond dicing discs are commonly used cutting tools to cut semiconductor wafers and other materials into specific sizes and shapes. However, during the cutting process, the high-speed friction between the dicing disc and the semiconductor material generates a large amount of heat. If this heat cannot be dissipated in time, the temperature of the dicing disc will rise sharply, leading to a series of problems.

[0003] On the one hand, high temperatures accelerate the wear of diamond cutting discs, reducing their lifespan and increasing production costs. On the other hand, excessively high temperatures transferred to semiconductor materials may cause thermal deformation, affecting their internal crystal structure and electrical properties, leading to a decline in the quality of the cut semiconductor devices and a lower yield. Traditional diamond cutting discs have significant shortcomings in heat dissipation design, relying mostly on natural air cooling or simple water cooling, resulting in low heat dissipation efficiency and failing to meet the stringent requirements for rapid cooling during semiconductor cutting. Therefore, developing a semiconductor diamond cutting disc structure with efficient heat dissipation and rapid cooling capability is of significant practical importance; thus, we propose a semiconductor diamond cutting disc structure capable of rapid cooling. Utility Model Content

[0004] In view of this, this application provides a semiconductor diamond cutting disc structure that can be rapidly cooled, which solves the above technical problems to some extent.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A semiconductor diamond cutting disc structure capable of rapid cooling includes a connecting disc, a diamond cutting disc body disposed on one side of the connecting disc, multiple heat-conducting grooves formed on the upper part of the diamond cutting disc body, a heat sink disposed on one side of the diamond cutting disc body, a bearing fixedly installed on the inner wall of one side of the heat sink, a movable shaft fixedly installed on the inner side of the bearing, multiple heat dissipation impellers fixedly installed on the outer side of the movable shaft, and multiple heat-conducting columns fixedly installed on the front side of the diamond cutting disc body, one end of each heat-conducting column being fixedly connected to the outer side of the heat sink.

[0007] Preferably, multiple threaded holes are provided on the top of the connecting plate, the diamond cutting disc body, and the heat sink, and the diamond cutting disc body and the heat sink are bolted on the top of the connecting plate.

[0008] Preferably, the diamond cutting disc body includes a carbon fiber reinforcement layer, a tungsten carbide alloy liner, a boron fiber reinforced composite material layer, a high-strength alloy steel inner layer, and a copper-molybdenum alloy thermal conductive layer. The tungsten carbide alloy liner is fixedly connected to one side of the diamond cutting disc body, the tungsten carbide alloy liner is fixedly connected to one side of the carbon fiber reinforcement layer, the boron fiber reinforced composite material layer is fixedly connected to one side of the tungsten carbide alloy liner, the high-strength alloy steel inner layer is fixedly connected to one side of the boron fiber reinforced composite material layer, and the copper-molybdenum alloy thermal conductive layer is fixedly connected to one side of the high-strength alloy steel inner layer.

[0009] Preferably, the heat sink includes a nano-silver coating, which is fixedly connected to the inner side of the heat sink.

[0010] Preferably, the carbon fiber reinforcing layer is made of carbon fiber, and the tungsten carbide alloy liner is made of tungsten carbide alloy.

[0011] Preferably, the boron fiber reinforced composite material layer is made of boron fiber, the high-strength alloy steel inner layer is made of alloy steel, and the copper-molybdenum alloy thermal conductive layer is made of copper-molybdenum alloy.

[0012] Preferably, the nano-silver coating is made of silver.

[0013] Preferably, the heat dissipation impeller is made of aluminum alloy and has a streamlined shape.

[0014] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0015] (1) A semiconductor diamond cutting disc structure that can quickly cool down is provided in this utility model. The diamond cutting disc body and the heat sink are installed on the top of the connecting disc by fixing bolts, and the connecting disc is fixed on the top of the drive motor. In order to achieve rapid cooling, a unique heat conduction groove is opened on the top of the diamond cutting disc body. The heat conduction groove is evenly distributed radially and extends from the center of the disc body to the edge. The number is set according to the size of the disc body. The heat conduction groove can ensure efficient heat conduction without affecting the structural strength of the disc body. The groove wall is finely polished to reduce thermal resistance, so that the heat generated during the cutting process can be quickly conducted to the surface of the disc body along the heat conduction groove, creating favorable conditions for subsequent heat dissipation.

[0016] (2) The present invention provides a semiconductor diamond cutting disc structure that can be rapidly cooled. The nano-silver coating is directly attached to the surface of the diamond cutting disc body. The nano-silver has ultra-high thermal conductivity, which can quickly absorb the heat conducted by the disc body through the heat conduction groove and rapidly diffuse the heat. Its nano-scale particle structure increases the heat dissipation surface area and improves the heat dissipation efficiency. It is also chemically stable and will not react with semiconductor materials or other substances in the cutting process. It can quickly absorb the heat conducted by the diamond cutting disc body to the heat dissipation disc and rapidly conduct the heat along the heat dissipation disc.

[0017] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0018] Figure 1 This is a three-dimensional structural diagram of a semiconductor diamond cutting disk structure that can be rapidly cooled, as proposed in this utility model.

[0019] Figure 2 This diagram shows a three-dimensional view of the rear portion of a semiconductor diamond cutting disk structure capable of rapid cooling according to an embodiment of this application.

[0020] Figure 3 A schematic diagram of a three-dimensional view of the exploded portion structure of a rapidly cooling semiconductor diamond cutting disk structure according to an embodiment of this application is shown.

[0021] Figure 4 This is a schematic diagram showing a partial three-dimensional view of a semiconductor diamond cutting disk structure capable of rapid cooling according to an embodiment of this application.

[0022] Figure label:

[0023] 1. Connecting disc; 2. Diamond cutting disc body; 3. Heat conduction groove; 4. Heat sink; 5. Bearing; 6. Movable shaft; 7. Heat dissipation impeller; 8. Heat conduction column; 9. Connecting threaded hole; 10. Carbon fiber reinforcement layer; 11. Tungsten carbide alloy liner; 12. Boron fiber reinforced composite material layer; 13. High-strength alloy steel inner layer; 14. Copper-molybdenum alloy heat conduction layer; 15. Nano silver coating. Detailed Implementation

[0024] To further understand the invention content, features and effects of this utility model, the following embodiments are provided, and detailed descriptions are given below in conjunction with the accompanying drawings;

[0025] The structure of this utility model will now be described in detail with reference to the accompanying drawings.

[0026] refer to Figure 1-4A semiconductor diamond cutting disc structure capable of rapid cooling includes a connecting disc 1, a diamond cutting disc body 2 disposed on one side of the connecting disc 1, multiple heat-conducting grooves 3 formed on the upper part of the diamond cutting disc body 2, a heat sink 4 disposed on one side of the diamond cutting disc body 2, a bearing 5 fixedly installed on the inner wall of one side of the heat sink 4, a movable shaft 6 fixedly installed on the inner side of the bearing 5, multiple heat dissipation impellers 7 fixedly installed on the outer side of the movable shaft 6, and multiple heat-conducting columns 8 fixedly installed on the front side of the diamond cutting disc body 2, with one end of the heat-conducting column 8 fixedly connected to the outer side of the heat sink 4.

[0027] In this embodiment, multiple threaded holes 9 are provided on the top of the connecting disk 1, the diamond cutting disk body 2, and the heat sink 4. The diamond cutting disk body 2 and the heat sink 4 are bolted on the top of the connecting disk 1.

[0028] In this embodiment, the diamond cutting disc body 2 includes a carbon fiber reinforced layer 10, a tungsten carbide alloy liner 11, a boron fiber reinforced composite material layer 12, a high-strength alloy steel inner layer 13, and a copper-molybdenum alloy thermal conductive layer 14. The tungsten carbide alloy liner 11 is fixedly connected to one side of the diamond cutting disc body 2, the tungsten carbide alloy liner 11 is fixedly connected to one side of the carbon fiber reinforced layer 10, the boron fiber reinforced composite material layer 12 is fixedly connected to one side of the tungsten carbide alloy liner 11, the high-strength alloy steel inner layer 13 is fixedly connected to one side of the boron fiber reinforced composite material layer 12, and the copper-molybdenum alloy thermal conductive layer 14 is fixedly connected to one side of the high-strength alloy steel inner layer 13.

[0029] In this embodiment, the heat sink 4 includes a nano silver coating 15, which is fixedly connected to the inner side of the heat sink 4.

[0030] In this embodiment, the carbon fiber reinforcement layer 10 is made of carbon fiber, and the tungsten carbide alloy liner 11 is made of tungsten carbide alloy. The carbon fiber reinforcement layer 10 is attached to the disk body near the center. Carbon fiber has an extremely high strength-to-weight ratio, which can significantly enhance the overall mechanical strength of the disk body, resist the strong centrifugal force and mechanical stress generated during the cutting process, and prevent the disk body from deforming or breaking. It is tightly bonded to the disk body through a special resin adhesive, ensuring stability under high-speed rotation and high-load cutting environments.

[0031] The tungsten carbide alloy liner 11 is laid adjacent to the carbon fiber reinforcement layer. The tungsten carbide alloy has excellent hardness and wear resistance, which further improves the structural strength and durability of the disc. During the cutting process, it can effectively resist wear caused by friction and extend the service life of the disc. It works synergistically with the carbon fiber reinforcement layer to enhance the overall performance of the disc.

[0032] In this embodiment, the boron fiber reinforced composite material layer 12 is made of boron fiber, the high-strength alloy steel inner layer 13 is made of alloy steel, and the copper-molybdenum alloy thermal conductive layer 14 is made of copper-molybdenum alloy. The boron fiber reinforced composite material layer 12 is added in the middle region of the disk. Boron fiber has the characteristics of high strength and high modulus. After being combined with the composite material matrix, it can provide good structural support for the disk and enhance the stability of the disk under complex stress environment. It further optimizes the mechanical properties of the disk and ensures the reliability of the cutting process.

[0033] A high-strength alloy steel inner layer 13 is set near the edge of the disc body; the alloy steel has high strength and toughness, which can withstand the huge stress transmitted by the cutting blade during operation, while protecting the internal heat dissipation structure and other functional layers; providing a solid structural foundation for the disc body;

[0034] A copper-molybdenum alloy thermal conductive layer 14 is placed on top of the four reinforcing layers mentioned above. Copper has excellent thermal conductivity, while molybdenum can improve the high-temperature strength and creep resistance of the alloy. This alloy layer can quickly and evenly distribute the heat conducted from the inside of the disk through the heat conduction grooves and rapidly transfer it to the heat dissipation material layer above, thereby improving the heat conduction efficiency and effectively enhancing the heat dissipation performance of the disk.

[0035] In this embodiment, the nano-silver coating 15 is made of silver. The nano-silver coating 15 is directly attached to the surface of the diamond cutting disc body 2. Nano-silver has ultra-high thermal conductivity, which can quickly absorb the heat conducted from the disc through the heat conduction groove and rapidly diffuse the heat. Its nano-scale particle structure increases the heat dissipation surface area and improves heat dissipation efficiency. It is also chemically stable and will not react with semiconductor materials or other substances in the cutting process. It can quickly absorb the heat conducted from the diamond cutting disc body 2 to the heat sink 4 and rapidly conduct the heat along the heat sink 4.

[0036] In this embodiment, the heat dissipation impeller 7 is made of aluminum alloy and has a streamlined shape. Made of high-strength aluminum alloy, the impeller 7 is lightweight and strong, capable of withstanding the powerful centrifugal force generated by the high-speed rotation of the diamond cutting disc body 2. The streamlined blade design effectively reduces air resistance and increases airflow efficiency during high-speed rotation. The impeller 7 is connected to the heat dissipation disc 4 via a built-in bearing 5, ensuring flexible rotation. During the cutting process, as the connecting disc 1 rotates at high speed, the impeller 7 also begins to rotate at high speed due to air friction. When the impeller 7 rotates, it acts like a small centrifugal fan, rapidly drawing in the surrounding air heated by the heat absorbed by the heat dissipation disc 4 and accelerating its expulsion. Because the heat dissipation disc 4 can quickly absorb heat through the nano-silver coating 15, the airflow generated by the rotation of the impeller 7 quickly carries away this hot air, accelerating heat dissipation. Simultaneously, the continuous replenishment of fresh, cool air further enhances the heat dissipation effect.

[0037] The specific operation involves installing the diamond cutting disc body 2 and the heat sink 4 on top of the connecting disc 1 using fixing bolts, and fixing the connecting disc 1 on top of the drive motor. To achieve rapid cooling, a unique heat conduction groove 3 is opened on the top of the diamond cutting disc body 2. The heat conduction groove 3 is evenly distributed radially, extending from the center of the disc body to the edge. The number is set according to the size of the disc body. The heat conduction groove 3 can ensure efficient heat conduction without affecting the structural strength of the disc body. The groove wall is finely polished to reduce thermal resistance, so that the heat generated during the cutting process can be quickly conducted along the heat conduction groove to the surface of the disc body, creating favorable conditions for subsequent heat dissipation.

[0038] The nano-silver coating 15 is directly attached to the surface of the diamond cutting disc body 2. Nano-silver has ultra-high thermal conductivity, which can quickly absorb the heat conducted from the disc through the heat conduction groove and rapidly diffuse the heat. Its nano-scale particle structure increases the heat dissipation surface area and improves heat dissipation efficiency. It is also chemically stable and will not react with semiconductor materials or other substances in the cutting process. It can quickly absorb the heat conducted from the diamond cutting disc body 2 to the heat sink 4 and rapidly conduct the heat along the heat sink 4.

[0039] The heat dissipation impeller 7 is made of high-strength aluminum alloy, which is lightweight and high-strength, and can withstand the strong centrifugal force generated by the high-speed rotation of the diamond cutting disc body 2; the blades are streamlined, which can effectively reduce air resistance and increase air flow efficiency when the impeller rotates at high speed.

[0040] The heat dissipation impeller 7 is connected to the heat dissipation plate 4 via the built-in bearing 5, ensuring that the heat dissipation impeller 7 can rotate flexibly. During the cutting process, as the connecting plate 1 rotates at high speed, the impeller also begins to rotate at high speed due to air friction. When the heat dissipation impeller 7 rotates, it acts like a small centrifugal fan, quickly drawing in the surrounding air heated by the heat absorbed by the heat dissipation plate 4 and accelerating its expulsion. Since the heat dissipation plate 4 can quickly absorb the heat of the plate through the nano-silver coating 15, the airflow generated by the rotation of the heat dissipation impeller 7 can quickly carry away this hot air, accelerating the dissipation of heat. At the same time, the continuous replenishment of fresh cold air further enhances the heat dissipation effect.

[0041] The heat dissipation impeller 7 not only assists the disc body in rapid heat dissipation, but also has the advantages of simple structure and no need for an additional power source. It relies entirely on the rotation drive of the cutting disc itself, which significantly improves the heat dissipation capacity of the diamond cutting disc body 2 without increasing the complexity of the equipment and energy consumption, providing a stronger guarantee for high-quality and high-efficiency cutting of semiconductor materials.

[0042] It should be noted that although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A semiconductor diamond cutting disk structure capable of rapid cooling, characterized in that, include: A connecting plate (1) is provided on one side of the connecting plate (1), and a diamond cutting disc body (2) is provided on the upper part of the diamond cutting disc body (2). A heat dissipation plate (4) is provided on one side of the diamond cutting disc body (2). A bearing (5) is fixedly installed on the inner wall of one side of the heat dissipation plate (4). A movable shaft (6) is fixedly installed on the inner side of the bearing (5). A plurality of heat dissipation impellers (7) are fixedly installed on the outer side of the movable shaft (6). A plurality of heat dissipation columns (8) are fixedly installed on the front side of the diamond cutting disc body (2). One end of the heat dissipation column (8) is fixedly connected to the outer side of the heat dissipation plate (4).

2. The semiconductor diamond cutting disk structure with rapid cooling according to claim 1, characterized in that, Multiple threaded holes (9) are provided on the top of the connecting disk (1), the diamond cutting disk body (2) and the heat sink (4), and the diamond cutting disk body (2) and the heat sink (4) are bolted on the top of the connecting disk (1).

3. The semiconductor diamond cutting disk structure with rapid cooling according to claim 1, characterized in that, The diamond cutting disc body (2) includes a carbon fiber reinforced layer (10), a tungsten carbide alloy liner (11), a boron fiber reinforced composite material layer (12), a high-strength alloy steel inner layer (13), and a copper-molybdenum alloy thermal conductive layer (14). The tungsten carbide alloy liner (11) is fixedly connected to one side of the diamond cutting disc body (2). The tungsten carbide alloy liner (11) is fixedly connected to one side of the carbon fiber reinforced layer (10). The boron fiber reinforced composite material layer (12) is fixedly connected to one side of the tungsten carbide alloy liner (11). The high-strength alloy steel inner layer (13) is fixedly connected to one side of the boron fiber reinforced composite material layer (12). The copper-molybdenum alloy thermal conductive layer (14) is fixedly connected to one side of the high-strength alloy steel inner layer (13).

4. The semiconductor diamond cutting disk structure with rapid cooling according to claim 1, characterized in that, The heat sink (4) includes a nano silver coating (15), which is fixedly connected to the inner side of the heat sink (4).

5. The semiconductor diamond cutting disk structure with rapid cooling according to claim 3, characterized in that, The carbon fiber reinforcement layer (10) is made of carbon fiber, and the tungsten carbide alloy liner (11) is made of tungsten carbide alloy.

6. The semiconductor diamond cutting disk structure with rapid cooling according to claim 3, characterized in that, The boron fiber reinforced composite material layer (12) is made of boron fiber, the high-strength alloy steel inner layer (13) is made of alloy steel, and the copper-molybdenum alloy thermal conductive layer (14) is made of copper-molybdenum alloy.

7. The semiconductor diamond cutting disk structure with rapid cooling according to claim 4, characterized in that, The nano-silver coating (15) is made of silver.

8. The semiconductor diamond cutting disk structure with rapid cooling according to claim 1, characterized in that, The heat dissipation impeller (7) is made of aluminum alloy and has a streamlined shape.

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