Expansion and shrinkage amount detection structure of laminated circuit board

Abstract

The utility model provides an expansion and shrinkage amount detection structure of a laminated circuit board. The expansion and shrinkage amount detection structure of the laminated circuit board comprises a circuit board body, the circuit board body is provided with first detection through holes, second detection through holes and third detection through holes, the first detection through holes and the second detection through holes are arranged at intervals in the same row, and the first detection through holes and the third detection through holes are arranged at intervals in the same column. The first detection through hole, the second detection through hole and the third detection through hole are arranged in a right-angle three-point shape; the actual distance between the center of the first detection through hole and the center of the second detection through hole is a first detection object distance, and the first detection object distance is used for calculating a first target distance; the actual distance between the center of the first detection through hole and the center of the third detection through hole is a second detection object distance, and the second detection object distance is used for calculating a second target distance. According to the expansion and contraction amount detection structure of the laminated circuit board, the use failure rate of the laminated circuit board is relatively low.

Description

Technical Field

[0001] This disclosure relates to the technical field of circuit board testing, and in particular to a structure for detecting the expansion and contraction of a laminated circuit board. Background Technology

[0002] A laminated circuit board is an electronic component made by laminating multiple layers of substrates together, providing electrical connections between electronic components. The lamination process is carried out under high temperature and pressure, making the laminated circuit board prone to thermal expansion and contraction. This results in a certain amount of expansion and contraction. To ensure that this expansion and contraction meets requirements, operators need to test it. Therefore, laminated circuit boards are equipped with expansion and contraction detection structures for this purpose.

[0003] The expansion and contraction detection structure of the laminated circuit board of the related technology includes a circuit board body, which is made of multiple layers of substrate laminated together. The circuit board body has multiple target point through holes, which are arranged at intervals around the periphery of the circuit board body. Each group of three target point through holes forms a target point group, and there is at least one target point group on one side of the circuit board body, such as Chinese Patent No. CN207423129U.

[0004] However, because the circuit board body has multiple target vias, each target via is a via structure, and every three target vias form a target group, with at least one target group on one side of the circuit board body, the number of target vias on the circuit board body is relatively large, and the spacing between two adjacent target vias is relatively small. This results in a large number and density of via structures on the circuit board body. The via structure is a relatively weak link on the circuit board body, and the large number and density of via structures reduces the reliability of the circuit board body, thus resulting in a high failure rate of the laminated circuit board. Utility Model Content

[0005] The purpose of this disclosure is to overcome the shortcomings of the prior art and provide a expansion and contraction detection structure for laminated circuit boards that results in a lower failure rate.

[0006] The purpose of this disclosure is achieved through the following technical solution:

[0007] A structure for detecting the expansion and contraction of a laminated circuit board includes a circuit board body. The circuit board body has a first detection through hole, a second detection through hole, and a third detection through hole. The first detection through hole and the second detection through hole are arranged in the same row at intervals, and the first detection through hole and the third detection through hole are arranged in the same column at intervals, so that the first detection through hole, the second detection through hole, and the third detection through hole are arranged in a right-angled three-point arrangement.

[0008] The actual distance between the center of the first detection through hole and the center of the second detection through hole is the first detection object distance, which is used to calculate the distance to the first target; the actual distance between the center of the first detection through hole and the center of the third detection through hole is the second detection object distance, which is used to calculate the distance to the second target.

[0009] In one embodiment, the circuit board body is provided with a copper foil layer.

[0010] In one embodiment, the second detection through-hole and the third detection through-hole are arranged diagonally.

[0011] In one embodiment, the circuit board body includes a plurality of substrates, which are stacked together. Each substrate has a first via, a second via, and a third via. The plurality of first vias between the plurality of substrates are interconnected to form a first detection via, the plurality of second vias between the plurality of substrates are interconnected to form a second detection via, and the plurality of third vias between the plurality of substrates are interconnected to form a third detection via.

[0012] In one embodiment, an adhesive layer is provided between two adjacent substrates.

[0013] In one embodiment, the adhesive layer is a semi-cured sheet structure.

[0014] In one embodiment, the number of substrates is m, and the number of adhesive layers is m-1, where m is an integer greater than or equal to 3.

[0015] In one embodiment, the cross-section of the first detection through-hole is circular, rectangular, triangular, or trapezoidal.

[0016] In one embodiment, the cross-section of the second detection through-hole is circular, rectangular, triangular, or trapezoidal.

[0017] In one embodiment, the cross-section of the third detection through-hole is circular, rectangular, triangular, or trapezoidal.

[0018] Compared with the prior art, this disclosure has at least the following advantages:

[0019] 1. Since the circuit board body has a first detection through-hole, a second detection through-hole, and a third detection through-hole, the staff will drill the first detection through-hole, the second detection through-hole, and the third detection through-hole on the circuit board body according to the design drawings. The design distance between the center of the first detection through-hole and the center of the second detection through-hole is the first target distance. The first detection object distance is used to calculate the difference between the first detection object distance and the first target distance to obtain the first error distance value. The staff will determine whether the first error distance value is within the error range, which is -1mil to 1mil. If it is, the expansion and contraction between the first detection through-hole and the second detection through-hole on the circuit board body is determined to meet the requirements. The first detection through-hole and the second detection through-hole are set in the same row with intervals, that is, the first detection through-hole and the third detection through-hole are set in the same row with intervals. The two detection vias are set horizontally to ensure that the lateral expansion and contraction on the circuit board body meets the requirements. The design distance between the center of the first detection via and the center of the third detection via is the second target distance. The second detection object distance is used to calculate the difference between the second detection object distance and the second target distance to obtain the second error distance value. The staff judges whether the second error distance value is within the error range. If it is, the expansion and contraction between the first detection via and the third detection via on the circuit board body is judged to meet the requirements. The first detection via and the third detection via are set in the same column with intervals, that is, the first detection via and the third detection via are set vertically with intervals, so that the vertical expansion and contraction on the circuit board body meets the requirements. The expansion and contraction detection process of the circuit board body is completed, that is, the expansion and contraction detection process of the laminated circuit board is completed.

[0020] 2. Because the circuit board body has a first detection through-hole, a second detection through-hole, and a third detection through-hole, all of which are via structures, the number of via structures on the circuit board body is reduced. The first and second detection through-holes are arranged in the same row with intervals to ensure a larger distance between them. The first and third detection through-holes are arranged in the same column with intervals to ensure a larger distance between them. This results in a larger spacing between the via structures on the circuit board body, leading to fewer and more sparse via structures on the circuit board body. This solves the problem of numerous and dense via structures on the circuit board body in the prior art, thus avoiding the problem of reduced reliability caused by numerous and dense via structures in the prior art. This results in higher reliability of the circuit board body and a lower failure rate of the laminated circuit board. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the accompanying drawings used in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this disclosure and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of a structure for detecting the expansion and contraction of a laminated circuit board according to one embodiment.

[0023] Figure 2 for Figure 1 A schematic diagram of the expansion and contraction detection structure of the laminated circuit board from another perspective.

[0024] Figure 3 for Figure 2 A cross-sectional view along line AA in the expansion and contraction detection structure of the laminated circuit board shown.

[0025] Figure 4 for Figure 3 The enlarged schematic diagram of point B of the expansion and contraction detection structure of the laminated circuit board is shown. Detailed Implementation

[0026] To facilitate understanding of this disclosure, a more complete description will be given below with reference to the accompanying drawings, which illustrate preferred embodiments of the present disclosure. However, this disclosure can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure.

[0027] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this disclosure. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0029] like Figures 1 to 4As shown, an embodiment of the expansion / contraction detection structure 10 for a laminated circuit board includes a circuit board body 100. The circuit board body 100 has a first detection through-hole 110, a second detection through-hole 120, and a third detection through-hole 130. The first detection through-hole 110 and the second detection through-hole 120 are arranged in the same row with intervals, and the first detection through-hole 110 and the third detection through-hole 130 are arranged in the same column with intervals, so that the first detection through-hole 110, the second detection through-hole 120, and the third detection through-hole 130 are arranged in a right-angled three-point shape. The actual distance between the center of the first detection through-hole 110 and the center of the second detection through-hole 120 is the first detection object distance x, which is used to calculate the distance to the first target. The actual distance between the center of the first detection through-hole 110 and the center of the third detection through-hole 130 is the second detection object distance y, which is used to calculate the distance to the second target.

[0030] In this embodiment, the circuit board body 100 is provided with a first detection through hole 110, a second detection through hole 120 and a third detection through hole 130. That is, the staff opens the first detection through hole 110, the second detection through hole 120 and the third detection through hole 130 on the circuit board body 100 according to the design drawings, so that the design distance between the center of the first detection through hole 110 and the center of the second detection through hole 120 is the first target distance, and the design distance between the center of the first detection through hole 110 and the center of the third detection through hole 130 is the second target distance.

[0031] The expansion and contraction detection structure 10 of the aforementioned laminated circuit board has a first detection through-hole 110, a second detection through-hole 120, and a third detection through-hole 130 on the circuit board body 100. According to the design drawings, the operator creates these holes on the circuit board body 100. The design distance between the center of the first detection through-hole 110 and the center of the second detection through-hole 120 is set as the first target distance. The first detection object distance x is used to calculate the difference between the first detection object distance x and the first target distance to obtain the first error distance value. The operator then determines whether the first error distance value is within the error range (-1 mil to 1 mil). If it is, the expansion and contraction between the first detection through-hole 110 and the second detection through-hole 120 on the circuit board body 100 is deemed to meet the requirements. The first detection through-hole 110 and the second detection through-hole 120 are arranged in the same row with intervals. The first detection through-hole 110 and the second detection through-hole 120 are horizontally spaced to ensure that the lateral expansion and contraction on the circuit board body 100 meets the requirements. The design distance between the center of the first detection through-hole 110 and the center of the third detection through-hole 130 is the second target distance. The second detection object distance y is used to calculate the difference between the second detection object distance and the second target distance to obtain the second error distance value. The operator judges whether the second error distance value is within the error range. If so, the expansion and contraction between the first detection through-hole 110 and the third detection through-hole 130 on the circuit board body 100 is determined to meet the requirements. The first detection through-hole 110 and the third detection through-hole 130 are arranged in the same column with intervals, that is, the first detection through-hole 110 and the third detection through-hole 130 are arranged vertically with intervals to ensure that the vertical expansion and contraction on the circuit board body 100 meets the requirements. The expansion and contraction detection process of the circuit board body 100 is completed, that is, the expansion and contraction detection process of the laminated circuit board is completed.

[0032] Because the circuit board body 100 has a first detection through-hole 110, a second detection through-hole 120, and a third detection through-hole 130, all of which are via structures, the number of via structures on the circuit board body 100 is reduced. The first detection through-hole 110 and the second detection through-hole 120 are arranged in the same row with intervals to maximize the spacing between them. The first detection through-hole 110 and the third detection through-hole 130 are arranged in the same column with intervals to maximize the spacing between them. The large spacing between the detection via 110 and the third detection via 130 results in a larger spacing between the via structures on the circuit board body 100, leading to fewer and more sparse via structures on the circuit board body 100. This solves the problem of numerous and dense via structures on the circuit board body 100 in the prior art, thus avoiding the problem of reduced reliability of the circuit board body 100 due to numerous and dense via structures in the prior art. This results in higher reliability of the circuit board body 100 and a lower failure rate of the laminated circuit board.

[0033] like Figures 1 to 2 As shown, in one embodiment, the circuit board body 100 is provided with a copper foil layer 140.

[0034] like Figures 1 to 2 As shown, in one embodiment, the second detection through hole 120 and the third detection through hole 130 are arranged diagonally.

[0035] like Figures 1 to 4 As shown, in one embodiment, the circuit board body 100 includes a plurality of substrates 150, which are stacked together. Each substrate 150 has a first via 151, a second via 152 and a third via 153. The plurality of first vias 151 between the plurality of substrates 150 are interconnected to form a first detection via 110. The plurality of second vias 152 between the plurality of substrates 150 are interconnected to form a second detection via 120. The plurality of third vias 153 between the plurality of substrates 150 are interconnected to form a third detection via 130.

[0036] like Figures 1 to 4 As shown, in one embodiment, an adhesive layer 154 is provided between two adjacent substrates 150 to ensure a tight connection between the two adjacent substrates 150.

[0037] like Figures 1 to 4 As shown, in one embodiment, the adhesive layer 154 is a semi-cured sheet structure.

[0038] like Figures 1 to 4 As shown, in one embodiment, the number of substrates 150 is m, and the number of adhesive layers 154 is m-1, where m is an integer greater than or equal to 3.

[0039] like Figures 1 to 2 As shown, in one embodiment, the cross-section of the first detection through-hole 110 is circular, rectangular, triangular, or trapezoidal.

[0040] like Figures 1 to 2 As shown, in one embodiment, the cross-section of the second detection through-hole 120 is circular, rectangular, triangular, or trapezoidal.

[0041] like Figures 1 to 2 As shown, in one embodiment, the cross-section of the third detection through-hole 130 is circular, rectangular, triangular, or trapezoidal.

[0042] Compared with the prior art, this disclosure has at least the following advantages:

[0043] 1. Since the circuit board body 100 has a first detection through-hole 110, a second detection through-hole 120, and a third detection through-hole 130, the staff opens the first detection through-hole 110, the second detection through-hole 120, and the third detection through-hole 130 on the circuit board body 100 according to the design drawings. The design distance between the center of the first detection through-hole 110 and the center of the second detection through-hole 120 is the first target distance. The first detection object distance x is used to calculate the first target distance, that is, the first detection object distance x is used to subtract the first target distance to obtain the first error distance value. The staff judges whether the first error distance value is within the error range, which is -1mil to 1mil. If it is, the expansion and contraction between the first detection through-hole 110 and the second detection through-hole 120 on the circuit board body 100 is judged to meet the requirements. The first detection through-hole 110 and the second detection through-hole 120 are set in the same row with intervals, that is, the first detection through-hole 110... The first detection through-hole 110 and the second detection through-hole 120 are laterally spaced to ensure that the lateral expansion and contraction on the circuit board body 100 meets the requirements. The design distance between the center of the first detection through-hole 110 and the center of the third detection through-hole 130 is the second target distance. The second detection object distance y is used to calculate with the second target distance, that is, the second detection object distance y is used to subtract from the second target distance to obtain the second error distance value. The operator judges whether the second error distance value is within the error range. If so, it is judged that the expansion and contraction between the first detection through-hole 110 and the third detection through-hole 130 on the circuit board body 100 meets the requirements. The first detection through-hole 110 and the third detection through-hole 130 are spaced in the same column, that is, the first detection through-hole 110 and the third detection through-hole 130 are spaced longitudinally to ensure that the longitudinal expansion and contraction on the circuit board body 100 meets the requirements. The expansion and contraction detection process of the circuit board body 100 is completed, that is, the expansion and contraction detection process of the laminated circuit board is completed.

[0044] 2. Because the circuit board body 100 has a first detection through-hole 110, a second detection through-hole 120, and a third detection through-hole 130, all of which are via structures, the number of via structures on the circuit board body 100 is reduced. The first detection through-hole 110 and the second detection through-hole 120 are arranged in the same row with intervals to maximize the spacing between them. The first detection through-hole 110 and the third detection through-hole 130 are arranged in the same column with intervals to maximize the spacing between them. The large spacing between the first detection via 110 and the third detection via 130 results in a larger spacing between the via structures on the circuit board body 100, leading to fewer and more sparse via structures on the circuit board body 100. This solves the problem of numerous and dense via structures on the circuit board body 100 in the prior art, thus avoiding the problem of reduced reliability of the circuit board body 100 due to numerous and dense via structures in the prior art. This results in higher reliability of the circuit board body 100 and a lower failure rate of the laminated circuit board.

[0045] The embodiments described above are merely illustrative of several implementations of this disclosure, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the disclosed patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this disclosure, and these all fall within the protection scope of this disclosure. Therefore, the protection scope of this patent should be determined by the appended claims.

Claims

1. A structure for detecting the expansion and contraction of a laminated circuit board, comprising a circuit board body, characterized in that, The circuit board body has a first detection through hole, a second detection through hole and a third detection through hole. The first detection through hole and the second detection through hole are arranged in the same row with intervals, and the first detection through hole and the third detection through hole are arranged in the same column with intervals, so that the first detection through hole, the second detection through hole and the third detection through hole are arranged in a right-angled three-point arrangement. The actual distance between the center of the first detection through hole and the center of the second detection through hole is the first detection object distance, which is used to calculate the distance to the first target; the actual distance between the center of the first detection through hole and the center of the third detection through hole is the second detection object distance, which is used to calculate the distance to the second target.

2. The expansion and contraction detection structure for the laminated circuit board according to claim 1, characterized in that, The circuit board body is provided with a copper foil layer.

3. The expansion and contraction detection structure for the laminated circuit board according to claim 1, characterized in that, The second detection through hole and the third detection through hole are arranged diagonally.

4. The expansion and contraction detection structure for the laminated circuit board according to claim 1, characterized in that, The circuit board body includes multiple substrates, which are stacked together. Each substrate has a first via, a second via, and a third via. The first vias between the multiple substrates are interconnected to form a first detection via. The second vias between the multiple substrates are interconnected to form a second detection via. The third vias between the multiple substrates are interconnected to form a third detection via.

5. The expansion and contraction detection structure for the laminated circuit board according to claim 4, characterized in that, An adhesive layer is provided between two adjacent substrates.

6. The expansion and contraction detection structure for the laminated circuit board according to claim 5, characterized in that, The adhesive layer is a semi-cured sheet structure.

7. The expansion and contraction detection structure for the laminated circuit board according to claim 5, characterized in that, The number of substrates is m, and the number of adhesive layers is m-1, where m is an integer greater than or equal to 3.

8. The expansion and contraction detection structure for the laminated circuit board according to claim 1, characterized in that, The cross-section of the first detection through hole is circular, rectangular, triangular, or trapezoidal.

9. The expansion and contraction detection structure for the laminated circuit board according to claim 1, characterized in that, The cross-section of the second detection through hole is circular, rectangular, triangular, or trapezoidal.

10. The expansion and contraction detection structure for the laminated circuit board according to claim 1, characterized in that, The cross-section of the third detection through hole is circular, rectangular, triangular, or trapezoidal.

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