Wall tile hollowing and cracking prevention structure

CN224244329UActive Publication Date: 2026-05-15ZHENGZHOU LUJIANG IND CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
ZHENGZHOU LUJIANG IND CO LTD
Filing Date
2025-04-23
Publication Date
2026-05-15

AI Technical Summary

Technical Problem

Hollow spots and cracks are extremely common in the installation of building wall tiles. Once hollow spots form, the tiles are subjected to uneven stress, which leads to cracking, affects the appearance, and may cause the tiles to fall off.

Method used

A wall tile anti-hollow cracking structure is adopted, including a tile layer, a buffer layer, an anti-heat shrinkage layer, a woven mesh, and an adhesive layer. The buffer layer buffers external forces, the anti-heat shrinkage layer copes with temperature changes, the woven mesh increases strength and toughness, and the adhesive layer ensures a firm bond with the wall surface, preventing hollowing or cracking caused by thermal expansion and contraction and external forces.

Benefits of technology

It effectively prevents tiles from becoming hollow or cracking due to external forces and temperature changes, improves construction efficiency and tile lifespan, ensures a firm bond between tiles and the wall, and enhances overall aesthetics and safety.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of building decoration, in particular to an anti-hollowing and anti-cracking structure for wall tiles. The ceramic tile comprises a ceramic tile layer, a buffer layer adheres to one side of the ceramic tile layer, a plurality of grooves are formed in one side of the buffer layer, protruding blocks are clamped in the grooves, a heat-shrinkage-resistant layer is fixedly connected to the surfaces of the protruding blocks, a woven mesh is fixedly connected to one side of the heat-shrinkage-resistant layer, and a bonding layer is fixedly connected to the side, away from the heat-shrinkage-resistant layer, of the woven mesh. The bonding layer is attached to a wall surface, a plurality of through holes are formed in the surface of the buffer layer, the through holes are distributed in the buffer layer in a linear array mode, the thermal shrinkage resistant layer is a modified cement mortar layer, a plurality of reinforcing wires are arranged in the thermal shrinkage resistant layer in a penetrating mode, the reinforcing wires are distributed in the thermal shrinkage resistant layer in an array mode at equal intervals, and the reinforcing wires are steel wires. The problems that the hollowing and cracking phenomena are very common in the paving project of the building wall ceramic tiles, once hollowing is formed, the stress of the ceramic tiles is not uniform, and then the ceramic tiles are cracked are solved.
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Description

Technical Field

[0001] This utility model relates to the field of building decoration technology, and in particular to a structure for preventing hollowing and cracking of wall ceramic tiles. Background Technology

[0002] Hollow spots and cracks are extremely common in the installation of building wall tiles. Traditional methods often use cement mortar as the bonding material between the tiles and the wall. However, cement mortar has many drawbacks. It shrinks during the curing process. The unevenness of the original wall substrate, coupled with frequent fluctuations in temperature and humidity in the environment, makes it very easy for hollow spots to appear in the tiles after a period of use.

[0003] Once hollow spots form, the tiles will be subjected to uneven stress, which will lead to cracking. This not only seriously damages the overall aesthetics of the wall, but may also cause the tiles to fall off the wall, posing a safety threat to the user.

[0004] Regarding the above-mentioned and existing related technologies, the inventor believes that the following defects often exist: in the laying of building wall tiles, hollowing and cracking are extremely common. Once hollowing occurs, the stress on the tile will be uneven, which will lead to cracking. This not only seriously damages the overall aesthetics of the wall, but may also cause the tile to fall off the wall. Therefore, in order to solve the above problems, a structure for preventing hollowing and cracking of wall tiles is proposed. Utility Model Content

[0005] The purpose of this utility model is to solve the problem that hollowness and cracking are extremely common in the laying of building wall tiles in the existing technology. Once hollowness forms, the stress on the tile will be uneven, which will lead to cracking. This not only seriously damages the overall aesthetics of the wall, but may also cause the tile to fall off the wall. Therefore, a structure for preventing hollowness and cracking of wall tiles is proposed.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a wall tile anti-hollow cracking structure, comprising a tile layer, a buffer layer adhered to one side of the tile layer, a plurality of grooves formed on one side of the buffer layer, protrusions being engaged in the grooves, an anti-heat shrinkage layer being fixedly connected to the surface of the protrusions, a woven mesh being fixedly connected to one side of the anti-heat shrinkage layer, and an adhesive layer being fixedly connected to the side of the woven mesh away from the anti-heat shrinkage layer, the adhesive layer being adhered to the wall surface.

[0007] The effects achieved by the above components are as follows: the buffer layer can buffer the impact of external forces that may be received by the tile layer, reducing stress; the interlocking design of the grooves and protrusions makes the connection between the buffer layer, the heat shrink layer and other layers tighter and more stable, and less prone to misalignment and separation; the heat shrink layer can cope with thermal expansion and contraction caused by temperature changes, preventing the tiles from becoming hollow or cracking due to dimensional changes; the woven mesh increases the strength and toughness of the structure and improves the overall stability; and the adhesive layer ensures that the structure is firmly bonded to the wall.

[0008] Preferably, the surface of the buffer layer has a plurality of through holes, and the plurality of through holes are distributed in a linear array on the buffer layer.

[0009] The effect achieved by the above components is that when the buffer layer is compressed, the through holes allow the internal air to flow rapidly, which not only further enhances the buffer performance and effectively disperses and alleviates the impact of external forces on the tile layer, but also avoids damage to the tiles caused by excessive local pressure.

[0010] Preferably, the heat-shrinkable layer is a modified cement mortar layer.

[0011] The effect achieved by the above components is to enhance the crack resistance of cement mortar and reduce shrinkage cracks caused by thermal expansion and contraction.

[0012] Preferably, a plurality of reinforcing wires are threaded through the heat-shrinkable layer, and the plurality of reinforcing wires are distributed in an equally spaced array within the heat-shrinkable layer, wherein the reinforcing wires are steel wires.

[0013] The effect achieved by the above components is that when encountering drastic temperature changes and the heat-shrinkable layer expands and contracts due to heat, the steel wire can inhibit the excessive deformation of the heat-shrinkable layer, preventing it from cracking or failing. This better maintains the heat-shrinkable layer's ability to cope with thermal expansion and contraction, and continuously ensures that wall tiles will not become hollow or cracked due to thermal stress under temperature change conditions.

[0014] Preferably, the woven mesh is a nylon woven mesh.

[0015] The effect achieved by the above components is that the nylon woven mesh can adapt to various minor deformations in the structure, further enhancing the overall buffering performance of the structure, effectively dispersing possible stress concentration points, and preventing the tiles from becoming hollow or cracked due to excessive local stress.

[0016] Preferably, one side of the adhesive layer is fixedly connected with a plurality of anti-slip textures, which are used to enhance the friction between the wall surfaces to which the adhesive layer is installed.

[0017] The effect achieved by the above components is that the anti-slip texture on one side of the adhesive layer greatly enhances the friction between the wall surface and the installation surface, effectively preventing the tiles from sliding and shifting during installation, ensuring accurate tile placement, and improving construction efficiency and installation quality.

[0018] Preferably, the surface of the ceramic tile layer is coated with a waterproof and anti-corrosion layer.

[0019] The effect achieved by the above components is to prevent the internal structure of the tile layer from changing due to water absorption, thus reducing the lifespan of the tile.

[0020] In this invention, the buffer layer can buffer the impact of external forces that may be received by the tile layer, reducing stress. The interlocking design of the grooves and protrusions makes the connection between the buffer layer, the heat shrink layer and other layers tighter and more stable, and less prone to misalignment and separation. The heat shrink layer can cope with thermal expansion and contraction caused by temperature changes, preventing the tiles from becoming hollow or cracking due to size changes. The woven mesh increases the strength and toughness of the structure and improves the overall stability. The adhesive layer ensures that the structure is firmly bonded to the wall. Attached Figure Description

[0021] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0022] Figure 2 In this utility model Figure 1 Enlarged view of point A;

[0023] Figure 3 In this utility model Figure 1 A reverse side diagram;

[0024] Figure 4 This is a schematic diagram of the woven mesh structure in this utility model.

[0025] Legend: 1. Tile layer; 2. Buffer layer; 3. Groove; 4. Protrusion; 5. Heat shrink-resistant layer; 6. Woven mesh; 7. Adhesive layer; 8. Through hole; 9. Reinforcing wire; 10. Anti-slip texture. Detailed Implementation

[0026] Reference Figure 1-4As shown, this utility model provides a technical solution: a structure for preventing hollow cracking of wall tiles, including a tile layer 1, a buffer layer 2 adhered to one side of the tile layer 1, a plurality of grooves 3 formed on one side of the buffer layer 2, protrusions 4 snapped into the grooves 3, an anti-heat shrinkage layer 5 fixedly connected to the surface of the protrusions 4, a woven mesh 6 fixedly connected to one side of the anti-heat shrinkage layer 5, and an adhesive layer 7 fixedly connected to the side of the woven mesh 6 away from the anti-heat shrinkage layer 5. The adhesive layer 7 is adhered to the wall surface. The buffer layer 2 can buffer the external impact that the tile layer 1 may be subjected to, reducing stress. The snapping design of the grooves 3 and protrusions 4 makes the connection between the buffer layer 2, the anti-heat shrinkage layer 5, and other layers tighter and more stable, and less prone to misalignment. The heat-shrinkable layer 5 is designed to withstand thermal expansion and contraction caused by temperature changes, preventing tiles from becoming hollow or cracking due to dimensional variations. The woven mesh 6 increases the strength and toughness of the structure, enhancing overall stability. The adhesive layer 7 ensures a firm bond between the structure and the wall. The buffer layer 2 has several through-holes 8 arranged in a linear array. When the buffer layer 2 is compressed, the through-holes 8 allow for rapid airflow, further enhancing the buffering performance, effectively dispersing and mitigating the impact of external forces on the tile layer 1, and preventing tile damage due to excessive local pressure. The heat-shrinkable layer 5 is a modified cement mortar layer that enhances water... The mortar's crack resistance reduces shrinkage cracks caused by thermal expansion and contraction. Several reinforcing wires 9, arranged in an evenly spaced array within the heat-shrinkable layer 5, are inserted. These reinforcing wires 9 are made of steel wire. When encountering drastic temperature changes and the heat-shrinkable layer 5 expands and contracts, the steel wires can inhibit excessive deformation, preventing cracking or failure. This better maintains the heat-shrinkable layer 5's ability to withstand thermal expansion and contraction, continuously ensuring that wall tiles do not develop hollowness or cracks due to thermal stress under varying temperature conditions. The woven mesh 6 is made of nylon, which can adapt to various minute deformations within the structure, further enhancing... The strong overall structure provides excellent buffering performance, effectively dispersing potential stress concentration points and preventing tiles from becoming hollow or cracked due to excessive local stress. Several anti-slip textures 10 are fixedly connected to one side of the adhesive layer 7. These anti-slip textures 10 enhance the friction between the installation wall and the wall surface. The anti-slip textures 10 on one side of the adhesive layer 7 greatly enhance the friction between the installation wall and effectively prevent the tiles from sliding during installation, ensuring accurate tile placement and improving construction efficiency and installation quality. The surface of the tile layer 1 is coated with a waterproof and anti-corrosion layer to prevent the internal structure of the tile layer 1 from changing due to water absorption, thus preventing a reduction in the tile's lifespan.

[0027] The working principle is as follows: The waterproof and anti-corrosion layer on the surface of the tile layer 1 effectively prevents moisture intrusion, avoiding changes in the internal structure of the tile due to water absorption, thereby extending the service life of the tile. The buffer layer 2 is key to resisting external impacts. Its surface has a linear array of through holes 8, which promotes rapid airflow when compressed. On the one hand, this further enhances the buffering performance, evenly dispersing the impact of external forces on the tile layer 1 and preventing damage to the tile due to excessive local pressure. On the other hand, the buffer layer 2 as a whole can buffer the external forces that the tile layer 1 may suffer, reducing stress. In addition, the buffer layer 2 and the heat-shrinkable layer 5 are tightly connected by grooves 3 and protrusions 4, ensuring a stable connection between the two and preventing easy misalignment and separation. The heat-shrinkable layer 5 is made of modified cement mortar and is threaded with equally spaced array of steel reinforcing wires 9. When rapid temperature changes cause thermal expansion and contraction, the steel wire can inhibit excessive deformation of the modified cement mortar layer, reduce the generation of shrinkage cracks, prevent the anti-heat shrinkage layer 5 from cracking or failing, and continuously ensure its ability to cope with thermal expansion and contraction. This effectively avoids hollowing and cracking of wall tiles due to thermal stress. The nylon woven mesh 6 is integrated into the structure, greatly enhancing the overall strength and toughness. It can adapt to various minor deformations, effectively disperse stress concentration points, and further improve the stability of the structure. Finally, the anti-slip texture 10 on one side of the adhesive layer 7 significantly increases the friction between the adhesive layer 7 and the reinforced wall surface, effectively preventing the tiles from sliding during installation and ensuring accurate tile placement. This improves construction efficiency and installation quality, achieving a comprehensive effect of preventing hollowing and cracking of wall tiles.

[0028] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

Claims

1. A structure for preventing hollowing and cracking of wall ceramic tiles, comprising a ceramic tile layer (1), characterized in that: A buffer layer (2) is adhered to one side of the tile layer (1). Several grooves (3) are provided on one side of the buffer layer (2). A protrusion (4) is snapped into the groove (3). An anti-heat shrink layer (5) is fixedly connected to the surface of the protrusion (4). A woven mesh (6) is fixedly connected to one side of the anti-heat shrink layer (5). An adhesive layer (7) is fixedly connected to the side of the woven mesh (6) away from the anti-heat shrink layer (5). The adhesive layer (7) is adhered to the wall surface.

2. The anti-hollow cracking structure for wall ceramic tiles according to claim 1, characterized in that: The surface of the buffer layer (2) is provided with a plurality of through holes (8), and the plurality of through holes (8) are distributed in a linear array on the buffer layer (2).

3. The anti-hollow cracking structure for wall ceramic tiles according to claim 1, characterized in that: The heat-shrinkable layer (5) is a modified cement mortar layer.

4. The anti-hollow cracking structure for wall ceramic tiles according to claim 1, characterized in that: The heat-shrinkable layer (5) is provided with a number of reinforcing wires (9), which are distributed in an equally spaced array within the heat-shrinkable layer (5). The reinforcing wires (9) are steel wires.

5. The anti-hollow cracking structure for wall ceramic tiles according to claim 1, characterized in that: The woven mesh (6) is a nylon woven mesh (6).

6. The anti-hollow cracking structure for wall ceramic tiles according to claim 1, characterized in that: The adhesive layer (7) has a plurality of anti-slip textures (10) fixedly connected to one side, and the plurality of anti-slip textures (10) are used to enhance the friction between the wall surfaces to which the adhesive layer is installed.

7. The anti-hollow cracking structure for wall ceramic tiles according to claim 1, characterized in that: The surface of the ceramic tile layer (1) is coated with a waterproof and anti-corrosion layer.