Wafer internal defect detection equipment
By designing a wafer internal defect detection device that integrates initial inspection, re-inspection, and internal inspection functions, the problem of multiple transfers and positioning in wafer inspection is solved, improving inspection efficiency and accuracy, and avoiding secondary damage.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HANGZHOU GUANGYAN TECH CO LTD
- Filing Date
- 2025-07-16
- Publication Date
- 2026-05-22
AI Technical Summary
Existing wafer defect detection technologies require multiple transfers and repositionings, resulting in low detection efficiency and accuracy, and may introduce secondary contamination or mechanical damage.
Design a wafer internal defect detection device that uses a clamping mechanism to move the wafer in multiple directions and performs multi-level detection through initial inspection, re-inspection and internal inspection mechanisms to avoid multiple wafer transfers and repositioning, and integrates initial inspection, re-inspection and internal inspection functions into one unit.
It improves detection efficiency and accuracy, reduces secondary damage to wafers, shortens detection time, and enhances equipment integration and detection results.
Smart Images
Figure CN224267224U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of semiconductor testing technology, and in particular relates to a wafer internal defect detection device. Background Technology
[0002] Currently, in semiconductor manufacturing, surface defects (such as scratches, particle contamination, and thin film inhomogeneity) and internal defects (such as lattice defects, cracks, microvoids, and uneven doping) on wafers directly affect chip performance and yield. Therefore, defect detection is a critical step in ensuring product quality. Existing defect detection technologies typically require two devices to detect surface and internal defects separately. Due to the differences in the principles and structures of different detection devices, the wafer needs to be transferred and repositioned multiple times during the detection process. This not only increases process time and reduces detection efficiency but may also introduce secondary contamination or mechanical damage during handling. Furthermore, multiple repositioning and calibrations can lead to cumulative errors, affecting detection accuracy.
[0003] To solve the above-mentioned technical problems, this utility model designs a wafer internal defect detection device. Utility Model Content
[0004] This invention provides a wafer internal defect detection device, which aims to solve the problem of low detection efficiency and accuracy caused by the need to move and position the wafer multiple times during the detection of surface defects and internal defects.
[0005] To achieve the above objectives, this utility model provides the following technical solution: a wafer internal defect detection device, comprising a base plate, a clamping mechanism, a preliminary inspection mechanism, a re-inspection mechanism, and an internal inspection mechanism. The base plate is provided with a first support frame and a second support frame. The preliminary inspection mechanism and the internal inspection mechanism are located on the first support frame, and the re-inspection mechanism is located on the second support frame. The re-inspection mechanism, the preliminary inspection mechanism, and the internal inspection mechanism are arranged sequentially along a first direction. The clamping mechanism is used to clamp the wafer and can move relative to the re-inspection mechanism, the preliminary inspection mechanism, and the internal inspection mechanism along a first direction and a second direction, wherein the first direction and the second direction are perpendicular to each other.
[0006] Based on the above technical solution, the first support frame includes a first crossbeam extending along a second direction. The initial inspection mechanism includes an initial inspection light source and multiple initial inspection cameras. The multiple initial inspection cameras are evenly distributed on the first crossbeam along the second direction. The initial inspection light source is located on the base plate and extends along the second direction. When the clamping mechanism moves along the first direction to a position where the wafer and the initial inspection mechanism are correspondingly positioned, the multiple initial inspection cameras and the initial inspection light source are respectively positioned above and below the wafer.
[0007] Based on the above technical solution, the second support frame is arranged on one side of the first support frame along the first direction. The re-inspection mechanism includes a re-inspection camera and a re-inspection light source arranged opposite to each other. The re-inspection camera is arranged on the second support frame, and the re-inspection light source is arranged on the base plate. When the clamping mechanism moves along the first direction to the point where the wafer and the re-inspection mechanism are arranged correspondingly, the re-inspection camera and the re-inspection light source are respectively arranged above and below the wafer.
[0008] Furthermore, a re-inspection adjustment component is provided between the second support frame and the re-inspection camera. The re-inspection adjustment component includes a lateral adjustment component, a longitudinal adjustment component, and an angle adjustment component, which are used to adjust the position of the re-inspection camera along the first direction and the second direction, as well as the angle along the wafer circumference direction.
[0009] Based on the above technical solution, the first support frame includes a second crossbeam, the second crossbeam extends in the same direction as the first crossbeam and is located below the first crossbeam, the internal inspection mechanism includes an internal inspection camera, a first internal inspection light source and a second internal inspection light source, the internal inspection camera is located on the second crossbeam, the first internal inspection light source is located on the base plate and is located opposite to the internal inspection camera, the second internal inspection light source is located on the internal inspection camera, when the clamping mechanism moves along the first direction to the point where the wafer is correspondingly positioned with the internal inspection mechanism, the internal inspection camera and the first internal inspection light source are respectively located above and below the wafer.
[0010] Furthermore, a first adjusting member is provided between the second crossbeam and the internal inspection camera for adjusting the height of the internal inspection camera, and a second adjusting member is provided between the base plate and the first internal inspection light source for adjusting the height of the first internal inspection light source.
[0011] Furthermore, the wafer internal defect detection equipment also includes a first sliding mechanism and a second sliding mechanism. The first sliding mechanism includes a first slide rail and a first slide plate. The first slide rail extends along a first direction and is disposed on a base plate. One end of the first slide plate is slidably connected to the first slide rail, and the other end of the first slide plate extends along a second direction. The second sliding mechanism includes a second slide rail and a second slide plate. The second slide rail is disposed on the first slide plate and extends along a second direction. The second slide plate is slidably connected to the second slide rail. The clamping mechanism is connected to the second slide plate.
[0012] Based on the above technical solution, the clamping mechanism includes a support frame, a first jaw assembly, a second jaw assembly, and a drive assembly. The support frame is connected to a second sliding plate. The first jaw assembly and the second jaw assembly are disposed opposite each other on the top wall of the support frame. The drive assembly is disposed on one side of the first jaw assembly. The drive assembly is used to drive the first jaw assembly to move so as to cooperate with the second jaw assembly to clamp or release the wafer.
[0013] Furthermore, the first jaw assembly includes a driving engagement component and a movable jaw. The driving engagement component is rotatably connected to the support frame. The driving engagement component includes a first end and a second end. The first end is correspondingly disposed with the driving component, and the second end abuts against the movable jaw. When the driving component moves in the direction close to the wafer, it can drive the driving engagement component to rotate, thereby driving the movable jaw to move in the direction away from the wafer, so that the movable jaw moves from the clamping position of clamping the wafer to the releasing position of releasing the wafer.
[0014] Based on the above technical solution, the driving component includes a fixing component, a driving component, and a moving component. The fixing component is disposed on one side of the first jaw assembly, the driving component is disposed on the top of the fixing component, and the moving component is disposed on the top of the driving component. The driving component can drive the moving component to move in a direction close to or away from the wafer. The moving component has an extension portion. When the movable jaw moves from the clamping position to the releasing position, the end of the extension portion close to the wafer contacts the first end of the driving mating component.
[0015] Compared with related technologies, the beneficial effects of this utility model are as follows:
[0016] This invention uses a clamping mechanism to clamp the wafer and move it along a first direction to the corresponding position of the initial inspection mechanism. The initial inspection mechanism performs preliminary identification and location of surface and internal defects on the wafer, obtaining initial defect information. During the inspection process, the clamping mechanism can adjust the position of the wafer along the first or second direction to meet the inspection requirements. After the initial inspection, the clamping mechanism moves the wafer along the first direction to the corresponding position of the re-inspection mechanism. The re-inspection mechanism re-inspects the wafer defects based on the initial defect information to further determine the defect type and morphology, obtaining re-inspection defect information. After the re-inspection, the clamping mechanism moves the wafer along the first direction to the corresponding position of the internal inspection mechanism, which inspects the inside of the wafer to obtain internal defect information.
[0017] Throughout the entire testing process, a clamping mechanism is used to move the wafer to complete multi-level testing, avoiding multiple wafer transfers and repositionings. This improves testing efficiency and accuracy to a certain extent and also avoids secondary damage to the wafer. Attached Figure Description
[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only one embodiment of this utility model. For those skilled in the art, other embodiments can be derived from the provided drawings without creative effort.
[0019] Figure 1 This is a schematic diagram of the structure of a wafer internal defect detection device provided by this utility model;
[0020] Figure 2 This utility model provides Figure 1 An enlarged structural diagram of part A shown in the figure;
[0021] Figure 3 This utility model provides Figure 1 An enlarged structural diagram of part B shown in the figure;
[0022] Figure 4 This is a schematic diagram of another wafer internal defect detection device provided by this utility model;
[0023] Figure 5 This utility model provides Figure 4 An enlarged structural diagram of section C shown in the figure;
[0024] Figure 6 This utility model provides Figure 4 An enlarged structural diagram of part D shown in the figure;
[0025] Figure 7 This is a schematic diagram of the structure of a first sliding mechanism and a second sliding mechanism provided by this utility model;
[0026] Figure 8 This is a schematic diagram of the structure of the clamping mechanism provided by this utility model moving to the corresponding positions of the drive assembly and the drive mating part;
[0027] Figure 9 This utility model provides Figure 8 An enlarged structural diagram of part E shown in the figure;
[0028] Figure 10 This utility model provides Figure 8 An enlarged structural diagram of part F shown in the figure;
[0029] Figure 11 This is a schematic diagram of the structure of the clamping mechanism, the first sliding mechanism, and the second sliding mechanism provided by this utility model.
[0030] Figure 12 This utility model provides Figure 11 An enlarged structural diagram of section H shown in the figure;
[0031] Figure 13 This utility model provides Figure 1 The diagram shows an enlarged view of part G.
[0032] In the diagram: 2. Clamping mechanism; 21. Support frame; 211. First fixing block; 22. First claw assembly; 221. Drive mating part; 2211. First end; 2212. Second end; 222. Movable claw; 2221. Extension rod; 223. Elastic element; 224. Limiting part; 225. Third slide rail; 23. Second claw assembly; 231. Second fixing block; 232. Second claw; 24. Drive assembly; 241. Fixing part; 2411. Support rod; 2412. First sensor; 242. Drive element; 243. Moving part; 25. Light shield; 251. Through hole; 252. Drive part; 253. Drive mating part; 26. Second sensor; 27. 1. Light-shielding plate limiting component; 3. Initial inspection mechanism; 31. Base plate; 32. First support frame; 321. First crossbeam; 322. Second crossbeam; 33. Initial inspection light source; 34. Initial inspection camera; 4. Re-inspection mechanism; 41. Second support frame; 42. Re-inspection camera; 43. Re-inspection light source; 44. Re-inspection adjustment component; 441. Lateral adjustment component; 442. Longitudinal adjustment component; 443. Angle adjustment component; 5. Internal inspection mechanism; 51. Internal inspection camera; 52. First internal inspection light source; 53. First adjustment component; 54. Second adjustment component; 6. First sliding mechanism; 61. First slide rail; 62. First slide plate; 7. Second sliding mechanism; 71. Second slide rail; 72. Second slide plate; 8. Wafer. Detailed Implementation
[0033] The present invention will be further described below with reference to the accompanying drawings and examples:
[0034] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.
[0035] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0036] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0037] Combination Figure 1 As shown, this embodiment of the present disclosure provides a wafer internal defect detection device, including a base plate 31, a clamping mechanism 2, a preliminary inspection mechanism 3, a re-inspection mechanism 4, and an internal inspection mechanism 5. The base plate 31 is provided with a first support frame 32 and a second support frame 41. The preliminary inspection mechanism 3 and the internal inspection mechanism 5 are disposed on the first support frame 32, and the re-inspection mechanism 4 is disposed on the second support frame 41. The re-inspection mechanism 4, the preliminary inspection mechanism 3, and the internal inspection mechanism 5 are arranged sequentially along a first direction. The clamping mechanism 2 is used to clamp the wafer 8 and can move relative to the re-inspection mechanism 4, the preliminary inspection mechanism 3, and the internal inspection mechanism 5 along a first direction and a second direction, wherein the first direction and the second direction are perpendicular to each other.
[0038] Using the wafer internal defect detection equipment provided in this embodiment, the wafer 8 is clamped by the clamping mechanism 2 and moved along the first direction to the corresponding position of the preliminary inspection mechanism 3. The preliminary inspection mechanism 3 performs preliminary identification and location of surface and internal defects of the wafer 8 to obtain preliminary defect information. During the inspection process, the clamping mechanism 2 can adjust the position of the wafer 8 along the first or second direction to meet the inspection requirements. After the preliminary inspection, the clamping mechanism 2 moves the wafer 8 along the first direction to the corresponding position of the re-inspection mechanism 4. The re-inspection mechanism 4 performs a second inspection of the defects of the wafer 8 based on the preliminary defect information to further determine the defect type. The wafer 8 is subjected to a re-inspection of its shape and morphology to obtain defect information. After the re-inspection, the clamping mechanism 2 moves the wafer 8 along the first direction to the corresponding position of the internal inspection mechanism 5. The internal inspection mechanism 5 is used to inspect the inside of the wafer 8 to obtain internal defect information. In the above wafer inspection equipment, multi-level inspection of wafer 8 defects, including initial inspection, re-inspection and internal inspection, can be completed, which improves the equipment integration and inspection efficiency. In the entire inspection process, the clamping mechanism 2 is used to move the wafer 8 to complete the multi-level inspection, avoiding multiple transfers and positioning of the wafer 8, which improves the inspection efficiency and accuracy to a certain extent, and also avoids secondary damage to the wafer 8.
[0039] Furthermore, the re-inspection mechanism 4, the initial inspection mechanism 3, and the internal inspection mechanism 5 are arranged sequentially along the first direction. Compared with the case where the initial inspection mechanism 3, the re-inspection mechanism 4, and the internal inspection mechanism 5 are arranged sequentially along the first direction, the length of the detection unit 122 along the first direction can be shortened to a certain extent, thereby reducing the volume of the wafer 8 inspection equipment.
[0040] like Figure 1 As shown, the first direction is the x-axis direction, and the second direction is the y-axis direction.
[0041] Based on the above technical solutions, such as Figure 1 As shown, the first support frame 32 includes a first crossbeam 321, which extends along a second direction. The initial inspection mechanism 3 includes an initial inspection light source 33 and multiple initial inspection cameras 34. The multiple initial inspection cameras 34 are evenly distributed on the first crossbeam 321 along the second direction. The initial inspection light source 33 is disposed on the base plate 31 and extends along the second direction. When the clamping mechanism 2 moves along the first direction to the point where the wafer 8 is correspondingly positioned with the initial inspection mechanism 3, the multiple initial inspection cameras 34 and the initial inspection light source 33 are respectively positioned above and below the wafer 8.
[0042] Specifically, the multiple preliminary inspection cameras 34 are line scan cameras. When the preliminary inspection mechanism 3 performs inspection, the preliminary inspection cameras 34 and the preliminary inspection light source 33 are turned on. The clamping mechanism 2 moves the wafer 8 along the first direction so that the wafer 8 passes under the multiple preliminary inspection cameras 34. The multiple preliminary inspection cameras 34 collect images of the surface of the wafer 8, perform preliminary identification and positioning of surface and internal defects of the wafer 8, and obtain preliminary inspection defect information. The preliminary inspection light source 33 is set under the wafer 8. When it shines upward on the wafer 8, if there are tiny holes inside the wafer 8, the light will be scattered after passing through the tiny holes. The preliminary inspection cameras 34 can capture the inconsistent light color on the surface of the wafer 8, thereby determining the location of internal defects and other information, so as to facilitate the internal inspection camera to detect internal defects of the wafer 8.
[0043] In this embodiment, as Figure 1 As shown, there are three primary inspection cameras 34. Depending on the selection of the primary inspection cameras 34, after the wafer 8 passes under the primary inspection cameras 34 for the first time, the sum of the shooting areas of the three primary inspection cameras 34 is half the area of the wafer 8. Therefore, the detection of the primary inspection mechanism 3 is divided into two steps. After the wafer 8 moves under the primary inspection cameras 34 for the first time, an image of a part of the surface of the wafer 8 is taken. The clamping mechanism 2 drives the wafer 8 to move a certain distance along the second direction, and then moves it again along the first direction so that the wafer 8 passes under the primary inspection cameras 34 and takes an image of the remaining part of the surface of the wafer 8 to complete the detection of the surface of the wafer 8 and obtain the primary inspection defect information of the surface of the wafer 8.
[0044] Based on the above technical solutions, such as Figure 1-3As shown, the second support frame 41 is disposed on one side of the first support frame 32 along the first direction. The re-inspection mechanism 4 includes a re-inspection camera 42 and a re-inspection light source 43. The re-inspection camera 42 is disposed on the second support frame 41, and the re-inspection light source 43 is disposed on the base plate 31. When the clamping mechanism 2 moves along the first direction to the point where the wafer 8 is correspondingly disposed with the re-inspection mechanism 4, the re-inspection camera 42 and the re-inspection light source 43 are respectively disposed above and below the wafer 8.
[0045] Specifically, based on the initial inspection defect information obtained by the initial inspection agency 3 and the relevant judgment criteria, the defects that need to be re-inspected in the initial inspection defect information are selected for re-inspection to further determine the defect type and morphology. The clamping mechanism 2 moves the wafer 8 along the first or second direction according to the defect position to be re-inspected so that the re-inspection camera 42 and the re-inspection light source 43 can observe and take images of the wafer 8 to obtain the re-inspection defect information.
[0046] To more precisely adjust the relative position between the inspection camera 42 and the wafer 8, such as Figure 2 As shown, a re-inspection adjustment component 44 is provided between the second support frame 41 and the re-inspection camera 42. The re-inspection adjustment component 44 includes a horizontal adjustment component 441, a vertical adjustment component 442 and an angle adjustment component 443, which are used to adjust the position of the re-inspection camera 42 along the first direction and the second direction, as well as the angle along the circumferential direction of the wafer 8.
[0047] The position of the re-inspection camera 42 relative to the wafer 8 along the first direction can be adjusted by the horizontal adjustment member 441, the position of the re-inspection camera 42 relative to the wafer 8 along the second direction can be adjusted by the vertical adjustment member 442, and the relative angle of the re-inspection camera 42 to the wafer 8 along the circumferential direction can be adjusted by the angle adjustment part, thereby achieving precise adjustment of the position of the re-inspection camera 42 relative to the wafer 8, so as to improve the imaging effect of the re-inspection camera 42 and improve the inspection accuracy of the wafer 8.
[0048] Based on the above technical solutions, such as Figure 4 As shown, the first support frame 32 includes a second crossbeam 322, which extends in the same direction as the first crossbeam 321 and is located below the first crossbeam 321. The internal inspection mechanism 5 includes an internal inspection camera 51, a first internal inspection light source 52, and a second internal inspection light source. The internal inspection camera 51 is located on the second crossbeam 322, the first internal inspection light source 52 is located on the base plate 31 and is located opposite to the internal inspection camera 51, and the second internal inspection light source is located on the internal inspection camera 51. When the clamping mechanism 2 moves along the first direction to the point where the wafer 8 is correspondingly positioned with the internal inspection mechanism 5, the internal inspection camera 51 and the first internal inspection light source 52 are respectively located above and below the wafer 8.
[0049] Specifically, the clamping mechanism 2 moves the wafer 8 along the first direction to the corresponding position of the internal inspection mechanism 5. The clamping mechanism 2 moves the wafer 8 along the first and second directions so that the internal inspection camera 51 can find internal defects in the wafer 8. The internal inspection camera 51 is equipped with a telecentric lens. The height of the internal inspection camera 51 relative to the wafer 8 is adjusted. The first internal inspection light source 52 is a transmission light source. Under the illumination of the first internal inspection light source 52, a clear image of the internal defects of the wafer 8 is captured at the first height. The second internal inspection light source is a coaxial light source of the internal inspection camera 51. Under the illumination of the second internal inspection light source, a clear image of the surface of the wafer 8 is captured at the second height. The height difference between the first height and the second height is the height difference between the internal defects of the wafer 8 and the surface of the wafer 8. In this way, we not only obtain the image of the internal defects of the wafer 8, but also measure the position of the internal defects of the wafer 8 relative to the surface of the wafer 8.
[0050] Furthermore, such as Figure 5 and Figure 6 As shown, a first adjusting member 53 is provided between the second crossbeam 322 and the internal inspection camera 51 for adjusting the height of the internal inspection camera 51, and a second adjusting member 54 is provided between the base plate 31 and the first internal inspection light source 52 for adjusting the height of the first internal inspection light source 52.
[0051] The first adjusting member 53 and the second adjusting member 54 can respectively adjust the height of the internal inspection camera 51 and the first internal inspection light source 52, thereby adjusting the height position of the internal inspection camera 51 and the first internal inspection light source 52 relative to the wafer 8, so as to improve the imaging effect of the internal inspection camera 51 and the first internal inspection light source 52 and improve the inspection accuracy of the wafer 8.
[0052] Furthermore, such as Figure 4 and Figure 7 As shown, the wafer internal defect detection equipment also includes a first sliding mechanism 6 and a second sliding mechanism 7. The first sliding mechanism 6 includes a first slide rail 61 and a first slide plate 62. The first slide rail 61 extends along a first direction and is disposed on the base plate 31. One end of the first slide plate 62 is slidably connected to the first slide rail 61, and the other end of the first slide plate 62 extends along a second direction. The second sliding mechanism 7 includes a second slide rail 71 and a second slide plate 72. The second slide rail 71 is disposed on the first slide plate 62 and extends along a second direction. The second slide plate 72 is slidably connected to the second slide rail 71. The clamping mechanism 2 is connected to the second slide plate 72.
[0053] Specifically, the first sliding mechanism 6 also includes a first drive motor, which drives the first slide plate 62 to slide along the first slide rail 61, thereby driving the second sliding mechanism 7 to move relative to the first slide rail 61 in a first direction, and thus driving the clamping mechanism 2 to move in the first direction. The second sliding mechanism 7 also includes a second drive motor, which drives the second slide plate 72 to slide along the second slide rail 71, thereby driving the clamping mechanism 2 to move in a second direction. The arrangement of the first sliding mechanism 6 and the second sliding mechanism 7 can drive the clamping mechanism 2 to move in the first and second directions, so as to facilitate the adjustment of the wafer 8 position during the inspection process and improve the inspection efficiency and effect.
[0054] Based on the above technical solutions, such as Figure 8 As shown, the clamping mechanism 2 includes a support frame 21, a first claw assembly 22, a second claw assembly 23, and a drive assembly 24. The support frame 21 is connected to the second slide plate 72. The first claw assembly 22 and the second claw assembly 23 are disposed opposite each other on the top wall of the support frame 21. The drive assembly 24 is disposed on one side of the first claw assembly 22. The drive assembly 24 is used to drive the first claw assembly 22 to move so as to cooperate with the second claw assembly 23 to clamp or release the wafer 8.
[0055] By setting a support frame 21 and setting a first jaw assembly 22 and a second jaw assembly 23 on the support frame 21, when the wafer 8 is clamped between the first jaw assembly 22 and the second jaw assembly 23, the drive assembly 24 moves from one side of the first jaw assembly 22 in a direction close to the first jaw assembly 22. When it moves to contact the first jaw assembly 22, it continues to move to drive the first jaw assembly 22 to move, so that the first jaw assembly 22 moves away from the wafer 8 to release the wafer 8. The drive assembly 24 moves in a direction away from the wafer 8, which can drive the first jaw assembly 22 to move in a direction close to the wafer 8, so as to cooperate with the second jaw assembly 23 to clamp the wafer 8.
[0056] Furthermore, such as Figure 9 As shown, the first jaw assembly 22 includes a driving engagement component 221 and a movable jaw 222. The driving engagement component 221 is rotatably connected to the support frame 21. The driving engagement component 221 includes a first end 2211 and a second end 2212. The first end 2211 is correspondingly disposed with the driving assembly 24, and the second end 2212 abuts against the movable jaw 222. When the driving assembly 24 moves in the direction close to the wafer 8, it can drive the driving engagement component 221 to rotate, thereby driving the movable jaw 222 to move in the direction away from the wafer 8, so that the movable jaw 222 moves from the clamping position of clamping the wafer 8 to the releasing position of releasing the wafer 8.
[0057] Specifically, this application takes two first claw assemblies 22 and two second claw assemblies 23 as an example. The two first claw assemblies 22 are disposed on one side of the top wall of the support frame 21, and the two second claw assemblies 23 are disposed on the other side of the top wall of the support frame 21. The drive assembly 24 can drive the two first claw assemblies 22 to move simultaneously. When the drive assembly 24 moves along the direction closer to the wafer 8, that is, when the drive assembly 24 gradually approaches the first end 2211 of the two drive mating parts 221, and moves until the drive assembly 24 contacts the first end 2211 of the two drive mating parts 221, the drive assembly 24 continues to move, causing the drive mating parts 221 to rotate relative to the support frame 21. During the rotation, the second end 2212 of the drive mating part 221 that abuts against the movable claw 222 moves along the direction away from the wafer 8, so as to drive the movable claw 222 away from the wafer 8 to release the wafer 8. The drive mating part 221 is configured to cooperate with the drive assembly 24 to drive the movable jaw 222 to move relative to the wafer 8, so as to achieve stable clamping of the wafer 8.
[0058] like Figure 9 As shown, the first jaw assembly 22 further includes an elastic element 223. The support frame 21 is provided with a first fixing block 211. The first fixing block 211 is disposed on the side of the movable jaw 222 away from the wafer 8. The elastic element 223 is disposed between the first fixing block 211 and the movable jaw 222. When the drive assembly 24 moves in the direction away from the wafer 8, the elastic element 223 drives the movable jaw 222 to move from the loose position to the clamping position.
[0059] like Figure 9 As shown, the movable jaw 222 has an extension rod 2221 on the side near the drive mating member 221, and the extension rod 2221 abuts against the second end 2212 of the drive mating member 221. When the drive assembly 24 moves along the direction close to the wafer 8, and moves to abut against the first end 2211 of the drive mating member 221, it continues to move to drive the drive mating member 221 to rotate. The second end 2212 of the drive mating member 221 abuts against the extension rod 2221 of the movable jaw 222. When the drive mating member 221 rotates, the movable jaw 222 moves through the extension rod 2221.
[0060] To limit the rotation angle of the drive mating part 221, such as Figure 9As shown, the first claw assembly 22 further includes a limiting part 224, which abuts against the side of the second end 2212 of the drive engagement member 221 that is close to the wafer 8, and the extension rod 2221 abuts against the side of the second end 2212 of the drive engagement member 221 that is away from the wafer 8. When the drive assembly 24 drives the drive mating part 221 to rotate so that the movable jaw 222 is in the released position, the drive assembly 24 moves away from the wafer 8, causing the drive mating part 221 to rotate until the second end 2212 of the drive mating part 221 abuts against the limiting part 224. The extension rod 2221 of the movable jaw 222 abuts against the second end 2212 of the drive mating part 221, thereby limiting the movable jaw 222 to the clamping position. The setting of the limiting part 224 can prevent the movable jaw 222 from excessively displacing in the direction close to the wafer 8, ensuring that the clamping force of the movable jaw 222 on the wafer 8 is moderate and avoiding damage to the wafer 8 due to excessive clamping.
[0061] To make the movement of the 222 claw more stable and smooth, such as Figure 9 As shown, the first claw assembly 22 also includes a third slide rail 225, which is disposed on the support frame 21. The third slide rail 225 extends along the radial direction of the wafer 8. The movable claw 222 can move along the third slide rail 225 toward the wafer 8 or away from the wafer 8 to clamp or release the wafer 8.
[0062] like Figure 10 As shown, the second claw assembly 23 includes a second fixing block 231 and a second claw 232. The second fixing block 231 is fixedly mounted on the support frame 21. The second fixing block 231 has a groove that extends radially along the wafer 8. The second claw 232 is located in the groove and has an elongated hole that extends radially along the wafer 8. The second fixing block 231 has a through hole 251. A fastener passes through the elongated hole and the through hole 251 to fix the second claw 232 to the second fixing block 231. By adjusting the position of the fastener relative to the elongated hole along the extension direction, the position of the second claw 232 relative to the wafer 8 can be adjusted.
[0063] Furthermore, such as Figure 11 As shown, the clamping mechanism 2 also includes a light-shielding plate 25, which is disposed on the bottom wall of the support frame 21. Both the support frame 21 and the light-shielding plate 25 have through holes 251 at their centers, and the size of the through holes 251 is adapted to the size of the wafer 8.
[0064] To prevent other ambient light from affecting the inspection of wafer 8, a light shield 25 is provided to block other light around wafer 8. The end of the movable claw 222 on the support frame 21 near wafer 8 protrudes from the support frame 21 to clamp wafer 8. The diameter of the through hole 251 of the support frame 21 is slightly larger than the diameter of wafer 8, and the diameter of the through hole 251 of the light shield 25 is slightly smaller than the diameter of wafer 8. In this way, when inspecting the lower surface of wafer 8, the light shield 25 can also block the interference position of the movable claw 222 on wafer 8, thus avoiding affecting the inspection.
[0065] Specifically, such as Figure 12 As shown, the second support frame 41 is provided with a driving part 252, and the light-shielding plate 25 is provided with a driving engagement part 253. The driving part 252 can drive the driving engagement part 253 to move downward, thereby moving the light-shielding plate 25 downward. An opening is provided on one side of the support frame 21. When the moving unit 111 moves the wafer 8 to the clamping mechanism 2, the driving part 252 of the second support frame 41 drives the driving engagement part 253 of the light-shielding plate 25 to move downward, thereby moving the light-shielding plate 25 downward, creating a gap between the light-shielding plate 25 and the support frame 21. The moving unit 111, carrying the wafer 8, extends into the support frame 21 through the opening and places the wafer 8 on the first claw assembly 22 and the second claw assembly 23. After the moving unit 111 is withdrawn, the driving part 252 drives the light-shielding plate 25 to return to its original position. The driving part 252 and the driving engagement part 253 prevent the light-shielding plate 25 from interfering with the movement and placement of the wafer 8. The drive unit 252 can be a pneumatic cylinder, a hydraulic cylinder, or an electric cylinder.
[0066] Based on the above technical solutions, such as Figure 13 As shown, the driving assembly 24 includes a fixing member 241, a driving member 242, and a moving member 243. The fixing member 241 is disposed on one side of the first claw assembly 22. The driving member 242 is disposed on the top of the fixing member 241. The moving member 243 is disposed on the top of the driving member 242. The driving member 242 can drive the moving member 243 to move in a direction close to or away from the wafer 8. The moving member 243 is provided with an extension. When the movable claw 222 moves from the clamping position to the releasing position, the end of the extension near the wafer 8 contacts the first end 2211 of the driving mating member 221.
[0067] Specifically, the movable member 243 can move relative to the fixed member 241 in a direction close to or away from the wafer 8 under the drive of the driving member 242. The extension of the movable member 243 extends in the direction close to the wafer 8 and is correspondingly disposed with the first end 2211 of the driving engagement member 221. When the wafer 8 needs to be removed, the driving member 242 drives the movable member 243 to move in the direction close to the wafer 8, so that the extension of the movable member 243 abuts against the first end 2211 of the driving engagement member 221, causing the driving engagement member 221 to rotate, so that the movable chuck 222 releases the wafer 8. The driving member 242 can be a piston cylinder or an electric cylinder.
[0068] Furthermore, such as Figure 13 As shown, the fixing member 241 is provided with a support rod 2411. One end of the support rod 2411 extends along the direction close to the wafer 8 to the bottom of the support frame 21 and is provided with a first sensor 2412. The support frame 21 is provided with a through hole, which is correspondingly arranged with the second end 2212 of the drive mating member 221. The first sensor 2412 is correspondingly arranged with the through hole. The first sensor 2412 is used to detect whether the movable claw 222 is in the clamping position or the loosening position.
[0069] Specifically, there can be one or more support rods 2411. When there are two or more first claw assemblies 22, the number of support rods 2411 is the same as the number of first claw assemblies 22, and they are set one-to-one with the first claw assemblies 22. Each first sensor 2412 detects whether the second end 2212 of the drive mating part 221 is located at the relative position of the through hole, thereby determining whether the movable claw 222 is in the clamping position or the loosening position.
[0070] Furthermore, such as Figure 13 As shown, the clamping mechanism 2 also includes a second sensor 26 and a light-shielding plate limiting member 27. The second sensor 26 is located below the wafer 8 and is used to detect whether the clamping mechanism 2 is clamping the wafer 8. The light-shielding plate limiting member 27 is located below the light-shielding plate 25 corresponding to the opening of the support frame 21. When the driving part 252 of the second support frame 41 drives the driving engagement part 253 on the light-shielding plate 25 to move, so that the light-shielding plate 25 moves downward, the light-shielding plate 25 moves to the light-shielding plate limiting member 27. The light-shielding plate limiting member 27 can limit the light-shielding plate 25, prevent the light-shielding plate 25 from moving too low, and also play a role in shock absorption and protection of the light-shielding plate 25 to a certain extent.
[0071] The present invention has been described above by way of example, but the present invention is not limited to the specific embodiments described above. Any modifications or variations made based on the present invention shall fall within the scope of protection claimed by the present invention.
Claims
1. A wafer internal defect detection device, characterized in that, The device includes a base plate, a clamping mechanism, a preliminary inspection mechanism, a re-inspection mechanism, and an internal inspection mechanism. The base plate is provided with a first support frame and a second support frame. The preliminary inspection mechanism and the internal inspection mechanism are located on the first support frame, and the re-inspection mechanism is located on the second support frame. The re-inspection mechanism, the preliminary inspection mechanism, and the internal inspection mechanism are arranged sequentially along a first direction. The clamping mechanism is used to clamp the wafer and can move relative to the re-inspection mechanism, the preliminary inspection mechanism, and the internal inspection mechanism along a first direction and a second direction, wherein the first direction and the second direction are perpendicular to each other.
2. The wafer internal defect detection equipment according to claim 1, characterized in that, The first support frame includes a first crossbeam extending along a second direction. The initial inspection mechanism includes an initial inspection light source and multiple initial inspection cameras. The multiple initial inspection cameras are evenly distributed on the first crossbeam along the second direction. The initial inspection light source is located on the base plate and extends along the second direction. When the clamping mechanism moves along the first direction to a position where the wafer and the initial inspection mechanism are aligned, the multiple initial inspection cameras and the initial inspection light source are respectively positioned above and below the wafer.
3. The wafer internal defect detection equipment according to claim 2, characterized in that, The second support frame is disposed on one side of the first support frame along the first direction. The re-inspection mechanism includes a re-inspection camera and a re-inspection light source disposed opposite to each other. The re-inspection camera is disposed on the second support frame, and the re-inspection light source is disposed on the base plate. When the clamping mechanism moves along the first direction to the point where the wafer and the re-inspection mechanism are correspondingly disposed, the re-inspection camera and the re-inspection light source are respectively disposed above and below the wafer.
4. The wafer internal defect detection equipment according to claim 3, characterized in that, A re-inspection adjustment component is provided between the second support frame and the re-inspection camera. The re-inspection adjustment component includes a horizontal adjustment component, a vertical adjustment component, and an angle adjustment component, which are used to adjust the position of the re-inspection camera along the first direction and the second direction, as well as the angle along the wafer circumference direction.
5. The wafer internal defect detection equipment according to claim 2, characterized in that, The first support frame includes a second crossbeam, which extends in the same direction as the first crossbeam and is located below the first crossbeam. The internal inspection mechanism includes an internal inspection camera, a first internal inspection light source, and a second internal inspection light source. The internal inspection camera is located on the second crossbeam, the first internal inspection light source is located on the base plate and is located opposite to the internal inspection camera, and the second internal inspection light source is located on the internal inspection camera. When the clamping mechanism moves along the first direction to the point where the wafer is positioned corresponding to the internal inspection mechanism, the internal inspection camera and the first internal inspection light source are respectively located above and below the wafer.
6. The wafer internal defect detection equipment according to claim 5, characterized in that, A first adjusting component is provided between the second crossbeam and the internal inspection camera to adjust the height of the internal inspection camera, and a second adjusting component is provided between the base plate and the first internal inspection light source to adjust the height of the first internal inspection light source.
7. The wafer internal defect detection equipment according to any one of claims 1 to 6, characterized in that, It also includes a first sliding mechanism and a second sliding mechanism. The first sliding mechanism includes a first slide rail and a first slide plate. The first slide rail extends along a first direction and is disposed on the base plate. One end of the first slide plate is slidably connected to the first slide rail, and the other end of the first slide plate extends along a second direction. The second sliding mechanism includes a second slide rail and a second slide plate. The second slide rail is disposed on the first slide plate and extends along a second direction. The second slide plate is slidably connected to the second slide rail. The clamping mechanism is connected to the second slide plate.
8. The wafer internal defect detection equipment according to any one of claims 1 to 6, characterized in that, The clamping mechanism includes a support frame, a first jaw assembly, a second jaw assembly, and a drive assembly. The support frame is connected to a second slide plate. The first jaw assembly and the second jaw assembly are disposed opposite each other on the top wall of the support frame. The drive assembly is disposed on one side of the first jaw assembly. The drive assembly is used to drive the first jaw assembly to move so as to cooperate with the second jaw assembly to clamp or release the wafer.
9. The wafer internal defect detection equipment according to claim 8, characterized in that, The first jaw assembly includes a driving engagement component and a movable jaw. The driving engagement component is rotatably connected to the support frame. The driving engagement component includes a first end and a second end. The first end is correspondingly disposed with the driving component, and the second end abuts against the movable jaw. When the driving component moves in the direction close to the wafer, it can drive the driving engagement component to rotate, thereby driving the movable jaw to move in the direction away from the wafer, so that the movable jaw moves from the clamping position of clamping the wafer to the releasing position of releasing the wafer.
10. The wafer internal defect detection equipment according to claim 9, characterized in that, The drive assembly includes a fixing member, a drive member, and a moving member. The fixing member is disposed on one side of the first jaw assembly, the drive member is disposed on the top of the fixing member, and the moving member is disposed on the top of the drive member. The drive member can drive the moving member to move in a direction closer to or away from the wafer. The moving member has an extension portion. When the movable jaw moves from the clamping position to the releasing position, the end of the extension portion near the wafer contacts the first end of the drive engagement member.