A turbulence nozzle for electroplating cleaning
By designing a mixed-flow nozzle structure and utilizing fluid momentum exchange to form a circulating flow, the problem of uneven spraying in electroplating nozzles was solved, achieving uniform coverage of the electroplated thin film layer and improving electroplating quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- GUANGDE DONGWEI TECH CO LTD
- Filing Date
- 2025-03-18
- Publication Date
- 2026-05-26
AI Technical Summary
Existing electroplating nozzles cannot achieve uniform liquid coverage on the material surface during the spraying process, resulting in uneven electroplated film thickness and affecting material performance.
A turbulence nozzle for electroplating cleaning, comprising a delivery pipe and a mixing nozzle, is designed. By setting a first nozzle, a second nozzle, and a third nozzle through the nozzle and providing a guide port on the middle side wall, the nozzle utilizes fluid momentum exchange to form a circulating flow, thereby achieving liquid mixing and a uniform spraying effect.
This achieves uniform coverage of the electroplated thin film layer on the circuit board surface, improving the electroplating quality and the overall performance of the materials.
Smart Images

Figure CN224272380U_ABST