Compound delivery and application device
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- QINGDAO MESNAC MACHINERY & ELECTRIC ENGINEERING CO LTD
- Filing Date
- 2025-05-08
- Publication Date
- 2026-05-26
AI Technical Summary
In existing technologies, the position control of the head and tail of the triangular adhesive during conveying and bonding is inaccurate, resulting in poor joint quality.
A rubber material conveying and bonding device was designed, including a material head gripping device and a material tail gripping device. By setting avoidance positions and guide rail mechanisms, the position of the material head and tail is ensured to be stable during the conveying process, and the bonding accuracy is improved by cutting and correction devices.
It achieves accurate positioning of the material head and tail, improves joint quality, avoids collisions of the gripping device, and improves production efficiency.
Smart Images

Figure CN224276314U_ABST