Photosensitive sensor and sensor assembly

By employing a special encapsulation structure with a light-transmitting plate and a high-layer pad in the photosensitive sensor, and adjusting the position of the getter, combined with wafer-level packaging, the problem of high cost of MEMS devices has been solved, resulting in a lower-cost and smaller-sized photosensitive sensor.

CN224279766UActive Publication Date: 2026-05-26HANGZHOU WEIYING SENSING ELECTRONICS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
HANGZHOU WEIYING SENSING ELECTRONICS CO LTD
Filing Date
2025-08-07
Publication Date
2026-05-26

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    Figure CN224279766U_ABST
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Abstract

The utility model provides a photosensitive sensor comprising a circuit substrate, a photosensitive sensor body, a light-transmitting plate and a heightening layer, the photosensitive sensor body is arranged on the circuit substrate, the heightening layer surrounds the photosensitive sensor body and is arranged on the circuit substrate, the light-transmitting plate is bonded with the heightening layer, and the light-transmitting plate is bonded with the heightening layer. The top opening of the heightening layer is sealed and is opposite to the photosensitive sensor body, the area of the top opening is smaller than that of the bottom opening of the heightening layer, and the area of the top opening is not smaller than that of the photosensitive surface of the photosensitive sensor body; the size of the light-transmitting plate is matched with the size of the top opening. The utility model also provides a sensor assembly.
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