A semiconductor electronic component electroplating fixture for high-speed electroplating lines

Abstract

This utility model discloses a semiconductor electronic component electroplating rack for high-speed electroplating lines, belonging to the technical field of semiconductor electronic component electroplating racks. It includes a clamp frame, a conductor, and an induction strip. A conductive strip is fixedly connected to the upper edge of the clamp frame via a non-welding method. The conductive strip is equipped with conductive hooks for placing lead frames. The conductive strip forms contact with the transmission steel strip of the high-speed tin plating production line, allowing the lead frames of the molded body's edge ribs to receive electroplating current. The induction strip is fixed along the depth direction to the side of the clamp frame away from the conductive strip via a non-welding method. The beneficial effects of this utility model are: it breaks through the traditional limitation that the edge ribs of the lead frame must be conductive; through the contact conductivity mechanism between the conductive strip and the steel strip, the lead frames of the molded body's edge ribs, which are not conductive, can be directly used in a steel strip-type high-speed tin plating production line, solving the problem of low efficiency in rack plating processes and improving production efficiency.

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