Pressure-sensing chip packaging sealing performance testing fixture

Abstract

This utility model relates to the field of testing fixture technology, specifically disclosing a chip packaging sealing performance testing fixture based on pressure sensing, comprising: a base plate, on the top of which mounting block one and mounting block two are respectively fixedly disposed, mounting slot one and mounting slot two are respectively formed on the top of mounting block one and mounting slot two, mounting slot one is fixedly disposed on the top of mounting slot one, and mounting slot two is disposed on the top of mounting slot two through a connecting component, and a testing mechanism is provided between mounting block one and mounting block two; this utility model forms a sealed cavity between mounting slot one and mounting slot two through the connecting component, and the sealing performance of the chip can be determined by the differential pressure change between pressure sensor one and pressure sensor two, without the need to drill holes on the chip, saving a sealing process, avoiding the need to drill micropores in the chip shell, and sealing after testing, reducing the risk of leakage due to secondary sealing, reducing testing steps, improving testing efficiency, and facilitating use.

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