FPGA-based general-purpose flash memory test system

CN224287790UActive Publication Date: 2026-05-26SHENZHEN DOUDAN TECHNOLOGY CO LTD

Patent Information

Authority / Receiving Office: CN · China
Patent Type: Utility models(China)
Current Assignee / Owner: SHENZHEN DOUDAN TECHNOLOGY CO LTD
Filing Date: 2025-08-21
Publication Date: 2026-05-26

AI Technical Summary

Technical Problem

Existing FPGA-based general-purpose flash memory testing systems are difficult to test multiple flash memory chips simultaneously in practical applications, which limits testing efficiency.

Method used

A general-purpose flash memory testing system based on FPGA was designed, including a test socket and an integrated flash memory detection module. The chip positioning component is fixed by a threaded hole, and the chip lifting and lowering movement is realized by a chip holding component and a spring-back component. The system is electrically connected to the integrated flash memory detection module through a probe component, and a heat dissipation area is set up for effective heat dissipation.

Benefits of technology

It enables the simultaneous testing of multiple flash memory chips, ensuring that each chip receives a stable and accurate test signal. It provides the hardware foundation for parallel testing of multiple chips, guarantees the accuracy and reliability of the test, and avoids test failures or chip damage caused by overheating.

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Abstract

This utility model provides a general-purpose flash memory testing system based on FPGA, belonging to the technical field of general-purpose flash memory testing equipment. The FPGA-based general-purpose flash memory testing system includes a test socket and an integrated flash memory detection module installed inside the test socket. Its key feature is that threaded holes are formed at the four corners of the test socket surface, and chip positioning components are installed via bolts through these threaded holes. A chip holding component is installed inside the chip positioning component. A spring-loaded component and a probe component are provided between the bottom of the chip holding component and the integrated flash memory detection module. Four heat dissipation zones are integrally formed on the surface of the chip positioning component at equal intervals, each corresponding to a chip position on the surface of the chip holding component. Through the coordinated operation of the chip positioning component, chip holding component, spring-loaded component, and probe component, the system effectively solves the problem of existing FPGA-based general-purpose flash memory testing systems being unable to test multiple flash memory chips simultaneously.

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