A TWS earphone antenna

CN224288584UActive Publication Date: 2026-05-26SHENZHEN AT COMM TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHENZHEN AT COMM TECH CO LTD
Filing Date
2025-07-30
Publication Date
2026-05-26

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Abstract

This utility model discloses a TWS earphone antenna, relating to the field of antenna technology. It includes a flexible substrate layer. A radiator is formed on the front side of the flexible substrate layer through an etching process. A gap is provided on the front side of the flexible substrate layer outside the radiator. A first connection point and a second connection point are respectively provided on the copper circuit on the front side of the flexible substrate layer within the gap. One radiating branch of the radiator extends between the first and second connection points and is in close contact with them. An insulating layer covers the surface of the radiator. An adhesive layer covers the back side of the flexible substrate layer. A recess is provided on one side of the flexible substrate layer. The radiator is distributed in a circumferential manner along the edge of the flexible substrate layer and can be directly attached and installed using the adhesive layer, making installation convenient. The radiator's placement on the flexible substrate layer enables the antenna to radiate omnidirectionally. The antenna structure using the flexible substrate layer is ultra-thin and flexible, adaptable to the installation requirements of wireless earphones of different shapes.
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