A leak-proof module for liquid cooling solutions

Abstract

This utility model discloses a leak-proof module for a liquid cooling solution, including a panel, a power interface assembly, a first I / O interface assembly, a second I / O interface assembly, and a switch assembly. The bottom circumference of the panel extends downwards with an embedded portion, which is annular and fits into the inner wall of the top opening of the chassis. Multiple threaded blind holes are provided on the outer side of the embedded portion, and a positioning groove is recessed at the bottom periphery of the panel. This positioning groove is annular and fits into the top of the chassis for positioning. A waterproof ring is embedded in the positioning groove. By extending an embedded portion onto the panel, fitting into the inner wall of the top opening of the chassis, and fitting into the positioning groove with the waterproof ring embedded in it, while the top of the chassis is embedded in the positioning groove and tightly abuts against the waterproof ring, this structure offers simple and stable installation, requires no high fitting precision, provides good sealing, and reduces the likelihood of coolant leakage, thus providing convenience for users.

Description

Technical Field

[0001] This utility model relates to the field of chassis technology, and in particular to a leak-proof module for liquid cooling solutions. Background Technology

[0002] A liquid-cooled chassis is a computer case that utilizes liquid cooling technology. Compared to traditional air cooling, liquid cooling offers higher heat dissipation efficiency and lower noise levels, making it widely used in high-performance computers, gaming PCs, and workstations. The core of a liquid-cooled chassis is the liquid cooling system, which typically consists of a radiator, tubing, a pump, a reservoir, and coolant. The coolant circulates between the radiator and water block within the chassis via the pump, absorbing and carrying away heat from components such as the CPU and GPU, before dissipating the heat into the air through the radiator.

[0003] Current liquid-cooled chassis mainly consist of a chassis shell, a PCB motherboard, and a front panel. The PCB motherboard is located inside the chassis shell, and the front panel seals over the opening of the chassis shell. This front panel houses components such as power interface assemblies, first I / O interface assemblies, second I / O interface assemblies, and switching assemblies. These components typically require cables for connection to the PCB motherboard. In existing technology, the front panel is fitted and fixed to the top outer side of the chassis shell, with a waterproof ring sandwiched between the outer wall of the chassis shell and the inner wall of the front panel. This structure requires a high degree of precision in the fit between the outer wall of the chassis shell and the inner wall of the front panel; otherwise, poor sealing can easily lead to coolant leakage. Therefore, it is necessary to research a solution to address these issues. Utility Model Content

[0004] In view of this, the present invention addresses the deficiencies of the existing technology, and its main purpose is to provide a leak-proof module for liquid cooling solutions, which can effectively solve the problem of poor sealing between the existing panel and the chassis shell, which easily leads to leakage.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A leak-proof module for a liquid cooling solution includes a panel, a power interface assembly, a first I / O interface assembly, a second I / O interface assembly, and a switch assembly. The outer surface of the panel has a first hole, a second hole, a third hole, and a fourth hole. An insert extends downwards from the bottom circumference of the panel. The insert is annular and fits into the inner wall of the top opening of the chassis. Multiple threaded blind holes are formed on the outer side of the insert. A positioning groove is recessed at the bottom periphery of the panel. This positioning groove is annular and mates with the top of the chassis for positioning. A waterproof ring is embedded in the positioning groove, and the waterproof ring is aligned with the top of the chassis. The top fits snugly against the panel; the power interface assembly is sealed and installed with the panel, and the power interface assembly has a power interface exposed in the first hole; the first I / O interface assembly is sealed and installed with the panel, and the first I / O interface assembly has a first I / O interface exposed in the second hole; the second I / O interface assembly is sealed and installed with the panel, and the second I / O interface assembly has a second I / O interface exposed in the third hole; the switch assembly is sealed and installed with the panel, and the switch assembly has a switch exposed in the fourth hole.

[0007] As a preferred embodiment, there are multiple first holes arranged on the outer peripheral side of the panel. Correspondingly, the power interface assembly has multiple power interfaces, which are respectively located in the corresponding first holes.

[0008] As a preferred embodiment, the second, third, and fourth holes are all located on the top surface of the panel.

[0009] As a preferred embodiment, the panel has a first groove, in which the power interface assembly is embedded and fixed and sealed by potting glue, resulting in a stable and reliable installation with good waterproof sealing.

[0010] As a preferred embodiment, the panel is recessed with a second groove, and the first I / O interface component is embedded in the second groove and fixed and sealed by potting glue, which ensures a stable and reliable installation and good waterproof sealing performance.

[0011] As a preferred embodiment, the panel is recessed with a third groove, and the second I / O interface component is embedded in the third groove and fixed and sealed by potting glue, which ensures a stable and reliable installation and good waterproof sealing performance.

[0012] As a preferred embodiment, the switch is installed in the fourth hole and secured by tightening a nut.

[0013] Compared with the prior art, this utility model has obvious advantages and beneficial effects. Specifically, as can be seen from the above technical solution:

[0014] By extending an embedded part on the panel, which fits into the inner wall of the top opening of the chassis, and a positioning groove is provided on the panel, a waterproof ring is embedded in the positioning groove, and the top of the chassis is embedded in the positioning groove and tightly abuts against the waterproof ring. This structure is simple and stable to install, does not require high fitting precision, has a good sealing effect, and is not prone to coolant leakage, bringing convenience to use.

[0015] To more clearly illustrate the structural features and effects of this utility model, the following detailed description of this utility model is provided in conjunction with the accompanying drawings and specific embodiments. Attached Figure Description

[0016] Figure 1 This is a three-dimensional assembly diagram of a preferred embodiment of the present invention;

[0017] Figure 2 This is a three-dimensional assembly schematic diagram of a preferred embodiment of the present invention from another angle;

[0018] Figure 3 This is an exploded view of a preferred embodiment of the present invention;

[0019] Figure 4 This is an exploded view from another angle of a preferred embodiment of the present invention;

[0020] Figure 5 This is a three-dimensional schematic diagram of the preferred embodiment of the present invention in its usage state.

[0021] Figure 6 This is an exploded view of the preferred embodiment of this utility model in its usage state;

[0022] Figure 7 This is a cross-sectional view of the preferred embodiment of the present invention in its usage state;

[0023] Figure 8 This is an enlarged schematic diagram of the panel in a preferred embodiment of the present invention;

[0024] Figure 9 This is an enlarged schematic diagram of the panel from another angle in a preferred embodiment of the present invention.

[0025] Explanation of reference numerals in the attached diagram:

[0026] 10. Panel 11. Embedded part

[0027] 12. Waterproof ring 101, First hole position

[0028] 102, Second Hole Position; 103, Third Hole Position

[0029] 104. Fourth hole position; 105. Threaded blind hole

[0030] 106. Positioning groove; 107. First groove

[0031] 108. Second groove 109. Third groove

[0032] 20. Power interface assembly 21. Power interface

[0033] 30. First I / O interface component 31. First I / O interface

[0034] 40. Second I / O interface component 41. Second I / O interface

[0035] 50. Switch assembly 51. Switch

[0036] 52. Nuts; 60. Chassis shell

[0037] 61. Through hole; 62. Screw

[0038] 63. Sealing ring 64. Connector

[0039] 70. PCB motherboard. Detailed Implementation

[0040] Please refer to Figures 1 to 9 As shown, it illustrates the specific structure of a preferred embodiment of the present invention, including a panel 10, a power interface assembly 20, a first I / O interface assembly 30, a second I / O interface assembly 40, and a switch assembly 50.

[0041] The outer surface of the panel 10 is provided with a first hole 101, a second hole 102, a third hole 103, and a fourth hole 104. An insert portion 11 extends downwards from the bottom circumference of the panel 10. The insert portion 11 is annular and fits into the inner wall of the top opening of the chassis 60. Multiple threaded blind holes 105 are provided on the outer side of the insert portion 11. A positioning groove 106 is recessed at the bottom periphery of the panel 10. The positioning groove 106 is annular and engages with the top of the chassis 60 for positioning. A waterproof ring 12 is embedded in the positioning groove 106, and the waterproof ring 12 abuts tightly against the top of the chassis 60. In this embodiment, there are multiple first holes 101 arranged on the outer peripheral side of the panel 10; the second holes 102, the third holes 103, and the fourth holes 104 are all located on the top surface of the panel 10, and there are multiple second holes 102, third holes 103, and fourth holes 104. Furthermore, the panel 10 is recessed and has a first groove 107, a second groove 108, and a third groove 109.

[0042] The power interface assembly 20 is sealed and fitted to the panel 10. The power interface assembly 20 has a power interface 21 exposed in the first hole 101. In this embodiment, the power interface assembly 20 is embedded in the first groove 107 and fixed and sealed by potting adhesive, resulting in a stable and reliable installation with good waterproof sealing. Furthermore, the power interface assembly 20 has multiple power interfaces 21, each located in a corresponding first hole 101.

[0043] The first I / O interface assembly 30 is sealed and fitted to the panel 10. The first I / O interface assembly 30 has a first I / O interface 31, which is exposed in the second hole 102. In this embodiment, the first I / O interface assembly 30 is embedded in the second groove 108 and fixed and sealed by potting adhesive, resulting in a stable and reliable installation with good waterproof sealing. There are multiple first I / O interfaces 31, each exposed in a corresponding second hole 102.

[0044] The second I / O interface assembly 40 is sealed and fitted to the panel 10. The second I / O interface assembly 40 has a second I / O interface 41, which is exposed in the third hole 103. In this embodiment, the second I / O interface assembly 40 is embedded in the third groove 109 and fixed and sealed by potting adhesive, resulting in a stable and reliable installation with good waterproof sealing. Multiple second I / O interfaces 41 are present, each exposed in a corresponding third hole 103.

[0045] The switch assembly 50 is installed in a sealed fit with the panel 10. The switch assembly 50 has a switch 51, which is exposed in the fourth hole 104. In this embodiment, the switch 51 is installed in the fourth hole 104 and tightened and fixed by the nut 52, which ensures a stable and reliable installation and good waterproof sealing.

[0046] The assembly process of this embodiment is described in detail below:

[0047] First, the switch assembly 50 is installed into the fourth hole 104 and tightened with the nut 52. Next, the first I / O interface assembly 30 is embedded in the second groove 108 and fixed and sealed with glue. Then, the second I / O interface assembly 40 is embedded in the third groove 109 and fixed and sealed with glue. Next, the power interface assembly 20 is embedded in the first groove 107 and fixed and sealed with glue. Finally, the waterproof ring 12 is embedded in the positioning groove 106, thus completing the assembly of the module.

[0048] In use, the PCB motherboard 70 is fixed in the chassis 60, and the plugs of the power interface assembly 20, the first I / O interface assembly 30, the second I / O interface assembly 40, and the switch assembly 50 are first connected to the corresponding interfaces of the PCB motherboard 70. Then, the panel 10 is placed over the top opening of the chassis 60. The top periphery of the chassis 60 has multiple through holes 61, so that the top of the chassis 60 is embedded in the positioning groove 106 and tightly abuts against the waterproof ring 12. At this time, the multiple through holes 61 are respectively connected to multiple threaded blind holes 105. Next, multiple screws 62 are used to put on the sealing ring 63 and then pass through the through holes 61 and lock them in place with the threaded blind holes 105, so that the internal space of the chassis 60 is isolated from the outside. Finally, coolant is injected into the chassis 60 through the connector 64.

[0049] The key design feature of this invention is that an embedded part extends from the panel, which is adapted to the inner wall of the top opening of the chassis shell. A positioning groove is set on the panel, and a waterproof ring is embedded in the positioning groove. At the same time, the top of the chassis shell is embedded in the positioning groove and tightly abuts against the waterproof ring. This structure is simple and stable to install, does not require high fitting precision, has a good sealing effect, and is not prone to coolant leakage, thus bringing convenience to use.

[0050] The above description is merely a preferred embodiment of the present utility model and does not constitute any limitation on the technical scope of the present utility model. Therefore, any minor modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model shall still fall within the scope of the technical solution of the present utility model.

Claims

1. A leak-proof module for a liquid cooling solution, characterized by: It includes a panel, a power interface assembly, a first I / O interface assembly, a second I / O interface assembly, and a switch assembly; the outer surface of the panel has a first hole, a second hole, a third hole, and a fourth hole; the bottom circumference of the panel extends downward to form an insert, which is annular and fits into the inner wall of the top opening of the chassis; the outer side of the insert has multiple threaded blind holes; and the bottom periphery of the panel has a recessed positioning groove, which is annular and fits into the top of the chassis for positioning; a waterproof ring is embedded in the positioning groove, which is in close contact with the top of the chassis. The power interface assembly is sealed and installed with the panel, and the power interface assembly has a power interface exposed in a first hole; the first I / O interface assembly is sealed and installed with the panel, and the first I / O interface assembly has a first I / O interface exposed in a second hole; the second I / O interface assembly is sealed and installed with the panel, and the second I / O interface assembly has a second I / O interface exposed in a third hole; the switch assembly is sealed and installed with the panel, and the switch assembly has a switch exposed in a fourth hole.

2. The leak-proof module for liquid cooling solution according to claim 1, wherein: There are multiple first holes arranged on the outer peripheral side of the panel. Correspondingly, the power interface assembly has multiple power interfaces, which are respectively located in the corresponding first holes.

3. The leak-proof module for liquid cooling solution of claim 1, wherein: The second, third, and fourth holes are all located on the top surface of the panel.

4. The leak-proof module for liquid cooling solution of claim 1, wherein: The panel has a first groove, and the power interface assembly is embedded in the first groove and fixed and sealed by potting glue.

5. The leak-proof module for liquid cooling solution of claim 1, wherein: The panel has a second recess, and the first I / O interface component is embedded in the second recess and fixed and sealed by potting.

6. The leak-proof module for liquid cooling solution of claim 1, wherein: The panel has a third recess, and the second I / O interface component is embedded in the third recess and fixed and sealed by potting.

7. The leak-proof module for liquid cooling solution of claim 1, wherein: The switch is installed in the fourth hole and secured by tightening the nut.

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