Visual panel-level plastic package mold for semiconductor forming

Abstract

The utility model discloses a visual panel level plastic package mould for semiconductor molding, which comprises an upper mould and a lower mould, the upper mould comprises a vacuum cover and a mould body positioned in the vacuum cover, one side of the vacuum cover is provided with a visual window, the mould body comprises a base station and a panel assembly, the outer wall of the side edge of the base station is fixedly connected with the inner wall of the vacuum cover, and the panel assembly is fixedly connected with the vacuum cover. The bottom surface of the base table is fixedly connected with the top surface of the panel assembly, the panel assembly is provided with a light path part corresponding to the visible window, and the light path part is used for reflecting the semiconductor forming condition in the plastic package mold to the visible window. According to the visual panel-level plastic package mold, the forming condition of a semiconductor in the plastic package mold can be directly observed from the visual window of the upper mold, so that the problems occurring in the semiconductor forming process can be conveniently mastered, and the visual panel-level plastic package mold can be designed in a targeted manner according to an area where the quality of a product is poor.

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