Circuit board electroplating tank structure and electroplating equipment
The problem of uneven mixing during the electroplating process of circuit boards was solved by multi-directional jet stirring, which improved the uniformity of the electroplated layer and the efficiency of electroplating, adapts to different current scenarios, and ensures the quality of electroplating.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HANS CNC SCI & TECH
- Filing Date
- 2025-07-18
- Publication Date
- 2026-05-29
Smart Images
Figure CN224299424U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of electroplating equipment technology, and more specifically, to a circuit board electroplating tank structure and electroplating equipment. Background Technology
[0002] In circuit board manufacturing, vertical continuous electroplating plays a crucial role in metal electrodeposition, particularly when plating through-holes and blind vias on circuit boards, where high uniformity and deposition efficiency of the electroplated layer are essential. Copper electroplating often involves dividing the entire plating process into multiple copper tank sections to improve throughput and control precision. Each copper tank section is typically equipped with cross-spray nozzles, using a back-spraying method along the thickness direction of the workpiece to agitate the electroplating solution. This ensures thorough flow and exchange of the solution on the workpiece surface and within the holes, achieving a stable electroplating reaction. Theoretically, more thorough agitation allows for higher current densities, thus increasing plating efficiency. However, the back-spraying method suffers from uneven agitation, resulting in poor solution turnover in holes or shaded areas, hindering the achievement of suitable current values.
[0003] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this application, and therefore may include information that does not constitute prior art known to those skilled in the art. Utility Model Content
[0004] The purpose of this application is to provide a circuit board electroplating tank structure and electroplating equipment, aiming to solve the technical problem of uneven stirring in the spraying method in related technologies.
[0005] To achieve the above objectives, the technical solution adopted in this application is as follows:
[0006] The first aspect of this application provides a circuit board electroplating tank structure for vertical continuous electroplating, including: a plating tank and a spray assembly;
[0007] The electroplating tank is used to hold the electroplating solution;
[0008] The spray assembly is disposed in the electroplating tank;
[0009] The spray assembly is configured to spray the electroplating solution onto the circuit board from above, which is placed in the electroplating tank, and is also configured to spray the electroplating solution onto the circuit board from below, and to spray the electroplating solution onto the circuit board along the thickness direction of the circuit board.
[0010] In some implementations, the spray assembly includes a first spray unit, a second spray unit, and a third spray unit, with the first spray unit located above the second spray unit;
[0011] The first spraying unit is used to spray the electroplating solution onto the circuit board placed in the electroplating tank from above.
[0012] The second spray unit is used to spray the electroplating solution onto the circuit board from below;
[0013] The third spraying unit is used to spray the electroplating solution onto the circuit board along the thickness direction of the circuit board.
[0014] In some implementations, the first spray unit includes: a first spray pipe and a plurality of first nozzles, wherein the plurality of first nozzles are spaced apart along the length direction of the first spray pipe;
[0015] The length extension direction of the first spray pipe is parallel to the length direction of the electroplating tank.
[0016] In some implementations, the second spray unit includes: a second spray pipe and a plurality of second nozzles, wherein the plurality of second nozzles are spaced apart along the length direction of the second spray pipe;
[0017] The length extension direction of the second spray pipe is parallel to the length direction of the electroplating tank.
[0018] In some implementations, the third spray unit includes: a third spray pipe and a plurality of third nozzles, wherein the plurality of third nozzles are spaced apart along the length direction of the third spray pipe;
[0019] The length of the third spray pipe extends parallel to the height of the electroplating tank.
[0020] In some implementations, the circuit board electroplating tank structure further includes a filter device, which is connected to the first spray unit, the second spray unit and the third spray unit respectively;
[0021] The first spray unit includes a first valve, the second spray unit includes a second valve, and the third spray unit includes a third valve;
[0022] The filtration device is connected to the first valve, the second valve, and the third valve, respectively.
[0023] In some implementations, the electroplating tank includes multiple electroplating sub-tanks;
[0024] The electroplating sub-tank is provided with at least one of the first spray unit, the second spray unit, and the third spray unit.
[0025] In some implementations, the electroplating tank includes two electroplating sub-tanks;
[0026] The two electroplating sub-tanks are a first sub-tank and a second sub-tank; the first sub-tank is provided with the first spray unit and / or the second spray unit, and the second sub-tank is provided with the third spray unit.
[0027] In some implementations, the first sub-slot is provided with two vertical spray groups, and the second sub-slot is provided with one lateral spray group;
[0028] Two vertical spray groups are distributed at intervals in the width direction of the electroplating tank. Each vertical spray group includes a first spray unit and a second spray unit. In the vertical spray group, the first spray unit and the second spray unit are arranged facing each other in the vertical direction.
[0029] The lateral spray group includes two third spray units, which are spaced apart in the width direction of the electroplating tank.
[0030] A second aspect of this application provides an electroplating apparatus, including at least one circuit board electroplating tank structure as described in any of the above implementations.
[0031] The main advantages of the circuit board electroplating tank structure and electroplating equipment provided in this application are:
[0032] This application sprays electroplating solution from above, below, and along the thickness direction of the circuit board during the initial, peak, and finishing stages of via filling, respectively, forming a three-dimensional solution flow path. Compared to the cross-spraying method (horizontal spraying) in related technologies, multi-directional spraying effectively covers all areas inside the vias and on the circuit board surface, reducing dead zones and obstructed areas in the solution flow, and significantly enhancing the fluidity and exchange efficiency of the electroplating solution within the via structures to be plated (such as through-holes and blind vias). The multi-directional spraying and stirring method also ensures a more uniform distribution of metal ions (such as copper ions) in the electroplating solution within the vias and on the circuit board surface, thereby improving the uniformity and density of the electroplated layer. Furthermore, the multi-directional spraying and stirring method allows for more thorough agitation of the electroplating solution, supporting higher current densities and shortening the plating time, thus improving plating efficiency and throughput. In addition, the multi-directional jet stirring method can adapt to three current scenarios under different current values (first current, second current, and third current), so that the electroplating solution can be fully stirred under different current conditions, thereby ensuring the quality of electroplating and filling at different times, and thus ensuring the quality of electroplating and filling of circuit boards. Attached Figure Description
[0033] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0034] Figure 1 This is a schematic flowchart of the circuit board electroplating hole filling method provided in the embodiments of this application;
[0035] Figure 2 This is a front view of the circuit board electroplating tank structure provided in the embodiments of this application;
[0036] Figure 3 This is a right view of the circuit board electroplating tank structure provided in the embodiments of this application;
[0037] Figure 4 This is a bottom view of the circuit board electroplating tank structure provided in the embodiments of this application;
[0038] Figure 5 This is a partial structural schematic diagram of the electroplating tank for a circuit board provided in an embodiment of this application;
[0039] Figure 6 This is a partial structural schematic diagram of the circuit board electroplating tank provided in an embodiment of this application from another perspective;
[0040] Figure 7 This is a schematic diagram of the pipe connection structure provided in the embodiments of this application;
[0041] Figure 8 This is a schematic diagram from another perspective of the pipe connection structure provided in the embodiments of this application;
[0042] Figure 9 This is a schematic diagram of the structure of the first nozzle provided in an embodiment of this application;
[0043] Figure 10 This is a schematic diagram of the structure of the third nozzle provided in the embodiment of this application.
[0044] Explanation of key figure labels:
[0045] 102. Electroplating tank; 103. First spray unit; 104. Second spray unit; 105. Third spray unit; 106. First spray pipe; 107. First nozzle; 108. Second spray pipe; 109. Second nozzle; 110. Third spray pipe; 111. Third nozzle; 112. Main spray pipe; 113. Filter device; 115. Pipe connection structure; 116. Elbow; 117. Union ball valve; 18. First valve; 119. Second valve; 120. Third valve; 121. First sub-slot; 122. Second sub-slot; 123. Vertical spray assembly; 124. Side spray assembly; 125. First pipe section; 126. Connecting rod; 127. Second pipe section; 128. Inlet end; 129. Outlet end; 130. Variable diameter liquid outlet chamber; 131. Spray pipe section; 132. First liquid outlet hole; 133. Second liquid outlet hole. Detailed Implementation
[0046] In related technologies, when using vertical continuous electroplating processes to plate through-holes, blind holes, and other structures on circuit boards, high requirements are placed on the uniformity and deposition efficiency of the electroplated layer. Copper electroplating often involves dividing the entire plating process into multiple copper tank sections to improve production capacity and control precision. Each copper tank section is typically equipped with cross-spray nozzles, using a back-spraying method along the thickness direction of the workpiece to agitate the electroplating solution, ensuring sufficient flow and exchange of the solution on the workpiece surface and within the holes to achieve a stable electroplating reaction. Theoretically, the more thorough the agitation, the higher the current density that can be withstood, thus improving electroplating efficiency; however, the back-spraying method suffers from uneven agitation, resulting in poor solution renewal in holes or shaded areas, making it difficult to increase the applicable current value. Furthermore, when the state of the electroplating solution (such as concentration, temperature, and additive distribution) is kept the same across all tank sections (i.e., "equal-state solution"), the different currents in different tank sections can easily lead to quality problems during PCB electroplating, i.e., "electroplating defects." These anomalies may include uneven plating, insufficient copper plating inside holes, surface roughness, or defects.
[0047] Therefore, this application provides a method for filling holes in circuit board electroplating, a circuit board, a circuit board electroplating tank structure, and electroplating equipment to solve the problems in related technologies.
[0048] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.
[0049] See Figure 1 As shown, this application provides a circuit board electroplating via filling method for vertical continuous plating (VCP).
[0050] In the circuit board electroplating via filling method provided in this application embodiment, the circuit board can be completely immersed in the electroplating solution. The circuit board electroplating via filling method is mainly used to electroplat and fill via structures to be electroplated on the circuit board. The via structures to be electroplated may include blind vias and through-holes, or only blind vias, or only through-holes. The circuit board may include one or more of the following: printed circuit board (PCB), flexible printed circuit board (FPC), rigid-flex board, high-density interconnect (HDI), integrated circuit substrate, metal core PCB, glass substrate, and ceramic substrate. When electroplating and filling via structures to be electroplated on the circuit board, the circuit board can act as a cathode or be suspended on a cathode holder, thereby realizing the electroplating of the via structures to be electroplated on the circuit board. The electroplating solution can be contained in the electroplating tank 102 of the electroplating equipment.
[0051] In the embodiments of this application, the circuit board electroplating hole filling method may include at least some or all of the following steps.
[0052] Step S100: Apply a first current to the circuit board and spray electroplating solution from the top of the circuit board to the circuit board for electroplating the hole structure to be electroplated on the circuit board in the initial stage of hole filling. In this way, the first current can be used to pre-plat the hole structure to be electroplated, and spraying can enhance the flow of electroplating solution, promote the uniform distribution of copper ions, additives, etc. in the electroplating solution, and reduce electroplating defects caused by uneven local concentration of electroplating solution; in addition, sufficient electroplating solution flow allows the use of higher electroplating current, thereby improving electroplating efficiency.
[0053] For step S100, since it is performed during the initial stage of via filling, the current value of the first current is less than the current used in other stages of via filling. When spraying the electroplating solution onto the circuit board, the spraying direction of the electroplating solution can be parallel to the surface of the circuit board or at a certain angle, which can be determined according to the actual situation. Furthermore, it is understood that due to the different thicknesses of different types of circuit boards, the depths of blind holes and / or through holes on the circuit board will vary, therefore the flow rate of the electroplating solution sprayed from the top of the circuit board may differ. The electroplating solution may contain copper ions, which can achieve the formation of a metallic conductive layer, such as a copper layer, on the hole walls and / or openings of the hole structure to be electroplated. The electroplating solution may also include additives, which can optimize the deposition behavior of copper ions by adjusting the chemical and physical properties of the electroplating solution, thereby improving the plating quality, uniformity, and electroplating efficiency. Additives may include one or more of brighteners, inhibitors, leveling agents, stabilizers, and wetting agents, which can be added according to actual needs, and this application does not impose specific limitations. The initial stage of via filling, also known as the additive adsorption equilibrium stage, is the initial phase of via-filling electroplating. It primarily involves pre-plating with a relatively low initial current to allow additives (such as inhibitors, leveling agents, and accelerators) in the plating solution to be uniformly adsorbed within the vias and / or blind holes of the circuit board, forming a thin and uniform initial copper layer. This lays the foundation for subsequent high-current via filling. During this initial stage, spraying the plating solution downwards from the top of the circuit board promotes the uniform adsorption of additives (such as inhibitors and leveling agents), forming an initial copper layer and preparing for subsequent via filling. Furthermore, top spraying creates a uniform liquid flow that covers the surface of the circuit board and the via openings, improving the stability of the pre-plating stage.
[0054] Step S200: Apply a second current to the circuit board and spray electroplating solution from the bottom of the circuit board to the top of the circuit board. This is used to electroplat the hole structure to be electroplated during the hole filling burst period. In this way, the second current can be used to enhance the electroplating, and the upward spray can further enhance the flow of the electroplating solution. Together with the upward spray, a more comprehensive electroplating solution circulation is formed, reducing dead zone areas.
[0055] In step S200, since it occurs during the via-filling burst period, the second current value is larger than the first current value. When spraying the electroplating solution onto the circuit board, the spraying direction of the electroplating solution can be parallel to the surface of the circuit board or at a certain angle, depending on the actual situation. Furthermore, it is understood that due to the different thicknesses of different types of circuit boards, the depths of blind vias and / or through-holes on the circuit board will vary. Therefore, the flow rate of the electroplating solution sprayed from the bottom of the circuit board can be different from or the same as the spraying flow rate in step S100. The via-filling burst period is the core stage of via-filling electroplating. A larger second current rapidly continues deposition on the initial copper layer, preferentially filling through-holes or blind vias to achieve efficient via filling. Thus, during the via-filling burst period, spraying the electroplating solution upwards from the bottom of the circuit board enhances the mass transfer efficiency of the electroplating solution within the holes, promotes rapid copper deposition, fills through-holes or blind vias, and improves via-filling efficiency.
[0056] Step S300: Apply a third current to the circuit board and spray electroplating solution onto the circuit board along the thickness direction of the circuit board. This is used to electroplat the hole structure to be electroplated during the hole filling and finishing period. The current values of the first current, the second current, and the third current are all different. Applying the third current to the circuit board in this way can achieve stable electroplating. In addition, this spraying method can directly act on the interior of the hole structure to be electroplated, which can significantly improve the flow and renewal of the electroplating solution inside the hole structure. For example, it is more suitable for holes with high aspect ratio or complex hole structures.
[0057] In step S300, since it is performed during the via filling and finishing stage, the current value of the third current is less than that of the second current. It is understood that because different types of circuit boards have different thicknesses, the depths of blind and / or through holes on the circuit board will vary. Therefore, the flow rate of the electroplating solution sprayed along the thickness direction of the circuit board can be different from or the same as the spraying flow rate in steps S100 and S200. The via filling and finishing stage is the final stage of the via filling electroplating. A moderate third current is used to further thicken the plating layer on top of the copper layer formed during the via filling burst stage, optimizing surface quality and ensuring the conductivity and appearance of the circuit board. During the via filling and finishing stage, the electroplating solution is sprayed symmetrically or in a staggered manner along the thickness direction of the circuit board. This creates cross-flows, improves mixing uniformity, thickens the plating layer, enhances plating uniformity, optimizes surface smoothness and brightness, and ensures overall quality.
[0058] The circuit board electroplating via filling method provided in this application involves spraying electroplating solution from above, below, and along the thickness direction of the circuit board during the initial filling stage, the peak filling stage, and the finishing stage, respectively. This creates a three-dimensional flow path for the solution. Compared to the cross-spraying method (horizontal spraying) in related technologies, multi-directional spraying effectively covers all areas inside the via and on the surface of the circuit board, reducing dead zones and obstructed areas in the solution flow. This significantly enhances the fluidity and exchange efficiency of the electroplating solution within the via structure (such as through-holes and blind vias). The multi-directional spraying and stirring method also ensures a more uniform distribution of metal ions (such as copper ions) in the electroplating solution within the via and on the surface of the circuit board, thereby improving the uniformity and density of the electroplated layer. Furthermore, the multi-directional spraying and stirring method allows for more thorough stirring of the electroplating solution, supporting higher current densities and shortening the electroplating time, thus improving electroplating efficiency and throughput. The multi-directional jet agitation method effectively mitigates the uneven state of the electroplating solution caused by current differences in different tank sections, thereby reducing plating defects such as uneven coating, insufficient copper plating in holes, and surface roughness or other defects. Furthermore, the multi-directional jet agitation method can adapt to different current values (first, second, and third currents), ensuring thorough agitation of the plating solution under varying current conditions. This guarantees the quality of the electroplating and hole filling at different stages, ultimately ensuring the quality of the electroplating and hole filling on the circuit board.
[0059] In some embodiments, when spraying the electroplating solution onto the circuit board from the top of the circuit board in step S100, the spraying pressure can be set as needed. When spraying the electroplating solution onto the circuit board from the bottom of the circuit board in step S200, the spraying pressure can be set as needed. When spraying the electroplating solution onto the circuit board along its thickness direction in step S200, the spraying pressure can also be set as needed, and the electroplating solution can be sprayed onto at least one of the two opposing surfaces of the circuit board. The duration of the initial filling period and the duration of the burst filling period are both shorter than the duration of the filling finishing period; this short initial filling period allows for rapid wetting and initial deposition, avoiding waste of the electroplating solution, while creating conditions for efficient filling during the burst filling period. A longer filling finishing period helps improve the quality of the electroplated layer (such as smoothness and uniformity), reduces subsequent processing requirements, and ensures the reliability and long-term stability of the circuit board.
[0060] Understandably, during the initial stage of via filling, the electroplating solution can be sprayed from the bottom of the circuit board and / or along the thickness direction of the circuit board, as needed. During the peak stage of via filling, the electroplating solution can also be sprayed from the top of the circuit board and / or along the thickness direction of the circuit board, as needed; during the finishing stage of via filling, the electroplating solution can also be sprayed from the top of the circuit board and / or from the bottom of the circuit board, as needed; this facilitates more thorough agitation of the electroplating solution.
[0061] In some embodiments, the current value of the third current can be greater than the current value of the first current, and the current value of the second current can be greater than the current value of the third current. This different adaptation to different spraying methods can improve the quality of electroplating filling.
[0062] In some embodiments, the first current has a value of 9A-11A, the second current has a value of 140A-160A, and the third current has a value of 20A-150A. For example, the first current can be 9A, 10A, or 11A; the second current can be 140A, 145A, 150A, 155A, or 160A. It is understood that the second current can also be set to a value greater than 160A as needed; the third current can be 20A, 50A, 75A, 90A, 95A, 100A, 125A, 130A, or 150A. The value of the third current can also be calculated based on the required copper plating thickness of the circuit board.
[0063] It should be noted that in some other possible implementations, when applying the first current, the current can be gradually increased to the set value required for the first current value in a gradient manner, such as by using an arithmetic sequence or stepless adjustment to increase the current to the set value required for the first current value. This can avoid uneven electroplating in the hole caused by excessive current in the initial stage.
[0064] Combination Figures 1 to 3 As shown, in some embodiments, the method of spraying electroplating solution onto the circuit board from above in step S100 includes: continuously spraying electroplating solution onto the circuit board using a first nozzle 107 during the initial stage of via filling. This continuous spraying of electroplating solution using the first nozzle 107 ensures the electroplating quality of the circuit board during the initial stage of via filling. For example, the first nozzle 107 may remain in a spraying state until the circuit board is removed from the electroplating tank.
[0065] Combination Figures 1 to 3As shown in some embodiments, for step S200, the method of spraying electroplating solution onto the circuit board from below includes: continuously spraying electroplating solution onto the circuit board using a second nozzle 109 during the via-filling burst period; thus, by continuously spraying the electroplating solution using the second nozzle 109, the electroplating quality of the circuit board during the via-filling burst period can be guaranteed. For example, the second nozzle 109 can remain in the spraying state until the circuit board is removed from the electroplating tank.
[0066] Combination Figures 1 to 3 As shown in some embodiments, for step S300, the method of spraying electroplating solution onto the circuit board along the thickness direction of the circuit board includes: continuously spraying electroplating solution onto the circuit board using a third nozzle 111 during the through-hole filling and finishing period; thus, by continuously spraying the electroplating solution using the third nozzle 111, the electroplating quality of the circuit board during the through-hole filling and finishing period can be guaranteed. Exemplarily, the third nozzle 111 can remain in the spraying state until the circuit board is removed from the electroplating tank.
[0067] Understandably, the first nozzle 107 and the second nozzle 109 can adopt the same structure. This design simplifies the equipment structure, reduces manufacturing and maintenance costs, and ensures process consistency between the two stages. The third nozzle 111, however, uses a different structure from the first nozzle 107 and the second nozzle 109. This allows it to meet the refined requirements of electroplating during the finishing stage, improving the quality of electroplating filling on the circuit board. Furthermore, when spraying from below onto the circuit board, the second nozzle 109 can be rotated or tilted to ensure that the electroplating solution evenly covers the orifice and the upper part of the orifice wall, reducing over-plating at the orifice.
[0068] It should be noted that in some other possible embodiments, the structures of the first nozzle 107 and the second nozzle 109 may also be different. For example, the first nozzle 107 may be a round orifice nozzle or a multi-hole nozzle, while the second nozzle 109 may be a slit nozzle, which can increase the injection pressure of the second nozzle 109.
[0069] In this embodiment of the application, the electroplating tank 102 may include one or more electroplating sub-tanks. It is understood that the number of electroplating sub-tanks can be set as needed.
[0070] In one embodiment, the initiation phase, the burst phase, and the finishing phase of the via filling are performed in different electroplating sub-batteries, that is, steps S100, S200, and S300 can be performed in different electroplating sub-batteries. Thus, at least three electroplating sub-batteries are required when electroplating via filling of the circuit board.
[0071] In another embodiment, the initiation phase, the burst phase, and the finishing phase of the via filling are all performed in the same electroplating sub-tank, that is, steps S100, S200, and S300 are all performed in the same electroplating sub-tank. In this way, only one electroplating sub-tank is needed when electroplating via filling of the circuit board.
[0072] In another embodiment, the initial filling phase is carried out in one electroplating sub-battery, and the filling burst phase and filling finishing phase are carried out in another electroplating sub-battery. That is, step S100 is carried out in one electroplating sub-battery, while steps S200 and S300 can be carried out in another electroplating sub-battery. Thus, at least two electroplating sub-batteries are required when electroplating and filling the circuit board.
[0073] In another embodiment, the initial filling phase and the filling finishing phase are carried out in one electroplating sub-battery, and the filling burst phase is carried out in another electroplating sub-battery. That is, steps S100 and S300 are carried out in the same electroplating sub-battery, while step S200 is carried out in another electroplating sub-battery. Thus, at least two electroplating sub-batteries are required when electroplating and filling the circuit board.
[0074] It should be noted that in some other possible embodiments, the initial filling stage and the peak filling stage may be carried out in one electroplating sub-tank, while the filling modification stage may be carried out in another electroplating sub-tank. Furthermore, the filling modification stage may be carried out in one or more electroplating sub-tanks as needed. Moreover, the same electroplating solution may be used for the initial filling stage, the peak filling stage, and the filling modification stage, or different electroplating solutions may be used as needed.
[0075] This application also provides a circuit board having at least one of blind vias and through vias; the blind vias are filled using the circuit board electroplating filling method described in any of the above embodiments; and / or, the through vias are filled using the circuit board electroplating filling method described in any of the above embodiments.
[0076] This application also provides a circuit board electroplating tank structure for vertical continuous electroplating. It is understood that the circuit board electroplating hole-filling method in any embodiment of this application can be implemented using the circuit board electroplating tank structure provided in any embodiment of this application to fill the holes in the circuit board.
[0077] Combination Figures 2 to 6As shown, the circuit board electroplating tank structure provided in this application embodiment includes: an electroplating tank 102 and a spray assembly. The electroplating tank 102 is used to hold electroplating solution; the spray assembly is disposed in the electroplating tank 102, and the spray assembly includes a first spray unit 103, a second spray unit 104, and a third spray unit 105. The first spray unit 103 is located above the second spray unit 104; the first spray unit 103 is used to spray electroplating solution from above the circuit board placed in the electroplating tank 102 onto the circuit board; the second spray unit 104 is used to spray electroplating solution from below the circuit board onto the circuit board; and the third spray unit 105 is used to spray electroplating solution onto the circuit board along the thickness direction of the circuit board. The above-described circuit board electroplating tank structure has the same technical effects as the circuit board electroplating hole-filling method provided in the foregoing embodiment, and will not be repeated here. It should be noted that... Figure 2 , Figure 3 and Figure 4 This is a perspective view of the circuit board electroplating tank structure in an embodiment of this application, showing its internal structure.
[0078] In some embodiments, the electroplating tank 102 can be made of PP, PVC, PVDF, fiberglass, stainless steel, or polytetrafluoroethylene. The circuit board electroplating tank structure is not limited to copper plating; it can also be used for zinc or nickel plating. The bottom of the electroplating tank may have a drain hole, which can be fitted with a plug or an electric valve to facilitate drainage.
[0079] Combination Figures 2 to 6 As shown, in some embodiments, the first spray unit 103 includes a first spray pipe 106 and a plurality of first nozzles 107, the plurality of first nozzles 107 being spaced apart along the length direction of the first spray pipe 106; the length extension direction of the first spray pipe 106 is parallel to the length direction of the electroplating tank 102. Step S200 can be executed by utilizing the first spray unit 103, which can enhance the flow of the electroplating solution, promote the uniform distribution of copper ions, additives, etc. in the electroplating solution, and reduce electroplating defects caused by uneven local concentrations in the electroplating solution; in addition, sufficient flow of the electroplating solution allows for the use of a higher electroplating current, thereby improving electroplating efficiency. For example, during use, at least the first nozzles are immersed in the electroplating solution; the plurality of first nozzles 107 can be evenly spaced along the length direction of the first spray pipe 106. It is understood that the first spray pipe 106 and the first nozzles 107 can be detachably fixedly connected, such as by plug-in or threaded connection. The number of first nozzles 107 on the first spray pipe 106 can be one or more. When there are multiple nozzles, the number of first nozzles 107 can be 1-50. The first spray unit 103 can be fixed to the electroplating tank 102 by a bracket (not shown).
[0080] Combination Figures 2 to 6As shown, in some embodiments, the second spray unit 104 includes a second spray pipe 108 and a plurality of second nozzles 109, the plurality of second nozzles 109 being spaced apart along the length direction of the second spray pipe 108; the length extension direction of the second spray pipe 108 is parallel to the length direction of the electroplating tank 102. Step S300 can be executed by utilizing the second spray unit 104, which can further enhance the flow of the electroplating solution, cooperating with the upward spray to form a more comprehensive electroplating solution circulation and reduce dead zones. Exemplarily, the plurality of second nozzles 109 can be evenly spaced along the length direction of the second spray pipe 108. It is understood that the second spray pipe 108 and the second nozzles 109 can be detachably fixedly connected, for example, by plug-in or threaded connection. The number of second nozzles 109 on the second spray pipe 108 can be one or more; when there are multiple nozzles, the number of second nozzles 109 can be 1-50.
[0081] Combination Figures 2 to 6 As shown, in some embodiments, the third spray unit 105 includes a third spray pipe 110 and a plurality of third nozzles 111, the plurality of third nozzles 111 being spaced apart along the length direction of the third spray pipe 110; the length extension direction of the third spray pipe 110 is parallel to the height direction of the electroplating tank 102. Step S400 can be executed by utilizing the third spray unit 105, which can directly act on the interior of the hole structure to be electroplated, significantly improving the flow and renewal of the electroplating solution inside the hole structure, and is particularly suitable for high aspect ratio holes or complex hole structures. For example, the plurality of third nozzles 111 can be evenly spaced along the length direction of the third spray pipe 110. The third spray unit 105 can have multiple third spray pipes 110, which are spaced apart along the length direction of the electroplating tank 102. The third spray unit 105 also includes a main spray pipe 112, and multiple third spray pipes 110 are fixedly connected to the main spray pipe 112. It can be understood that the connection between the third spray pipes 110 and the main spray pipes 112 can be detachable, such as by plugging or threading. The number of third nozzles 111 on the third spray pipe 110 can be one or more. When there are multiple nozzles, the number of third nozzles 111 can be 1-50.
[0082] It should be noted that in some other possible embodiments, the first spray pipe 106, the second spray pipe 108 and the main spray pipe 112 can adopt the same structure, which can improve the versatility of the spray assembly and achieve interchangeability through detachable connection.
[0083] Combination Figures 2 to 6As shown, in some embodiments, the circuit board electroplating tank structure further includes a filter device 113, which is connected to the first spray unit 103, the second spray unit 104, and the third spray unit 105, respectively. This filter device 113 not only achieves filtration but also enhances the spraying power of the spray assembly. For example, the input end of the filter device 113 is connected to the electroplating tank 102, and the output end of the filter device 113 is connected to the first spray unit 103, the second spray unit 104, and the third spray unit 105, respectively. The filter device 113 can be connected to the first spray unit 103 via a pipe connection structure 115; the filter device 113 can be connected to the second spray unit 104 via a pipe connection structure 115; and the filter device 113 can be connected to the third spray unit 105 via a pipe connection structure 115.
[0084] See Figure 7 and Figure 8 As shown, the pipe connection structure 115 may include an elbow 116 and a union ball valve 117. One end of the union ball valve 117 is connected to the spray pipe (first spray pipe 106, second spray pipe 108, or main spray pipe 112), and the other end of the union ball valve 117 is connected to one end of the elbow 116. The other end of the elbow 116 is connected to the filter device 113. The union ball valve 117 refers to a ball valve with a union structure, which is a type of valve that is easy to install, disassemble, and maintain. The number of filter devices 113 can be one or more.
[0085] Combination Figures 2 to 6 As shown, in some embodiments, the first spray unit 103 includes a first valve 118, the second spray unit 104 includes a second valve 119, and the third spray unit 105 includes a third valve 120. The filter device 113 is connected to the first valve 118, the second valve 119, and the third valve 120 respectively. Thus, the first valve 118 can be used to open or close the first nozzle 107, the second valve 119 can be used to open or close the second nozzle 109, and the third valve 120 can be used to open or close the third nozzle 111. For example, the first valve 118 is connected to the first spray pipe 106 via a pipe connection structure 115, the second valve 119 is connected to the second spray pipe 108 via a pipe connection structure 115, and the third valve 120 is connected to the third spray pipe 110 via a pipe connection structure 115. The first valve 118 can be an electric ball valve or a solenoid valve; the second valve 119 can be an electric ball valve or a solenoid valve; and the third valve 120 can be an electric ball valve or a solenoid valve.
[0086] Combination Figures 2 to 6As shown, in some embodiments, the electroplating tank 102 includes multiple electroplating sub-tanks; each electroplating sub-tank is provided with at least one of a first spray unit 103, a second spray unit 104, and a third spray unit 105. Exemplarily, one or more of the first spray unit 103, the second spray unit 104, and the third spray unit 105 can be provided in the electroplating sub-tank as needed. For different electroplating sub-tanks, the first spray unit 103, the second spray unit 104, and the third spray unit 105 can be provided simultaneously, or only the first spray unit 103 and the second spray unit 104, or only the second spray unit 104 and the third spray unit 105, or only the first spray unit 103, or only the second spray unit 104, or only the third spray unit 105.
[0087] Combination Figures 2 to 6 As shown, in some embodiments, the electroplating tank 102 may include two electroplating sub-tanks; the two electroplating sub-tanks are a first sub-tank 121 and a second sub-tank 122; the first sub-tank 121 is provided with a first spray unit 103 and a second spray unit 104, and the second sub-tank 122 is provided with a third spray unit 105. It is understood that, for the first sub-tank 121, when both the first spray unit 103 and the second spray unit 104 are provided, only the first spray unit 103 can be used, only the second spray unit 104 can be used, or both the first spray unit 103 and the second spray unit 104 can be used. The first sub-tank 121 and the second sub-tank 122 may be connected or disconnected.
[0088] Combination Figures 2 to 6As shown, in some embodiments, two vertical spray groups 123 are provided in the first sub-tank 121, and one lateral spray group 124 is provided in the second sub-tank 122; the two vertical spray groups 123 are spaced apart in the width direction of the electroplating tank 102, and each vertical spray group 123 includes a first spray unit 103 and / or a second spray unit 104, which are arranged facing each other in the vertical direction; the lateral spray group 124 includes two third spray units 105, which are spaced apart in the width direction of the electroplating tank 102. Exemplarily, the circuit board electroplating tank structure may also include a cathode hanger and an anode, the cathode hanger being used to mount the circuit board; in the width direction of the electroplating tank 102, the cathode hanger is located between the two vertical spray groups 123, and the cathode hanger is also located between the two third spray units 105 of the lateral spray group 124. In the two third spray units 105 of the side spray group 124, the distance between two adjacent third nozzles 111 on the third spray pipe 110 of one third spray unit 105 may not be equal to the distance between adjacent third nozzles 111 on the third spray pipe 110 of the other third spray unit 105. This allows for a staggered vertical distribution of the third nozzles 111 on the third spray pipe 110 of one third spray unit 105 and the third nozzles 111 on the third spray pipe 110 of the other third spray unit 105. When there are multiple filter devices 113, there may be two: one vertical spray group 123 and one third spray unit 105 in the side spray group 124 are connected to one filter device 113; the other vertical spray group 123 and the other third spray unit 105 in the side spray group 124 are connected to the other filter device 113.
[0089] Combination Figure 5 and Figure 9As shown, in some embodiments, the structure of the first nozzle 107 is the same as that of the second nozzle, which simplifies the complexity of the device. The structure of the first nozzle 107 will be described in detail below, and the structure of the second nozzle can be referred to the description of the structure of the first nozzle 107. Exemplarily, the first nozzle 107 includes a first tube portion 125, a connecting rod 126, and a second tube portion 127. One end of the connecting rod 126 is fixedly connected to the outer surface of the first tube portion 125, and the other end of the connecting rod 126 is fixedly connected to the outer surface of the second tube portion 127. There can be multiple connecting rods 126, which are evenly spaced along the circumference of the first tube portion 125. The inlet end 128 of the first tube portion 125 is threadedly connected to the first spray pipe. The outlet end 129 of the first tube 125 extends toward the inlet end 128 of the second tube 127. The inlet end 128 of the second tube 127 is funnel-shaped, which facilitates the flow of fluid ejected from the outlet end 129 of the first tube 125 to the second tube 127. The second tube 127 has a variable diameter liquid outlet chamber 130. The diameter of the variable diameter liquid outlet chamber 130 gradually increases from the inlet end 128 of the second tube 127 toward the outlet end 129 of the second tube 127, which facilitates better stirring of the electroplating solution.
[0090] Combination Figure 6 and Figure 10 As shown, in some embodiments, the third nozzle 111 has a spray pipe portion 131, with a plurality of first liquid outlet holes 132 circumferentially spaced on the spray pipe portion 131. The spray pipe portion 131 also has a second liquid outlet hole 133, which is located at the axial end of the spray pipe portion 131, thus enabling more thorough stirring of the electroplating solution. Exemplarily, the third nozzle 111 and the third spray pipe 110 can be fixedly connected by snap-fit or by threaded connection; the number of first liquid outlet holes 132 can be two, and the two first liquid outlet holes 132 are symmetrically distributed on the spray pipe portion 131.
[0091] This application provides an electroplating apparatus, including at least one circuit board electroplating tank structure as described in any of the above embodiments. It is understood that the circuit board electroplating via filling method in any embodiment of this application can be implemented using the electroplating apparatus provided in any embodiment of this application to fill vias in the circuit board. The above-described electroplating apparatus has the same technical effects as the circuit board electroplating via filling method provided in the foregoing embodiments, and will not be repeated here.
[0092] It should be understood that, in the embodiments of this application, unless otherwise expressly specified and limited, the terms "connection," "fixed connection," "contact," etc., should be interpreted broadly. Those skilled in the art can understand the specific meanings of the various terms in the embodiments of this application according to the specific circumstances.
[0093] For example, the "connection" can be a fixed connection, a rotating connection, a flexible connection, a sliding connection, a one-piece molding, an electrical connection, a contact connection, or other connection methods; it can be a direct connection, or an indirect connection through an intermediate medium, or a connection within two components or an interaction between two components.
[0094] For example, a "fixed connection" can be a component that can be directly or indirectly fixedly connected to another component; a fixed connection can include mechanical connection, welding, bonding or integral molding, etc., wherein mechanical connection can include riveting, bolting, threaded connection, keying, snap-fit connection, locking connection, plugging, etc., and bonding can include adhesive bonding and solvent bonding, etc.
[0095] It should also be understood that the “parallel” or “perpendicular” described in the embodiments of this application can be understood as “approximately parallel” or “approximately perpendicular”.
[0096] It should also be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Features specified as "first" or "second" may explicitly or implicitly include one or more of that feature.
[0097] In the embodiments of this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature and the second feature are in direct contact, or that the first feature and the second feature are in indirect contact through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0098] It should also be understood that the terms “length,” “width,” “up,” “down,” “front,” “back,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” and “outer,” etc., indicate the orientation or positional relationship (if any) based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.
[0099] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of protection of the claims. In conclusion, the above description is merely a preferred embodiment of the technical solution of this application and is not intended to limit the scope of protection of this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.
Claims
1. A circuit board electroplating tank structure for vertical continuous electroplating, characterized in that, include: An electroplating tank, the electroplating tank being used to hold electroplating solution; A spray assembly is disposed in the electroplating tank; The spray assembly is configured to spray the electroplating solution onto the circuit board from above, which is placed in the electroplating tank, and is also configured to spray the electroplating solution onto the circuit board from below, and to spray the electroplating solution onto the circuit board along the thickness direction of the circuit board.
2. The circuit board electroplating tank structure as described in claim 1, characterized in that, The spray assembly includes a first spray unit, a second spray unit, and a third spray unit, with the first spray unit located above the second spray unit; The first spraying unit is used to spray the electroplating solution onto the circuit board placed in the electroplating tank from above. The second spray unit is used to spray the electroplating solution onto the circuit board from below; The third spraying unit is used to spray the electroplating solution onto the circuit board along the thickness direction of the circuit board.
3. The circuit board electroplating tank structure as described in claim 2, characterized in that, The first spray unit includes: a first spray pipe and a plurality of first nozzles, wherein the plurality of first nozzles are spaced apart along the length direction of the first spray pipe; The length extension direction of the first spray pipe is parallel to the length direction of the electroplating tank.
4. The circuit board electroplating tank structure as described in claim 2, characterized in that, The second spray unit includes: a second spray pipe and a plurality of second nozzles, wherein the plurality of second nozzles are spaced apart along the length direction of the second spray pipe; The length extension direction of the second spray pipe is parallel to the length direction of the electroplating tank.
5. The circuit board electroplating tank structure as described in claim 2, characterized in that, The third spray unit includes: a third spray pipe and a plurality of third nozzles, wherein the plurality of third nozzles are spaced apart along the length direction of the third spray pipe; The length of the third spray pipe extends parallel to the height of the electroplating tank.
6. The circuit board electroplating tank structure as described in any one of claims 2-5, characterized in that, The circuit board electroplating tank structure also includes a filter device, which is connected to the first spray unit, the second spray unit and the third spray unit respectively; The first spray unit includes a first valve, the second spray unit includes a second valve, and the third spray unit includes a third valve; The filtration device is connected to the first valve, the second valve, and the third valve, respectively.
7. The circuit board electroplating tank structure as described in any one of claims 2-5, characterized in that, The electroplating tank includes multiple electroplating sub-tanks; The electroplating sub-tank is provided with at least one of the first spray unit, the second spray unit, and the third spray unit.
8. The circuit board electroplating tank structure as described in claim 7, characterized in that, The electroplating tank includes two electroplating sub-tanks; The two electroplating sub-tanks are a first sub-tank and a second sub-tank; the first sub-tank is provided with the first spray unit and / or the second spray unit, and the second sub-tank is provided with the third spray unit.
9. The circuit board electroplating tank structure as described in claim 8, characterized in that, The first sub-slot is equipped with two vertical spray groups, and the second sub-slot is equipped with one lateral spray group; Two vertical spray groups are distributed at intervals in the width direction of the electroplating tank. Each vertical spray group includes a first spray unit and a second spray unit. In the vertical spray group, the first spray unit and the second spray unit are arranged facing each other in the vertical direction. The lateral spray group includes two third spray units, which are spaced apart in the width direction of the electroplating tank.
10. An electroplating device, characterized in that, It includes at least one circuit board electroplating tank structure as described in any one of claims 1-9.