An observation device for droplet morphology

Abstract

The application discloses a kind of liquid drop shape observation devices, and the observation device includes bottom plate, observation module, upper substrate and lower substrate;Wherein, observation module includes observation camera, point light source and first adjusting unit, observation camera is oppositely arranged with point light source, to make the light of point light source be observed by observation camera after passing through liquid drop;Liquid drop is located between upper substrate and lower substrate, and upper substrate and lower substrate are parallel with bottom plate;First adjusting unit is arranged on bottom plate, and first adjusting unit is fixedly connected with observation module, to make first adjusting unit adjust the position and angle of observation camera and point light source, to observe the morphology of liquid drop.The application can observe the micro-nano structure of liquid drop.

Description

Technical Field

[0001] This application relates to the field of droplet morphology observation, specifically to a device for observing droplet morphology. Background Technology

[0002] Currently, the sizes of micro- and nanostructures are typically in the micrometer to nanometer range. Their large specific surface area significantly increases the proportion of surface atoms or molecules, leading to a substantial enhancement of interfacial effects. For example, at the micro- and nanoscale, the surface energy and surface tension of materials change, affecting the contact angle and wettability of liquids on the surface of micro- and nanostructures, thus significantly influencing the flow behavior of liquids within them. Superhydrophobic micro- and nanostructure surfaces, due to their unique micro-geometry and chemical composition, enable droplets to exhibit extremely small contact angle hysteresis and extremely high roll-off angles, allowing liquids to roll rapidly on the surface and carry away dust and other impurities, demonstrating self-cleaning properties.

[0003] However, observation of micro- and nano-structures is necessary both during and after their fabrication; therefore, how to observe micro- and nano-structures has become a problem that needs to be solved.

[0004] The above description of the background technology is only used for understanding the relevant technology and is not considered to be prior art known to those skilled in the art. Utility Model Content

[0005] This application provides a device for observing droplet morphology, which can observe the micro-nano structure of droplets.

[0006] This application discloses a droplet morphology observation device, comprising a base plate, an observation module, an upper substrate, and a lower substrate. The observation module includes an observation camera, a point light source, and a first adjustment unit. The observation camera is positioned opposite the point light source so that light from the point light source passes through the droplet and is observed by the observation camera. The droplet is located between the upper substrate and the lower substrate, both of which are parallel to the base plate. The first adjustment unit is disposed on the base plate and fixedly connected to the observation module, allowing the first adjustment unit to adjust the position and angle of the observation camera and the point light source, thereby observing the droplet morphology.

[0007] In the above scheme, a droplet located between the upper and lower substrates receives light from a point light source, which then enters the observation camera to observe the droplet's morphology. The upper and lower substrates are preferably ITO glass plates, but can also be conductive rigid substrates. A voltage is applied to the upper and lower substrates to change the droplet's morphology, which is then observed by the camera. The material of the droplet is not limited, and the distance between the upper and lower substrates is on the order of micrometers. Both the upper and lower substrates are parallel to the base plate, facilitating vertical positioning of the upper and lower substrates by the positioning camera and horizontal observation of the droplet's morphology by the observation camera. Using the base plate as a reference plane also facilitates adjustment of the parallelism between the upper and lower substrates. The droplet morphology changes rapidly, requiring the observation camera to capture hundreds of images per second. Furthermore, because the distance between the upper and lower substrates is on the order of micrometers, if the parallelism between the upper and lower substrates is not met, the observation camera may fail to observe the droplet morphology, or the distorted droplet morphology may result in inaccurate observations.

[0008] In one possible implementation, the observation device includes a lower substrate fixing module, which includes a second adjustment unit and a first fixing area; wherein the second adjustment unit is disposed on the base plate and is fixedly connected to the first fixing area so that the second adjustment unit can adjust the position and angle of the first fixing area; the first fixing area is provided with a plurality of negative pressure holes, and the first fixing area fixes the lower substrate by vacuum adsorption through the plurality of negative pressure holes.

[0009] The above solution discloses a lower substrate fixing module, and the first fixing area can fix the lower substrate by vacuum adsorption; the fixing method is simple.

[0010] In one possible implementation, a first limiting block is provided at the apex of the first fixing area; wherein the first limiting block is right-angled and closely fits the apex corner of the first fixing area to limit the lower substrate.

[0011] In the above scheme, there is no limit to the number of the first limit blocks.

[0012] In one possible implementation, a plurality of leveling operation holes are provided on the plate surface where the first fixing area is located, and leveling threads are provided in the leveling operation holes so that the parallelism between the lower substrate and the upper substrate can be adjusted by operating the leveling threads.

[0013] In the above scheme, the leveling operation hole facilitates fine-tuning of the parallelism between the upper and lower substrates. The first fixing area is parallel to the base plate and can be manually adjusted; the second fixing area of ​​the upper substrate is also parallel to the base plate and can be manually adjusted. Based on this, the parallelism between the upper and lower substrates can be identified using the leveling sensor. If the parallelism is not within the required range, fine-tuning can be performed manually using the leveling thread in the leveling operation hole to ensure the parallelism between the upper and lower substrates meets the requirements. Here, fine-tuning refers to micrometer-level adjustment.

[0014] In one possible implementation, the observation device includes an upper substrate fixing module, which includes a second fixing area, a third adjustment unit, and a leveling sensor. The third adjustment unit is disposed on the base plate and fixedly connected to the second fixing area to adjust the position and angle of the second fixing area. The second fixing area has multiple negative pressure holes, and the upper substrate is fixed by vacuum adsorption through these holes. The leveling sensor is disposed at the vertex cutout of the second fixing area and located at the vertex of the upper substrate to measure the distance between the vertex of the upper substrate and the corresponding vertex of the lower substrate; one leveling sensor corresponds to one vertex of the upper substrate.

[0015] In the above scheme, given the high parallelism requirement between the upper and lower substrates, four leveling sensors are installed at the four corners of the second fixing area. Any one of these sensors can detect the distance between corresponding positions on the upper and lower substrates. When the distance is outside the preset range or is not a preset distance, it is adjusted via the leveling threads in the aforementioned leveling operation holes. This method ensures that the distance between the four corresponding positions on the upper and lower substrates meets the requirements, and also ensures that the parallelism between the upper and lower substrates meets the requirements. The leveling sensors can be spectral confocal displacement sensors, which detect distances at the micrometer level. The vertex cutouts at the four corners of the second fixing area also facilitate the leveling sensors' detection of the distance between the upper and lower substrates.

[0016] In one possible implementation, a second limiting block is provided at the apex of the second fixing area; wherein the second limiting block is right-angled and closely fits the apex corner of the second fixing area to limit the upper substrate.

[0017] In the above scheme, there is no limit to the number of the second limiting blocks. The limiting blocks (the first limiting block and the second limiting block) are set up to facilitate the placement of the substrates (the upper substrate and the lower substrate); and also to facilitate the positioning of the upper substrate and the lower substrate by the positioning camera.

[0018] In one possible implementation, the central region of the second fixing area is provided with at least two through holes, and the positions of the through holes correspond to the positioning marks of the upper substrate and the lower substrate.

[0019] In the above scheme, the through holes are designed to allow the positioning camera to pass through them without obstruction and to position the positioning marks on the upper and lower substrates.

[0020] In one possible implementation, the observation device further includes a positioning module, which includes at least two positioning cameras and a fourth adjustment unit; wherein the fourth adjustment unit is disposed on the base plate; the positioning cameras are fixedly connected to the fourth adjustment unit so that the fourth adjustment unit adjusts the position of the positioning cameras; the positioning cameras are correspondingly disposed with the through holes in the second fixed area so that the positioning cameras observe the positioning marks of the upper substrate and the lower substrate through the through holes.

[0021] In the above scheme, the positioning camera allows for more accurate alignment of the upper and lower substrates; the positioning marks on the upper and lower substrates are pre-set and can be "cross" marks. Accurate alignment of the upper and lower substrates ensures that when a voltage is applied between them, the electric field acts precisely on the droplet. If the positioning camera determines that the positioning marks on the upper and lower substrates are not aligned, i.e., the alignment is inaccurate, the alignment can be adjusted using the fourth adjustment unit.

[0022] In one possible implementation, the positioning marks of the upper substrate are located on the lower surface of the upper substrate; and the positioning marks of the lower substrate are located on the upper surface of the lower substrate.

[0023] The above scheme discloses a preferred method for setting positioning marks; however, the position of the positioning marks is not restricted.

[0024] In one possible implementation, the center of the first fixing area has a hollow structure; the observation device further includes a curing module, which includes a curing unit and a fifth adjustment unit; wherein the fifth adjustment unit is disposed on the base plate; the curing unit is fixedly connected to the fifth adjustment unit so that the fifth adjustment unit adjusts the position of the curing unit; the curing unit is located below the lower substrate so that the curing unit cures the droplet after passing through the hollow structure at the center of the first fixing area.

[0025] In the above scheme, the center of the first fixing area is set with a hollow structure to facilitate the curing unit to cure the droplets located between the upper substrate and the lower substrate.

[0026] The beneficial effects of this application include:

[0027] A droplet is positioned between an upper substrate and a lower substrate. Light from a point light source passes through the droplet and enters the observation camera to observe its morphology. The upper and lower substrates are preferably ITO glass plates, but can also be conductive rigid substrates. A voltage is applied to the upper and lower substrates to change the droplet's morphology, which is then observed by the camera. The material of the droplet is not limited, and the distance between the upper and lower substrates is on the order of micrometers. Both the upper and lower substrates are parallel to the base plate, facilitating vertical positioning of the upper and lower substrates by the positioning camera and horizontal observation of the droplet morphology by the observation camera. Using the base plate as a reference plane also facilitates adjustment of the parallelism between the upper and lower substrates. The droplet morphology changes rapidly, requiring the observation camera to capture hundreds of images per second. Furthermore, because the distance between the upper and lower substrates is on the order of micrometers, if the parallelism between the substrates is not met, the observation camera may fail to observe the droplet morphology, or the distorted droplet morphology may result in inaccurate observations.

[0028] The leveling operation hole facilitates fine-tuning of the parallelism between the upper and lower substrates. The first fixing area, parallel to the base plate, can be manually adjusted; the second fixing area of ​​the upper substrate, also parallel to the base plate, can also be manually adjusted. Furthermore, the parallelism between the upper and lower substrates can be identified using the leveling sensor. If the parallelism is not within the required range, fine-tuning can be performed manually using the leveling thread in the leveling operation hole to ensure the parallelism of the upper and lower substrates meets the requirements. Here, fine-tuning refers to micrometer-level adjustment.

[0029] To ensure high parallelism between the upper and lower substrates, four leveling sensors are installed at the four corners of the second fixing area. Each leveling sensor can detect the distance between corresponding positions on the upper and lower substrates. When the distance is outside the preset range or is not a preset distance, it is adjusted via the leveling threads in the aforementioned leveling operation holes. This method ensures that the distance between the four corresponding positions on the upper and lower substrates meets the requirements, and also ensures that the parallelism between the upper and lower substrates meets the requirements. The leveling sensors can be spectral confocal displacement sensors, which provide micron-level distance detection. The four corners of the second fixing area also feature vertex cutouts to facilitate the leveling sensors' detection of the distance between the upper and lower substrates.

[0030] There is no limit to the number of the second limiting blocks. The limiting blocks (first limiting block and second limiting block) are set up to facilitate the placement of the substrate (upper substrate and lower substrate); and also to facilitate the positioning of the upper substrate and lower substrate by the positioning camera.

[0031] The through-hole is designed to allow the positioning camera to pass through unobstructed and position the positioning marks on the upper and lower substrates.

[0032] The positioning camera allows for more accurate alignment of the upper and lower substrates; the positioning marks on the upper and lower substrates are pre-set and can be marked with a cross. Accurate alignment of the upper and lower substrates ensures that when a voltage is applied between them, the electric field acts precisely on the droplet.

[0033] The center of the first fixing area is set with a hollow structure to facilitate the curing unit to cure the droplets located between the upper and lower substrates. Attached Figure Description

[0034] Figure 1 This is a schematic diagram of the structure of a droplet morphology observation device disclosed in this application.

[0035] Figure 2 This is a schematic diagram of the structure of a droplet observation module disclosed in this application specification;

[0036] Figure 3 This is a schematic diagram of the structure of a lower substrate fixing module disclosed in this application specification;

[0037] Figure 4 This is a schematic diagram of the structure of an upper substrate fixing module disclosed in this application specification;

[0038] Figure 5 This is a partial structural schematic diagram of an upper substrate fixing module disclosed in this application specification;

[0039] Figure 6 This is a schematic diagram of the structure of a positioning module disclosed in this application specification;

[0040] Figure 7 This is a schematic diagram of the structure of a curing module disclosed in this application specification;

[0041] Figure 8 This is a schematic diagram of the observation principle of an observation module disclosed in this application specification.

[0042] In the above figures: observation module 100, lower substrate fixing module 200, upper substrate fixing module 300, positioning module 400, curing module 500, base plate 600, handrail frame 700, leveling base 800; observation camera 101, point light source 102, first adjustment unit 103, light source schematic ray 104; first fixing area 201, second adjustment unit 202, first limiting block 203, first negative pressure hole 204, leveling operation hole 205, balance block 206; second fixing area 301, third adjustment unit 302, leveling sensor 303, second limiting block 304, through hole 305, vertex hollow hole 306, second negative pressure hole 307, negative pressure groove 308; positioning camera 401, fourth adjustment unit 402, positioning observation schematic ray 403; fifth adjustment unit 501, curing unit 502. Detailed Implementation

[0043] To enable those skilled in the art to better understand the technical solutions in this specification, the technical solutions in the embodiments of this specification will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0044] In the description of the embodiments of this application, the words "for example" or "for instance" are used to indicate examples, illustrations, or explanations. Any embodiment or design that is described as "for example" or "for instance" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design options. Rather, the use of the words "for example" or "for instance" is intended to present the relevant concepts in a specific manner.

[0045] This specification discloses a miniaturized desktop device for observing droplet morphology; it is used to observe the micro / nano structures of droplets. The parallelism between the two substrates is crucial for observing the droplet's micro / nano structures; therefore, this specification incorporates a leveling sensor to detect the distance between the two substrates, providing data for adjusting their parallelism. A positioning camera is also included to ensure more accurate alignment between the two substrates. During device use, a voltage is applied between the upper and lower substrates, stretching the droplet's shape. When the droplet's micro / nano structure meets the requirements, it can be cured using a curing unit; therefore, this specification also discloses a curing module.

[0046] Furthermore, the adjustment units described in this specification often include multi-directional adjustment. Figures 1-8The adjustment units shown are merely examples and should not be construed as limitations on the adjustment units described in this specification. The adjustment units in this specification include X-axis, Y-axis, and Z-axis adjustments, as well as angle adjustments; angle adjustments may include adjustments to the X-axis angle, Y-axis angle, and Z-axis angle, which can be set as needed and are not limited thereto. The first, second, third, fourth, and fifth adjustment units mentioned below refer to the entire adjustment unit of the corresponding module; it is readily understood that adjustments in each direction and angle are not further labeled in the accompanying drawings.

[0047] The following is a detailed description of the observation device for droplet morphology. For example... Figures 1-8 As shown.

[0048] This specification discloses a droplet morphology observation device, which includes a base plate 600, an observation module 100, an upper substrate, and a lower substrate.

[0049] like Figure 2 As shown, the observation module includes an observation camera 101, a point light source 102, and a first adjustment unit 103. The observation camera 101 and the point light source 102 are arranged opposite to each other so that the light from the point light source (such as...) Figure 2 The light source 104 shown in the diagram passes through the droplet and is observed by the observation camera 101; the droplet is located between the upper substrate and the lower substrate, both of which are parallel to the base plate; the first adjustment unit 103 is disposed on the base plate 600 and is fixedly connected to the observation module 100 so that the first adjustment unit 103 can adjust the position and angle of the observation camera 101 and the point light source 102, thereby observing the shape of the droplet.

[0050] At this point, the droplet located between the upper and lower substrates receives light from a point light source, which then enters the observation camera to observe the droplet's morphology (e.g., ...). Figure 8 As shown, Figure 8 (Schematic diagram of the principle of observing droplet morphology using an observation camera). The upper and lower substrates are preferably ITO glass plates, but can also be conductive rigid substrates. A voltage is then applied to the upper and lower substrates to change the morphology of the droplet, and the morphology of the droplet is then observed by an observation camera.

[0051] In the above example, the first adjustment unit 103 can be adjusted for displacement in the X, Y, and Z directions, as well as for rotation in the X-plane and angle adjustment in the Y-plane. Other adjustment methods can also be set as needed, without limitation. The first adjustment unit 103 allows light from the light source to pass through the gap between the upper and lower substrates, illuminating the array of droplets, and then the observation camera 101 observes the shape of the droplets.

[0052] This specification does not restrict the material of the droplet, and the distance between the upper and lower substrates is on the order of micrometers. Both the upper and lower substrates are parallel to the base plate, facilitating vertical positioning of the upper and lower substrates by the positioning camera and horizontal observation of the droplet morphology by the observation camera. Using the base plate as a reference plane also facilitates adjustment of the parallelism between the upper and lower substrates. The droplet morphology changes rapidly, requiring the observation camera to capture hundreds of images per second. In other words, maintaining the parallelism of the upper and lower substrates to the base plate (manually adjusted by instruments) is a prerequisite for maintaining parallelism between the upper and lower substrates; the gap between the upper and lower substrates is on the order of micrometers. If the upper and lower substrates are not initially leveled with the base plate, adjusting their parallelism is extremely difficult.

[0053] Furthermore, since the distance between the upper and lower substrates is on the order of micrometers, if the parallelism between the upper and lower substrates does not meet the requirements, the observation camera may be unable to observe the droplet shape, or the droplet shape may be distorted, resulting in inaccurate observation of the droplet shape.

[0054] In one example, such as Figure 1 and 3 As shown, the observation device includes a lower substrate fixing module 200, which includes a second adjustment unit 202 and a first fixing area 201. The second adjustment unit 202 is disposed on the base plate 600 and is fixedly connected to the first fixing area 201 so that the second adjustment unit 202 can adjust the position and angle of the first fixing area 201. The first fixing area 201 is provided with multiple negative pressure holes, and the lower substrate is fixed by vacuum adsorption through the multiple negative pressure holes.

[0055] At this point, a lower substrate fixing module 200 is disclosed, and the first fixing area 201 can fix the lower substrate by vacuum adsorption; the fixing method is simple. Multiple negative pressure holes can be used... Figure 3 The first negative pressure hole 204 is provided; in order to balance the first fixed area 201, a balance block 206 can also be provided.

[0056] As described above, the second adjustment unit 202 can adjust the displacement in the Z-axis direction, and can also adjust the angle in the X and Y directions. Other adjustment methods can also be set as needed, without limitation. The second adjustment unit 202 can coarsely adjust the parallelism between the first fixed area 201 and the base plate.

[0057] In one example, a first limiting block 203 is provided at the apex of the first fixing area 201; wherein the first limiting block 203 is right-angled and closely fits the apex of the first fixing area 201 to limit the lower substrate.

[0058] At this time, there is no limit to the number of the first limit block 203.

[0059] like Figure 3 and 5 As shown, both the first fixing area 201 and the second fixing area 301 (hereinafter referred to as the second fixing area) in this specification have a recessed "corner notch" structure at one corner, which is the position where voltage is applied to the upper substrate and the lower substrate.

[0060] In one example, multiple leveling operation holes are provided on the plate surface where the first fixed area is located, and leveling threads are provided in the leveling operation holes 205 so that the parallelism between the lower substrate and the upper substrate can be adjusted by operating the leveling threads.

[0061] At this point, the leveling operation hole 205 facilitates fine-tuning of the parallelism between the upper and lower substrates. The first fixing area 201 is parallel to the base plate 600 and can be manually adjusted; the second fixing area 301 of the upper substrate is also parallel to the base plate 600 and can be manually adjusted. Based on this, the parallelism between the upper and lower substrates can be identified by the leveling sensor 303. If the parallelism is not within the required range, fine-tuning can be performed manually by adjusting the leveling thread in the leveling operation hole to ensure that the parallelism between the upper and lower substrates meets the requirements. Here, fine-tuning refers to micron-level adjustment.

[0062] like Figure 1 , Figure 4 and Figure 5 As shown, in one example, the observation device includes an upper substrate fixing module 300, which includes a second fixing area 301, a third adjustment unit 302, and a leveling sensor 303. The third adjustment unit 302 is disposed on the base plate 600 and is fixedly connected to the second fixing area 301 so that the third adjustment unit 302 can adjust the position and angle of the second fixing area 301. The second fixing area 301 is provided with multiple negative pressure holes, and the upper substrate is fixed by vacuum adsorption through the multiple negative pressure holes. The leveling sensor 303 is disposed at the vertex cutout of the second fixing area 301 and is located at the vertex of the upper substrate to measure the distance between the vertex of the upper substrate and the vertex of the corresponding lower substrate. One leveling sensor corresponds to one vertex of the upper substrate.

[0063] The above-mentioned negative pressure holes, such as Figure 5 As shown in the second negative pressure hole 307, a negative pressure groove 308 can also be provided in the second fixed area 301. The shape of the negative pressure groove can be straight or other shapes, and there is no limitation on this. Figure 5 The shapes of two negative pressure grooves are shown.

[0064] The aforementioned third adjustment unit 302 can be adjusted in the X, Y, and Z directions, and can also be rotated in the X plane. Other adjustment methods can also be set as needed, without limitation. It can adjust the parallelism between the second fixed area 301 and the base plate, and can also adjust the position of the upper substrate to complete the positioning of the upper and lower substrates.

[0065] At this point, given the high parallelism requirement between the upper and lower substrates, four leveling sensors are installed at the four corners of the second fixing area. Any one of these sensors can detect the distance between corresponding positions on the upper and lower substrates. When the distance is outside the preset range or is not a preset distance, it is adjusted using the leveling threads in the aforementioned leveling operation holes. This method ensures that the distance between the four corresponding positions on the upper and lower substrates meets the requirements, and also ensures that the parallelism between the upper and lower substrates meets the requirements.

[0066] Furthermore, a spectral confocal displacement sensor can be used as the leveling sensor, which detects distances at the micrometer level. The four corners of the second fixing area are provided with vertex cutouts 306, which also facilitates the leveling sensor's detection of the distance between the upper and lower substrates. This specification does not explain the principle of the leveling sensor; those skilled in the art can understand its principle based on the description in this specification.

[0067] like Figure 4 and Figure 5 As shown, in one example, a second limiting block 304 is provided at the apex of the second fixing area 301; wherein, the second limiting block 304 is right-angled and the second limiting block 304 is closely attached to the apex corner of the second fixing area 301 to limit the upper substrate.

[0068] At this time, there is no limit to the number of the second limiting blocks 304. The limiting blocks (the first limiting block and the second limiting block) are set up to facilitate the placement of the substrates (the upper substrate and the lower substrate); and also to facilitate the positioning of the upper substrate and the lower substrate by the positioning camera.

[0069] like Figure 4 and Figure 5 As shown, in one example, the central region of the second fixing area is provided with at least two through holes 305, and the positions of the through holes correspond to the positioning marks of the upper substrate and the lower substrate.

[0070] At this point, the through holes are designed to allow the positioning camera to pass through unobstructed and locate the positioning marks on the upper and lower substrates. The number of through holes is the same as the number of positioning cameras, and preferably two; however, this number is not limited and can be set according to actual needs, such as three (triangular configuration) or four (quadrilateral configuration).

[0071] like Figure 1 and Figure 6 As shown, in one example, the observation device further includes a positioning module 400, which includes at least two positioning cameras 401 and a fourth adjustment unit 402; wherein, the fourth adjustment unit 402 is disposed on the base plate 600; the positioning cameras 401 are fixedly connected to the fourth adjustment unit 402 so that the fourth adjustment unit 402 can adjust the position of the positioning cameras 401; the positioning cameras 401 are correspondingly disposed with the through holes 305 in the second fixed area 301 so that the positioning cameras 401 can observe the positioning marks of the upper and lower substrates through the through holes 305.

[0072] At this point, the positioning camera allows for more accurate alignment of the upper and lower substrates; the positioning marks on the upper and lower substrates are pre-set and can be "cross" marks. Accurate alignment of the upper and lower substrates ensures that when a voltage is applied between them, the electric field acts precisely on the droplet. The fourth adjustment unit 402 can adjust the focal length of the positioning camera along the Z-axis. Other adjustment methods can also be set as needed; there are no limitations on this.

[0073] It should be noted that the observation device may also omit the positioning module 400; instead, it may directly position the upper and lower substrates using the limiting blocks in the first and second fixed areas.

[0074] In one example, the positioning marks of the upper substrate are located on the lower surface of the upper substrate; and the positioning marks of the lower substrate are located on the upper surface of the lower substrate.

[0075] At this point, a preferred method for setting the positioning marker is disclosed; however, the position of the positioning marker is not restricted.

[0076] like Figure 3 and Figure 7 As shown, in one example, the center of the first fixed area 201 has a hollow structure; the observation device also includes a curing module 500, which includes a curing unit 502 and a fifth adjustment unit 501; wherein, the fifth adjustment unit 501 is disposed on the base plate 600; the curing unit 502 is fixedly connected to the fifth adjustment unit 501 so that the fifth adjustment unit 501 adjusts the position of the curing unit 502; the curing unit 502 is located below the lower substrate so that the curing unit 502 cures the droplet after passing through the hollow structure in the center of the first fixed area 201.

[0077] At this time, the center of the first fixing area 201 is set with a hollow structure to facilitate the curing unit 502 to cure the droplets located between the upper and lower substrates. The curing unit is preferably a UV curing device.

[0078] The fifth adjustment unit 501 described above can adjust the angle in both the X and Y directions. Other adjustment methods can also be set as needed, without limitation.

[0079] also, Figure 1 The outer casing is not shown; all modules on the base plate 600 are located inside the casing. The handrail frame 700 is used to facilitate user handling, and the leveling base 800 is used to adjust the level of the base plate.

[0080] The workflow of the droplet observation device in this specification is as follows: First, the base plate 600 is leveled using the leveling base 800; then, the upper substrate (i.e., through the third adjustment unit of the upper substrate fixing module 300) and the lower substrate (i.e., through the second adjustment unit of the lower substrate fixing module 200) are respectively adjusted to be parallel to the base plate 600; then, the positioning camera is adjusted using the fourth adjustment unit in the positioning module 400 to complete the positioning; if the positioning is inaccurate, the position of the first fixing area is adjusted using the third adjustment unit to complete the positioning; next, fine adjustments are made using the leveling operation hole of the lower substrate fixing module 200 to make the lower substrate parallel to the upper substrate; finally, the observation camera is adjusted using the first adjustment unit in the observation module 100 to allow light to pass through the droplet for observation. After the micro / nano structure of the droplet meets the requirements, the angle of the solidification module 500 can be adjusted using the fifth adjustment unit to solidify the droplet.

[0081] The droplet observation device disclosed in this specification can observe the morphology of droplets through a camera via a micrometer-level gap between the upper and lower substrates. The combination of multiple adjustment methods not only ensures micrometer-level parallelism between the upper and lower substrates but also facilitates simple and convenient manual operation. The positioning modules for the upper and lower substrates reduce inaccuracies in the electric field applied to the droplets after applying voltage to the upper and lower substrates due to inaccurate positioning.

[0082] In the description of this application, it should be understood that in the accompanying drawings, the positive direction of "X" represents the front, and correspondingly, the negative direction of "X" represents the rear; the positive direction of "Y" represents the right, and correspondingly, the negative direction of "Y" represents the left; the positive direction of "Z" represents the top, and correspondingly, the negative direction of "Z" represents the bottom. The terms "X", "Y", "Z", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Moreover, the specific features, structures, materials, or characteristics described can be combined in any suitable manner in one or more embodiments or examples.

[0083] In the description of this application, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0084] It should be noted that in this application, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes the element.

[0085] The above are merely specific embodiments of this application, enabling those skilled in the art to understand or implement this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A device for observing droplet morphology, characterized in that, The observation device includes a base plate, an observation module, an upper base plate, and a lower base plate; wherein... The observation module includes an observation camera, a point light source, and a first adjustment unit. The observation camera is positioned opposite to the point light source so that the light from the point light source is observed by the observation camera after passing through the droplet. The droplet is located between the upper substrate and the lower substrate, and both the upper substrate and the lower substrate are parallel to the bottom plate; The first adjustment unit is disposed on the base plate and is fixedly connected to the observation module so that the first adjustment unit can adjust the position and angle of the observation camera and the point light source, thereby observing the shape of the droplet.

2. The observation device according to claim 1, characterized in that, The observation device includes a lower base plate fixing module, which includes a second adjustment unit and a first fixing area; wherein... The second adjustment unit is disposed on the base plate and is fixedly connected to the first fixed area so that the second adjustment unit can adjust the position and angle of the first fixed area; The first fixing area is provided with a plurality of negative pressure holes, and the first fixing area fixes the lower substrate by vacuum adsorption through the plurality of negative pressure holes.

3. The observation device according to claim 2, characterized in that, A first limiting block is provided at the apex of the first fixed region; wherein... The first limiting block is right-angled and closely fits the top corner of the first fixing area to limit the lower substrate.

4. The observation device according to claim 2, characterized in that, Multiple leveling operation holes are provided on the plate surface where the first fixed area is located. Leveling operation holes are provided with leveling threads so that the parallelism between the lower substrate and the upper substrate can be adjusted by operating the leveling threads.

5. The observation device according to claim 1 or 2, characterized in that, The observation device includes an upper base plate fixing module, which comprises a second fixing area, a third adjustment unit, and a leveling sensor; wherein... The third adjustment unit is disposed on the base plate and is fixedly connected to the second fixed area so that the third adjustment unit can adjust the position and angle of the second fixed area; The second fixing area is provided with a plurality of negative pressure holes, and the upper substrate is fixed by vacuum adsorption through the plurality of negative pressure holes; The leveling sensor is disposed at the vertex cutout of the second fixed area and at the vertex of the upper substrate to measure the distance between the vertex of the upper substrate and the vertex of the corresponding lower substrate. One leveling sensor corresponds to one vertex of the upper substrate.

6. The observation device according to claim 5, characterized in that, A second limiting block is provided at the apex of the second fixed area; wherein... The second limiting block is right-angled and closely fits the top corner of the second fixing area to limit the upper substrate.

7. The observation device according to claim 5, characterized in that, The central area of ​​the second fixing area is provided with at least two through holes, and the positions of the through holes correspond to the positioning marks of the upper substrate and the lower substrate.

8. The observation device according to claim 7, characterized in that, The observation device further includes a positioning module, which comprises at least two positioning cameras and a fourth adjustment unit; wherein... The fourth adjustment unit is mounted on the base plate; The positioning camera is fixedly connected to the fourth adjustment unit so that the fourth adjustment unit can adjust the position of the positioning camera. The positioning camera is configured to correspond to the through hole in the second fixed area, so that the positioning camera can observe the positioning mark points of the upper substrate and the lower substrate through the through hole.

9. The observation device according to claim 7, characterized in that, The positioning marks on the upper substrate are located on the lower surface of the upper substrate; and The positioning marks on the lower substrate are located on the upper surface of the lower substrate.

10. The observation device according to claim 2, characterized in that, The center of the first fixed area has a hollow structure; the observation device also includes a curing module, which comprises a curing unit and a fifth adjustment unit; wherein... The fifth adjustment unit is mounted on the base plate; The curing unit is fixedly connected to the fifth adjusting unit so that the fifth adjusting unit can adjust the position of the curing unit. The curing unit is located below the lower substrate so that the curing unit can cure the droplet after passing through the central hollow structure of the first fixing area.

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