A semiconductor chip defect detection apparatus

Abstract

The utility model relates to technical field of semiconductor chip, and disclose a kind of semiconductor chip defect detection device, the problem proposed in background art is solved, it includes conveyer belt, conveyer belt both sides are sequentially provided with first support, second support and third support, first support and third support are uniformly provided with defect detection equipment on, position sensor is provided on second support, the both sides of conveyer belt are provided with base, support piece is provided on the base, rotatable rotary shaft is provided on two support pieces, rotary shaft one end is connected with rotary motor, rotary shaft middle part is provided with turnover plate, the utility model, with can realize upper and lower surface detection, make up the deficiency of traditional single side detection, and the effect of maximum limit reduces chip damage.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor chip technology, specifically a semiconductor chip defect detection device. Background Technology

[0002] With the continuous advancement of semiconductor manufacturing technology, the integration and complexity of chips are increasing, and their size is shrinking. This makes chip defect detection a key link in ensuring product quality and reliability. Existing semiconductor chip defect detection technologies mainly focus on detecting defects on a single surface of the chip (usually the top surface), using high-resolution optical imaging, electron beam detection, or other non-destructive testing methods to identify and locate defects.

[0003] Existing inspection devices can usually only inspect one surface of a chip, ignoring potential defects on other surfaces. Traditional optical inspection techniques rely on high-resolution cameras and microscopes, which can provide high-precision surface imaging, but are limited to inspecting a single surface and cannot penetrate the chip material to detect defects on the other side. To address this, we propose a semiconductor chip defect inspection device. Utility Model Content

[0004] To address the problems raised in the background art, this utility model provides the following technical solution: a semiconductor chip defect detection device, comprising a conveyor belt, on both sides of which a first support, a second support, and a third support are sequentially arranged. Defect detection equipment is mounted on both the first and third supports, and a position sensor is mounted on the second support. Bases are mounted on both sides of the conveyor belt, and support members are mounted on the bases. Rotating shafts are rotatably mounted on the two support members. A rotary motor is connected to one end of each rotating shaft, and a flipping plate is mounted in the middle of the rotating shaft.

[0005] Preferably, the flip plate is triangular in shape, with the base of the triangle fixedly connected to the rotation axis and the tip of the triangle facing the chip conveying end. The fixed connection of the base of the triangle to the rotation axis ensures that the flip plate can rotate stably, and the tip of the triangle facing the chip conveying end allows the flip plate to smoothly contact and flip the chip with the tip as the fulcrum.

[0006] Preferably, the tip of the triangle is rounded, and the flip plate is made of a lightweight and high-strength material, such as aluminum alloy or engineering plastic. Using aluminum alloy or engineering plastic ensures the strength of the flip plate while reducing its weight and lowering the load on the rotary motor.

[0007] Preferably, the conveyor belt has a conveying speed of 100 mm / s, the total time for the flipping plate to complete one flip (i.e., flipping 180° from its original state and returning to its original state) is 0.5-1 seconds, and the distance between the semiconductor chips is 100-150 mm, ensuring that the flipping plate has enough time to complete the flipping and reset, avoiding chip stacking or collision.

[0008] Preferably, the surface of the conveyor belt is provided with a buffer pad, which is made of an elastic material, such as silicone or rubber, which can absorb the impact force between the chip and the conveyor belt and prevent the chip from being damaged during conveying and flipping.

[0009] Preferably, the surface of the flip plate is polished to reduce friction when the flip plate contacts the chip, and to prevent the chip surface from being scratched or worn during the flipping process.

[0010] Compared with the prior art, the beneficial effects of this utility model are:

[0011] During operation, the conveyor belt starts first, transporting chips at a constant speed. The spacing between chips is 100-150 mm to ensure no collision between chips. When a chip passes the first support, the defect detection equipment images and analyzes its upper surface. When the chip reaches the flipping area below the second support, the position sensor sends a signal to the control system. Due to the inclined surface of the flipping plate, the chip is moved onto the flipping plate by the conveyor belt. The control system triggers the rotary motor, which drives the rotary shaft to perform a flipping action. The flipping plate uses the triangular tip as a fulcrum to flip the chip 180°, with the lower surface facing up. The flipping time is controlled within 0.5-1 second. Then, the flipping plate reverses and resets to its original state, ready for the next flip. After the chip flips, when it passes the third support, another set of defect detection equipment detects the exposed lower surface. The conveyor belt speed is matched with the flipping time to ensure that after the flipping plate resets, the next chip arrives at the flipping position just in time, realizing the detection of both the upper and lower surfaces. This overcomes the shortcomings of traditional single-sided detection and minimizes chip damage. Attached Figure Description

[0012] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0013] Figure 1 This is a side view of the overall structure of this utility model;

[0014] In the diagram: 1. Conveyor belt; 2. First support; 3. Second support; 4. Third support; 5. Defect detection equipment; 6. Position sensor; 7. Base; 8. Support component; 9. Rotating shaft; 10. Rotating motor; 11. Tilting plate. Detailed Implementation

[0015] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0016] Depend on Figure 1 The present invention includes a conveyor belt 1, on which a first support 2, a second support 3 and a third support 4 are arranged sequentially on both sides. A defect detection device 5 is arranged on both the first support 2 and the third support 4. A position sensor 6 is arranged on the second support 3. A base 7 is arranged on both sides of the conveyor belt 1. A support member 8 is arranged on the base 7. A rotating shaft 9 is rotatably arranged on the two support members 8. A rotating motor 10 is connected to one end of the rotating shaft 9. A flip plate 11 is arranged in the middle of the rotating shaft 9.

[0017] The flip plate 11 is triangular in shape. The base of the triangle is fixedly connected to the rotating shaft 9, and the tip of the triangle faces the chip conveying end. The fixed connection of the base of the triangle to the rotating shaft 9 ensures that the flip plate can rotate stably. The tip of the triangle facing the chip conveying end allows the flip plate 11 to smoothly contact and flip the chip with the tip as the fulcrum.

[0018] The tip of the triangle is rounded. The flip plate 11 is made of lightweight and high-strength material, such as aluminum alloy or engineering plastic. Using aluminum alloy or engineering plastic ensures the strength of the flip plate while reducing weight and lowering the load on the rotary motor 10.

[0019] The conveyor belt 1 has a conveying speed of 100 mm / s. The total time for the flip plate 11 to complete one flip, that is, to flip 180° from the original state and return to the original state, is 0.5-1 seconds. The distance between the semiconductor chips is 100-150 mm, ensuring that the flip plate 11 has enough time to complete the flip and reset, avoiding chip stacking or collision.

[0020] The surface of the conveyor belt 1 is provided with a buffer pad, which is made of elastic material, such as silicone or rubber, which can absorb the impact force between the chip and the conveyor belt and prevent the chip from being damaged during conveying and flipping.

[0021] The surface of the flip plate 11 is polished to reduce friction when the flip plate 11 contacts the chip, and to prevent the chip surface from being scratched or worn during the flipping process.

[0022] Working principle: During operation, conveyor belt 1 starts first, conveying chips at a constant speed of 100 mm / s. The spacing between chips is 100-150 mm to ensure no collision between chips. When a chip passes the first support 2, the defect detection device 5 images and analyzes its upper surface. When the chip reaches the flipping area below the second support 3, the position sensor 6 sends a signal to the control system. Because the flipping plate 11 has an inclined surface, the chip is moved onto the flipping plate 11 by the conveyor belt 1. The control system triggers the rotary motor 10, which drives the rotary shaft 9 to rotate the flipping plate 11. The flipping plate 11 uses the apex of the triangle as a fulcrum to flip the chip 180° so that the lower surface faces upward. The flipping time is controlled within 0.5-1 second. Then, the flipping plate 11 reverses and resets to its original state, ready for the next flip. After the chip flips, when it passes the third support 4, another set of defect detection equipment 5 detects the exposed lower surface. The conveyor belt speed of 100 mm / s is matched with the flipping time of 0.5-1 second to ensure that after the flipping plate is reset, the next chip arrives at the flipping position just in time, realizing the detection of both the upper and lower surfaces, making up for the shortcomings of traditional single-sided detection, and minimizing chip damage.

[0023] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0024] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A semiconductor chip defect detection device, comprising a conveyor belt (1), characterized in that: The conveyor belt (1) is provided with a first support (2), a second support (3) and a third support (4) in sequence on both sides. The first support (2) and the third support (4) are provided with defect detection equipment (5). The second support (3) is provided with a position sensor (6). The conveyor belt (1) is provided with a base (7) on both sides. The base (7) is provided with a support member (8). The two support members (8) are rotatably provided with a rotating shaft (9). One end of the rotating shaft (9) is connected to a rotating motor (10). The rotating shaft (9) is provided with a flip plate (11) in the middle.

2. The semiconductor chip defect detection device according to claim 1, characterized in that: The flip plate (11) is triangular in shape, with the base of the triangle fixedly connected to the rotation axis (9) and the tip of the triangle facing the chip transfer end.

3. The semiconductor chip defect detection device according to claim 2, characterized in that: The apex of the triangle is rounded, and the flip plate (11) is made of a lightweight and high-strength material, which is aluminum alloy or engineering plastic.

4. The semiconductor chip defect detection device according to claim 3, characterized in that: The conveyor belt (1) has a conveying speed of 100 mm / s. The total time for the flip plate (11) to complete one flip, i.e., flip 180° from the original state and return to the original state, is 0.5-1 seconds. The distance between the semiconductor chips is 100-150 mm.

5. A semiconductor chip defect detection device according to claim 4, characterized in that: The surface of the conveyor belt (1) is provided with a buffer pad, which is made of an elastic material, such as silicone or rubber.

6. The semiconductor chip defect detection device according to claim 5, characterized in that: The surface of the flip plate (11) is polished.

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