Automatic detection mechanism for chip burning

Abstract

The utility model discloses a kind of automatic detection mechanism of chip burning, comprising: substrate and respectively installed on substrate test unit, three-axis drive unit, at least 2 interval settings vacuum suction nozzle are installed on the Z-axis movable block of three-axis drive unit, the upper surface of the substrate is also installed with a horizontal carrying module, one end with the upper surface of substrate The other end of the horizontal carrying module is used for with the bench of burning equipment lap joint connection, a material carrying platform is installed on the movable part of the horizontal carrying module, the material carrying platform for loading the chip to be tested from burning equipment, which moves between the bench of burning equipment and substrate, is used for carrying the chip to be tested on material carrying platform to test unit. The utility model chip burning automatic detection mechanism can improve production efficiency, can also guarantee the yield in the whole process of burning, and can also avoid damage to test seat and chip in test seat.

Description

Technical Field

[0001] This utility model relates to the field of chip testing technology, and in particular to an automatic testing mechanism for chip programming. Background Technology

[0002] Chip programming is the process of writing programs, parameters, and files into a microcontroller or ARM controller to achieve the functions and effects of electronic products. After programming, the chip needs to be tested to eliminate defective chips before packaging, ensuring a high yield rate. A search revealed that patent CN118245311A discloses a chip testing method and a chip testing device. The chip testing device includes a chip fixture, a communication interface connected to the chip fixture, and a microcontroller connected to the chip fixture. In this patent, the chip to be tested is loaded into the chip fixture, and then tested through the communication interface and the microcontroller. However, in this patent, the chip may be damaged when it comes into contact with the chip fixture, thereby reducing the stability of product performance and leading to low production efficiency. Utility Model Content

[0003] The purpose of this invention is to provide an automatic chip programming detection mechanism. This automatic chip programming detection mechanism can randomly and automatically inspect the programmed chips at any time during the programming process without stopping the programming process, and can also avoid damage to the test socket and the chip inside the test socket.

[0004] To achieve the above objectives, the technical solution adopted by this utility model is: an automatic testing mechanism for chip programming, comprising: a substrate and a test unit and a three-axis drive unit respectively mounted on the substrate. At least two spaced vacuum nozzles are mounted on the Z-axis movable block of the three-axis drive unit. A horizontal transport module is also mounted on the upper surface of the substrate. The other end of the horizontal transport module, which is connected to the upper surface of the substrate, is used to connect with the stage of the programming equipment. A material transport platform is mounted on the movable part of the horizontal transport module. The material transport platform, which can move between the stage of the programming equipment and the substrate with the movable part of the horizontal transport module, is used to load the chip to be tested from the programming equipment. The vacuum nozzles are used to transport the chip to be tested on the material transport platform into the test unit.

[0005] The test unit further includes: a test carrier plate mounted on a substrate, several test seats spaced apart on the test carrier plate, and a movable cover plate movably disposed above the test carrier plate for cooperating with the test seats. A movable plate corresponding to the movable cover plate and located below the substrate is connected to the movable cover plate by at least two vertically arranged connecting columns. A bottom substrate connected to the substrate is disposed below the movable plate. A cylinder with a piston rod connected to the movable plate is mounted on the upper surface of the bottom substrate. A guide post is disposed on the lower surface of the movable plate on both sides of the cylinder. The other end of the guide post connected to the movable plate is slidably passed through the bottom substrate. A spring is fitted on the outer side of each guide post between the movable plate and the bottom substrate.

[0006] The following are further improvements to the above technical solution:

[0007] 1. In the above scheme, the upper surface of the material handling platform is provided with at least two carrier slots for chip embedding.

[0008] 2. In the above scheme, there are four vacuum suction nozzles and four bearing grooves opened on the upper surface of the material conveying platform.

[0009] 3. In the above scheme, the vacuum nozzle is also used to transport the chip that has completed testing in the test unit to the material handling platform.

[0010] 4. In the above scheme, a material box is installed on the upper surface of the substrate, and the vacuum nozzle is also used to transport the chip that has completed testing in the test unit into the material box.

[0011] Due to the application of the above technical solution, this utility model has the following advantages compared with the prior art:

[0012] This utility model discloses an automatic testing mechanism for chip programming. At least two spaced vacuum nozzles are mounted on the Z-axis movable block of its three-axis drive unit. A horizontal transport module is also mounted on the upper surface of the substrate. One end of the horizontal transport module is connected to the upper surface of the substrate, and the other end is used to connect to the programming equipment's machine base. A material transport platform is mounted on the movable part of the horizontal transport module. This platform, which moves between the programming equipment's machine base and the substrate, is used to load the chips to be tested from the programming equipment. The vacuum nozzles are used to transport the chips to be tested from the material transport platform to the testing unit. This allows for random and automatic sampling inspection of programmed chips at any time during the programming process without stopping the programming process, improving production efficiency and ensuring a high yield rate throughout the programming process. Furthermore, the testing unit includes: a test carrier board mounted on the substrate, and several spaced... A test socket is mounted on a test carrier plate and a movable cover plate is movably disposed above the test carrier plate and used to cooperate with the test socket. A movable plate corresponding to the movable cover plate and located below the substrate is connected to the movable cover plate by at least two vertically arranged connecting posts. A bottom substrate connected to the substrate is disposed below the movable plate. A cylinder with a piston rod connected to the movable plate is mounted on the upper surface of the bottom substrate plate. A guide post is disposed on the lower surface of the movable plate on both sides of the cylinder. The other end of the guide post connected to the movable plate can slide through the bottom substrate plate. A spring is fitted on the outer side of each guide post between the movable plate and the bottom substrate plate. During the process of pressing and releasing the test socket through the movable cover plate to realize the electrical conduction and disconnection between the test socket and the test carrier plate, the movable cover plate is ensured to elastically press the test socket, avoiding damage to the test socket and the chip inside the test socket, and ensuring the stability of the performance of the sampled qualified products. Attached Figure Description

[0013] Appendix Figure 1 This is a schematic diagram of the automatic detection mechanism for chip programming according to this utility model.

[0014] Appendix Figure 2 This is a partial structural diagram of the automatic detection mechanism for chip programming according to this utility model.

[0015] Appendix Figure 3 This is a schematic diagram of the test unit structure in the automatic detection mechanism for chip programming of this utility model.

[0016] Appendix Figure 4 This is a schematic diagram of the second part of the automatic detection mechanism for chip programming of this utility model.

[0017] In the above attached figures: 1. Substrate; 2. Test unit; 3. Three-axis drive unit; 31. Z-axis movable block; 4. Vacuum nozzle; 5. Horizontal transport module; 6. Material transport platform; 61. Bearing groove; 7. Material box; 8. Test carrier plate; 9. Test seat; 10. Movable cover plate; 11. Movable plate; 12. Connecting column; 13. Bottom substrate; 14. Cylinder; 15. Guide column; 16. Spring. Detailed Implementation

[0018] The present invention can be further understood through the specific embodiments given below, but they are not intended to limit the present invention.

[0019] Example 1: An automatic testing mechanism for chip programming includes: a substrate 1 and a test unit 2 and a three-axis drive unit 3 respectively mounted on the substrate 1. At least two spaced vacuum nozzles 4 are mounted on the Z-axis movable block 31 of the three-axis drive unit 3. A horizontal transport module 5 is also mounted on the upper surface of the substrate 1. The other end of the horizontal transport module 5, which is connected to the upper surface of the substrate 1, is used to connect with the machine tool of the programming equipment. A material transport platform 6 is mounted on the movable part of the horizontal transport module 5. The material transport platform 6, which can move between the machine tool of the programming equipment and the substrate 1 with the movable part of the horizontal transport module 5, is used to load the chip to be tested from the programming equipment. The vacuum nozzles 4 are used to transport the chip to be tested on the material transport platform 6 into the test unit 2.

[0020] The test unit 2 further includes: a test carrier plate 8 mounted on the substrate 1, a plurality of test seats 9 spaced apart on the test carrier plate 8, and a movable cover plate 10 movably disposed above the test carrier plate 8 and used to cooperate with the test seats 9. A movable plate 11 corresponding to the movable cover plate 10 and located below the substrate 1 is connected to the movable cover plate 10 by at least two vertically arranged connecting posts 12. A bottom substrate 13 connected to the substrate 1 is disposed below the movable plate 11. A cylinder 14 with a piston rod connected to the movable plate 11 is mounted on the upper surface of the bottom substrate 13. A guide post 15 is disposed on the lower surface of the movable plate 11 and on both sides of the cylinder 14. The other end of the guide post 15 connected to the movable plate 11 is slidably passed through the bottom substrate 13. A spring 16 is fitted on the outer side of each guide post 15 and between the movable plate 11 and the bottom substrate 13.

[0021] The upper surface of the aforementioned material handling platform 6 is provided with at least two carrier slots 61 for chip embedding; a material box 7 is installed on the upper surface of the aforementioned substrate 1, and the vacuum nozzle 4 is also used to transport the chips that have completed testing in the test unit 2 into the material box 7.

[0022] Example 2: An automatic testing mechanism for chip programming includes: a substrate 1 and a test unit 2 and a three-axis drive unit 3 respectively mounted on the substrate 1. At least two spaced vacuum nozzles 4 are mounted on the Z-axis movable block 31 of the three-axis drive unit 3. A horizontal transport module 5 is also mounted on the upper surface of the substrate 1. The other end of the horizontal transport module 5, which is connected to the upper surface of the substrate 1, is used to connect with the machine base of the programming equipment. A material transport platform 6 is mounted on the movable part of the horizontal transport module 5. The material transport platform 6, which can move between the machine base of the programming equipment and the substrate 1 with the movable part of the horizontal transport module 5, is used to load the chip to be tested from the programming equipment. The vacuum nozzles 4 are used to transport the chip to be tested on the material transport platform 6 into the test unit 2.

[0023] The test unit 2 further includes: a test carrier plate 8 mounted on the substrate 1, a plurality of test seats 9 spaced apart on the test carrier plate 8, and a movable cover plate 10 movably disposed above the test carrier plate 8 and used to cooperate with the test seats 9. A movable plate 11 corresponding to the movable cover plate 10 and located below the substrate 1 is connected to the movable cover plate 10 by at least two vertically arranged connecting posts 12. A bottom substrate 13 connected to the substrate 1 is disposed below the movable plate 11. A cylinder 14 with a piston rod connected to the movable plate 11 is mounted on the upper surface of the bottom substrate 13. A guide post 15 is disposed on the lower surface of the movable plate 11 and on both sides of the cylinder 14. The other end of the guide post 15 connected to the movable plate 11 is slidably passed through the bottom substrate 13. A spring 16 is fitted on the outer side of each guide post 15 and between the movable plate 11 and the bottom substrate 13.

[0024] The upper surface of the aforementioned material handling platform 6 is provided with at least two carrier slots 61 for chip embedding; the aforementioned vacuum nozzle 4 and the carrier slots 61 on the upper surface of the material handling platform 6 are each provided with four slots.

[0025] The aforementioned vacuum nozzle 4 is also used to transport the tested chips in the test unit 2 to the material handling platform 6.

[0026] When used in conjunction with a programming device:

[0027] The chip to be programmed is sequentially transferred from the tray or tape to the programming unit of the programming equipment by the pick-up unit for programming. After programming is completed, the chip to be programmed in the programming unit is sequentially transferred to the empty tray or tape for subsequent unloading operations by the pick-up unit.

[0028] The burning devices mentioned above all fall within the existing basic scope, and the applicant's prior applications have provided specific technical solutions, which will not be repeated in this patent.

[0029] Importantly, during the chip programming process, a random inspection of the programmed chips is necessary to check the accuracy of the programmed information and prevent errors caused by human error, computer viruses, software mutations, or other factors. The specific process is as follows:

[0030] During the normal burning process, perform the following operations at regular intervals (e.g., every hour):

[0031] The horizontal transport module moves the material transport platform to the side of the programming equipment. The picking unit of the programming equipment randomly selects the chip that has been programmed in the programming unit and transports it to the material transport platform.

[0032] The horizontal transport module then moves the transport platform carrying the programmed chip to above the substrate. Next, the vacuum nozzle driven by the three-axis drive unit moves the programmed chip on the transport platform to the test unit for testing. Based on the test results, the tested chip is moved to a specific location (such as a qualified product box, an NG product box, or a discharge tray). The test unit and test process described above are all within the scope of existing technology and will not be elaborated here.

[0033] During the aforementioned testing process, the test socket needs to be pressed and released using the movable cover plate to achieve electrical connection and disconnection between the test socket and the test carrier. The guide post and spring settings can buffer the force of the cylinder that drives the movable cover plate to move up and down, ensuring that the movable cover plate elastically presses the test socket, avoiding damage to the test socket and the chip inside the test socket, and ensuring the stability of the performance of the sampled qualified products.

[0034] When using the aforementioned automatic chip programming testing mechanism, it can randomly and automatically sample and inspect the programmed chips at any time during the programming process without stopping the programming process. This can improve production efficiency and ensure the yield rate throughout the programming process. Furthermore, in the process of pressing and releasing the test socket through the movable cover to realize the electrical conduction and disconnection between the test socket and the test carrier, the test unit ensures that the movable cover elastically presses the test socket, avoiding damage to the test socket and the chip inside the test socket, and ensuring the stability of the performance of the sampled qualified products.

[0035] The above embodiments are only for illustrating the technical concept and features of this utility model, and are intended to enable those skilled in the art to understand the content of this utility model and implement it accordingly. They should not be construed as limiting the scope of protection of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be included within the scope of protection of this utility model.

Claims

1. An automatic detection mechanism for chip programming, comprising: The substrate (1) and the test unit (2) and the three-axis drive unit (3) respectively mounted on the substrate (1) are characterized in that: at least two vacuum nozzles (4) are installed on the Z-axis movable block (31) of the three-axis drive unit (3), and a horizontal transport module (5) is also installed on the upper surface of the substrate (1). The other end of the horizontal transport module (5) connected to the upper surface of the substrate (1) is used to connect with the machine tool of the burning device. A material transport platform (6) is installed on the movable part of the horizontal transport module (5). The material transport platform (6) which can move between the machine tool of the burning device and the substrate (1) with the movable part of the horizontal transport module (5) is used to load the chip to be tested from the burning device. The vacuum nozzles (4) are used to transport the chip to be tested on the material transport platform (6) into the test unit (2). The test unit (2) further includes: a test carrier plate (8) mounted on the substrate (1), a plurality of test seats (9) spaced apart on the test carrier plate (8), and a movable cover plate (10) movably disposed above the test carrier plate (8) and used to cooperate with the test seats (9). A movable plate (11) corresponding to the movable cover plate (10) and located below the substrate (1) is connected to the movable cover plate (10) through at least two vertically arranged connecting posts (12). A [missing information] is disposed below the movable plate (11). A base plate (13) connected to the base plate (1) has a cylinder (14) on its upper surface that is connected to a piston rod and a movable plate (11). A guide post (15) is provided on the lower surface of the movable plate (11) and on both sides of the cylinder (14). The other end of the guide post (15) connected to the movable plate (11) can slide through the base plate (13). A spring (16) is fitted on the outer side of each guide post (15) and between the movable plate (11) and the base plate (13).

2. The automatic detection mechanism for chip programming according to claim 1, characterized in that: The upper surface of the material handling platform (6) is provided with at least two carrier slots (61) for chip embedding.

3. The automatic detection mechanism for chip programming according to claim 2, characterized in that: The vacuum nozzle (4) and the bearing groove (61) opened on the upper surface of the material conveying platform (6) are both provided with 4.

4. The automatic detection mechanism for chip programming according to claim 1, characterized in that: The vacuum nozzle (4) is also used to transport the chip that has been tested in the test unit (2) to the material handling platform (6).

5. The automatic detection mechanism for chip programming according to claim 1, characterized in that: A material box (7) is mounted on the upper surface of the substrate (1), and the vacuum nozzle (4) is also used to transport the chip that has been tested in the test unit (2) to the material box (7).

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