A multilayer composite copper alloy heat dissipation substrate

Abstract

The utility model relates to the technical field of heat dissipation substrate, and disclose a multilayer composite copper alloy heat dissipation substrate, including surface layer, the bottom fixed mounting of surface layer has intermediate layer, the bottom fixed mounting of intermediate layer has bottom layer, through spot welding hole makes installation card frame, surface layer and bottom layer complete installation to fix the connecting pipe in the inside of intermediate layer, the cooling liquid flow heat dissipation is convenient, also makes surface layer, intermediate layer and bottom layer installation more fastening, on this basis, the utility model is through sealing washer setting between intermediate layer and connecting pipe, make the sealing effect better, avoid the cooling liquid leakage, and surface layer is high purity copper, intermediate layer is Cu Cr Zr alloy, bottom layer is microporous copper foil, realize three layers' gradient heat conduction to strengthen the heat dissipation effect of the device, can cope with high heat flow density scene, be applicable to IGBT module, 5G base station etc. High frequency high power electronic device's heat dissipation demand.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation substrate technology, specifically a multilayer composite copper alloy heat dissipation substrate. Background Technology

[0002] The substrate is not only the base material for making PCB circuit boards, but also used to support and connect various electronic devices. Its internal circuits and control circuits are connected to conduct electricity to supply power to the electronic devices. During operation, heat is generated, which causes thermal resistance in the circuit, thus affecting the normal operation of the circuit. Therefore, a heat dissipation substrate is needed.

[0003] Copper itself can conduct heat, so conventional heat dissipation substrates are generally copper substrates. Although copper substrates can conduct heat to a certain extent, their heat sink structure is simple and cannot cope with high heat flux density scenarios. They cannot meet the heat dissipation requirements of high-frequency and high-power electronic devices such as IGBT modules and 5G base stations. Long-term heat accumulation without dissipation will seriously affect the normal operation of the circuit. Therefore, it is necessary to improve the multilayer composite copper alloy heat dissipation substrate to solve the above problems. Utility Model Content

[0004] The purpose of this invention is to provide a multilayer composite copper alloy heat dissipation substrate to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a multilayer composite copper alloy heat dissipation substrate, comprising a surface layer, an intermediate layer fixedly mounted at the bottom of the surface layer, and a bottom layer fixedly mounted at the bottom of the intermediate layer.

[0006] Preferably, two connecting pipes are inserted into the interior of the intermediate layer, and a sealing gasket is fixedly installed at one end of each connecting pipe near the intermediate layer.

[0007] Preferably, the sealing gasket is disposed between the intermediate layer and the connecting pipe, and a flange is fixedly installed at the end of the connecting pipe away from the sealing gasket.

[0008] Preferably, both of the connecting pipes are fixedly mounted with mounting brackets on their exteriors, and the mounting brackets have spot welding holes inside.

[0009] Preferably, the mounting bracket is snapped into the interior of the surface layer and the bottom layer, and two mounting brackets are symmetrically arranged on the left and right sides of the middle layer, with the mounting brackets fitting snugly against the middle layer.

[0010] Preferably, the interior of the intermediate layer has serpentine microchannels.

[0011] Preferably, the centers at both ends of the serpentine microchannel correspond to the centers of the two connecting pipes, and the serpentine microchannel is connected to the two connecting pipes.

[0012] Compared with the prior art, the present invention provides a multilayer composite copper alloy heat dissipation substrate, which has the following advantages:

[0013] 1. This multi-layer composite copper alloy heat dissipation substrate allows the mounting bracket, surface layer, and bottom layer to be installed through spot welding holes, thereby fixing the connecting pipe inside the middle layer, facilitating the flow of coolant for heat dissipation, and making the installation of the surface layer, middle layer, and bottom layer more secure.

[0014] 2. Based on this, the present invention uses a sealing gasket between the intermediate layer and the connecting pipe to improve the sealing effect and prevent coolant leakage.

[0015] 3. Based on this, in this utility model, the surface layer is high-purity copper, the middle layer is Cu-Cr-Zr alloy, and the bottom layer is microporous copper foil, realizing gradient heat conduction of the three layers, thereby enhancing the heat dissipation effect of the device, enabling it to cope with high heat flux density scenarios, and is suitable for the heat dissipation needs of high-frequency and high-power electronic devices such as IGBT modules and 5G base stations. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the appearance and structure of this utility model;

[0018] Figure 2 This is an exploded view of the front structure of this utility model;

[0019] Figure 3 This is an exploded structural diagram of the present invention;

[0020] Figure 4 This is a cross-sectional exploded view of the intermediate layer and its connected mechanism of this utility model.

[0021] In the diagram: 1. Surface layer; 2. Intermediate layer; 3. Bottom layer; 4. Connecting pipe; 5. Sealing gasket; 6. Mounting bracket; 7. Spot welding hole; 8. Serpentine microchannel. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0024] Example 1:

[0025] Please see Figure 1-3 This utility model provides a technical solution: a multilayer composite copper alloy heat dissipation substrate, including a surface layer 1, an intermediate layer 2 fixedly installed at the bottom of the surface layer 1, and a bottom layer 3 fixedly installed at the bottom of the intermediate layer 2.

[0026] Furthermore, two connecting pipes 4 are inserted into the interior of the intermediate layer 2. Each of the two connecting pipes 4 has a sealing gasket 5 fixedly installed at one end near the intermediate layer 2, which improves the sealing effect and prevents coolant leakage.

[0027] Furthermore, the sealing gasket 5 is placed between the intermediate layer 2 and the connecting pipe 4, and a flange is fixedly installed at the end of the connecting pipe 4 away from the sealing gasket 5, so as to facilitate the connection of the connecting pipe 4 to the outer pipe.

[0028] Furthermore, mounting brackets 6 are fixedly installed on the outside of both connecting pipes 4. The mounting brackets 6 have spot welding holes 7 inside, which facilitates welding the mounting brackets 6 to the outside of the surface layer 1 and the bottom layer 3.

[0029] Furthermore, the mounting bracket 6 is snapped into the interior of the top layer 1 and the bottom layer 3. The two mounting brackets 6 are symmetrically arranged on the left and right sides of the middle layer 2, and the mounting brackets 6 are in close contact with the middle layer 2, making the installation between the top layer 1, the middle layer 2 and the bottom layer 3 more secure.

[0030] Example 2:

[0031] Please see Figure 3-4 Furthermore, in conjunction with Embodiment 1, it is further found that the interior of the intermediate layer 2 is provided with serpentine microchannels 8, which are distributed in a serpentine pattern inside the intermediate layer 2, resulting in better heat dissipation.

[0032] Furthermore, the centers at both ends of the serpentine microchannel 8 correspond to the centers of the two connecting pipes 4, and the serpentine microchannel 8 is connected to the two connecting pipes 4, so that it can be combined with the coolant circulation system, and the coolant flows inside the serpentine microchannel 8 to further improve the heat dissipation efficiency.

[0033] In actual operation, when this device is used, the connecting pipe 4 is inserted into the interior of the intermediate layer 2. At this time, the mounting bracket 6 is snapped into the interior of the surface layer 1 and the bottom layer 3. Then, the mounting bracket 6, the surface layer 1 and the bottom layer 3 are installed through the spot welding hole 7, thereby fixing the connecting pipe 4 inside the intermediate layer 2. This facilitates the flow and heat dissipation of the coolant and makes the installation between the surface layer 1, the intermediate layer 2 and the bottom layer 3 more secure. At the same time, the sealing gasket 5 is placed between the intermediate layer 2 and the connecting pipe 4, which makes the sealing effect better and avoids coolant leakage.

[0034] The device features a composite structure design: the top layer 1 is made of high-purity copper with a purity of ≥99.93%, the middle layer 2 is made of Cu-Cr-Zr alloy with a thermal conductivity of ≥320 W / m·K, and the bottom layer 3 is made of microporous copper foil. This three-layer gradient heat conduction enhances the heat dissipation effect of the device, enabling it to cope with high heat flux density scenarios and meet the heat dissipation requirements of high-frequency and high-power electronic devices such as IGBT modules and 5G base stations.

[0035] Furthermore, by Figure 3 , 4 It can be seen that a serpentine microchannel 8 is formed inside the intermediate layer 2 by etching technology, and the center of both ends of the serpentine microchannel 8 corresponds to the center of the two connecting pipes 4. The serpentine microchannel 8 is connected to the two connecting pipes 4, so that it can be combined with the coolant circulation system. The coolant flows inside the serpentine microchannel 8 to further improve the heat dissipation efficiency.

[0036] It should be noted that coating the surface layer 1 with a TiO2 composite film extends the service life of the device.

[0037] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

Claims

1. A multilayer composite copper alloy heat dissipation substrate, comprising a surface layer (1), characterized in that: The bottom of the surface layer (1) is fixedly installed with an intermediate layer (2), and the bottom layer (3) is fixedly installed with a bottom layer (3). Two connecting pipes (4) are inserted inside the intermediate layer (2). A sealing gasket (5) is fixedly installed at one end of each connecting pipe (4) near the intermediate layer (2). The sealing gasket (5) is located between the intermediate layer (2) and the connecting pipe (4). Both of the connecting pipes (4) are fixedly installed with mounting brackets (6) on the outside. The mounting brackets (6) have spot welding holes (7) inside. The mounting brackets (6) are snapped into the inside of the surface layer (1) and the bottom layer (3). The two mounting brackets (6) are symmetrically arranged on the left and right sides of the middle layer (2), and the mounting brackets (6) are in contact with the middle layer (2). The intermediate layer (2) has a serpentine microchannel (8) inside. The center of both ends of the serpentine microchannel (8) corresponds to the center of the two connecting pipes (4), and the serpentine microchannel (8) is connected to the two connecting pipes (4).

2. The multilayer composite copper alloy heat dissipation substrate according to claim 1, characterized in that: A flange is fixedly installed at the end of the connecting pipe (4) away from the sealing gasket (5).

3. The multilayer composite copper alloy heat dissipation substrate according to claim 1, characterized in that: The surface layer (1) is high-purity copper with a purity ≥99.93%; the intermediate layer (2) is a Cu-Cr-Zr alloy with a thermal conductivity ≥320W / m·K; and the bottom layer (3) is a microporous copper foil.

4. A multilayer composite copper alloy heat dissipation substrate according to claim 1 or 3, characterized in that: The surface layer (1) is coated with a TiO2 composite film.

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