IGBT fixing support and IGBT packaging member
By designing IGBT mounting brackets and packaging components made of different materials, and utilizing fasteners and insulating barrier structures, the problems of poor heat dissipation, difficult assembly, and insulation in IGBT packaging were solved, achieving stable fixing, rapid assembly, and efficient heat dissipation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- DELTA ELECTRONICS INC(CN)
- Filing Date
- 2025-04-18
- Publication Date
- 2026-05-29
AI Technical Summary
Existing IGBT packaging technology suffers from problems such as poor heat dissipation, high cost, easy breakage of ceramic insulation layer, and assembly difficulties. In particular, when using SMT process, it is difficult to achieve stable fixation and good insulation.
The design employs a first and second bracket made of different materials. The IGBT is tightly fixed between the circuit board and the heat dissipation interface using fasteners. The extension of the second bracket and the top abutment are used to achieve insulation barrier, and the fasteners are used for quick fastening and fixing, thereby reducing the overall thickness and improving heat dissipation efficiency.
This achieves stable fixing of IGBTs, rapid assembly, reduced overall size and cost, while meeting electrical safety requirements and improving heat dissipation and insulation performance.
Smart Images

Figure CN224306316U_ABST