A single-crystal silicon wafer slicing device

Abstract

This utility model relates to the technical field of silicon wafer slicing, and in particular to a single-crystal silicon wafer slicing device, comprising: a housing with a frame on top; a cylinder fixedly connected to the top of the frame; a second frame fixedly connected to the output end of the cylinder; a rod rotatably connected to the second frame; a blade slidably connected to the outside of the rod; and a motor located on one side of the second frame. In use, a knob is manually rotated to cause the first ring to slide, adjusting the distance between multiple blades. Finally, the knob is stopped, activating the cylinder and motor to slice the single-crystal silicon wafer, achieving rapid adjustment of the slice thickness. The device has a simple structure, low cost, and is convenient for operators, solving the problem that existing single-crystal silicon wafer slicing devices lack adequate adjustment capabilities.

Description

Technical Field

[0001] This utility model relates to the technical field of silicon wafer slicing, and in particular to a single-crystal silicon wafer slicing device. Background Technology

[0002] Monocrystalline silicon wafers are mainly used to manufacture semiconductor components. They are used as raw materials for manufacturing semiconductor silicon devices, such as high-power rectifiers, high-power transistors, diodes, and switching devices. Monocrystalline silicon wafers need to be cut using a slicing device during production.

[0003] When cutting monocrystalline silicon wafers, the cutting thickness needs to be controlled. In related technologies, after the cylinder and motor work together, the connecting frame moves down, and the cutting blade on the threaded rod rotates to cut the monocrystalline silicon rod placed in the slot in the connecting seat. The cutting efficiency is high, replacing the traditional wire cutting machine. Moreover, the position of the cutting blade can be adjusted by rotating the nuts on both sides of the cutting blade, that is, the spacing between adjacent cutting blades can be adjusted, so that the monocrystalline silicon rod can be cut into monocrystalline silicon wafers of different thicknesses.

[0004] However, in actual use, its adjustment method is relatively complicated and inefficient, making it inconvenient for staff to use and causing inconvenience to the slicing work. Utility Model Content

[0005] The purpose of this invention is to provide a single-crystal silicon wafer slicing device to solve the problems mentioned in the background art.

[0006] The technical solution adopted in this utility model is:

[0007] A single-crystal silicon wafer slicing apparatus, comprising:

[0008] The box has a frame on top;

[0009] The cylinder is fixedly connected to the top of the frame;

[0010] Frame 2 is fixedly connected to the output end of the cylinder;

[0011] The rod is rotatably connected to the second frame.

[0012] The blade is slidably connected to the outside of the rod body;

[0013] Motor 1 is located on one side of the frame 2, and the output end of motor 1 is fixedly connected to one end of the rod.

[0014] Ring body one is fixedly connected to the inner side of the blade, and ring body one is slidably connected to the outer side of the rod body;

[0015] Ring two is fixedly connected to the outside of the rod;

[0016] A bidirectional threaded rod is rotatably connected to the second ring body;

[0017] A through hole is formed on one of the blades, the bidirectional threaded rod passes through two of the blades and through the through hole, and the bidirectional threaded rod is threadedly connected to the other two blades;

[0018] The knob is fixedly connected to one end of the ring body.

[0019] Optionally, a limiting rod is fixedly connected to the second ring body, and the limiting rod passes through the first ring body.

[0020] Optionally, the frame two

[0021] It has a groove on top.

[0022] Optionally, multiple knobs may be provided.

[0023] Optional, including:

[0024] A connecting rod is rotatably connected to the housing.

[0025] The plate body is fixedly connected to the outside of the connecting rod;

[0026] Frame three is fixedly connected to the top of the plate;

[0027] Motor 2 is fixedly connected to the other end of the connecting rod.

[0028] Optionally, the plate, the frame three, and the connecting rod are a group, and each frame three is provided with the rod.

[0029] Optionally, the plate is an elliptical plate.

[0030] Optionally, the frame three is C-shaped.

[0031] Compared with the prior art, the beneficial effects of this utility model are:

[0032] In use, this application involves manually rotating a knob to slide the ring body along with the blades, adjusting the distance between multiple blades. Finally, stopping the knob activates the cylinder and motor to slice the monocrystalline silicon wafer material, enabling rapid adjustment of the slice thickness. The design is relatively simple, low-cost, and easy for operators to use, solving the problem of existing monocrystalline silicon wafer slicing devices lacking adequate adjustment capabilities. Attached Figure Description

[0033] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1 This is a three-dimensional structural diagram of the present application;

[0035] Figure 2 This is a bottom view of the frame structure in this application;

[0036] Figure 3 This is a structural diagram showing the installation position of the connecting rod in this application.

[0037] Figure label:

[0038] 10. Box body; 11. Frame one; 12. Cylinder; 13. Frame two; 14. Rod; 15. Blade; 16. Motor one;

[0039] 20. Ring body one; 21. Ring body two; 22. Bidirectional threaded rod; 23. Through hole; 24. Knob; 25. Groove;

[0040] 30. Plate; 31. Frame three; 32. Connecting rod; 33. Motor two. Detailed Implementation

[0041] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0042] It should be noted that all directional indications in the embodiments of this application are only used to explain the relative positional relationship and movement of each component in a specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0043] In this application, unless otherwise expressly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0044] Furthermore, the use of terms such as "first" and "second" in this application is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. If the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed in this application.

[0045] Monocrystalline silicon wafers are mainly used to manufacture semiconductor components. They are used as raw materials for manufacturing semiconductor silicon devices, such as high-power rectifiers, high-power transistors, diodes, and switching devices. Monocrystalline silicon wafers need to be cut using slicing equipment during production. Monocrystalline silicon wafer slicing equipment on the market needs to control the cutting thickness during the cutting process.

[0046] In related technologies, the connecting frame is lowered by the cooperation of a cylinder and a motor, and the cutting blade on the threaded rod rotates to slice the monocrystalline silicon rod placed in the slot of the connecting seat. The cutting efficiency is high, replacing the traditional wire cutting machine. The position of the cutting blade can be adjusted by rotating the nuts on both sides of the cutting blade, that is, the spacing between adjacent cutting blades can be adjusted, so that the monocrystalline silicon rod can be cut into monocrystalline silicon wafers of different thicknesses. However, in actual use, the adjustment method is relatively complicated and the efficiency is low, which is inconvenient for operators and causes inconvenience to the slicing work.

[0047] To address some of the problems in the related technologies, this application provides a single-crystal silicon wafer slicing device. When needed, simply rotate the knob 24 to rotate the bidirectional threaded rod 22, thereby adjusting the position of the two outer blades 15. This is more convenient and faster, improving the device's usability.

[0048] This application is described below with reference to the accompanying drawings and specific embodiments:

[0049] Combination Figures 1-3This application provides a single-crystal silicon wafer slicing device, comprising: a housing 10, with a frame 11 on its top; a cylinder 12 fixedly connected to the top of the frame 11; a second frame 13 fixedly connected to the output end of the cylinder 12; a rod 14 rotatably connected to the second frame 13; a blade 15 slidably connected to the outside of the rod 14; a motor 16 disposed on one side of the second frame 13, with the output end of the motor 16 fixedly connected to one end of the rod 14; and a ring 20. A ring body 20 is fixedly connected to the inner side of the blade 15, and a ring body 21 is slidably connected to the outer side of the rod body 14; a bidirectional threaded rod 22 is rotatably connected to the ring body 21; a through hole 23 is formed on one of the blades 15, the bidirectional threaded rod 22 passes through two of the blades 15 and passes through the through hole 23, and the bidirectional threaded rod 22 is threadedly connected to the other two blades 15; a knob 24 is fixedly connected to one end of the ring body 21.

[0050] After installing the housing 10 in the designated position, the monocrystalline silicon wafer material to be sliced ​​is fixed to the top of the housing 10 using a clamp. Then, the knob 24 is manually turned, causing the knob 24 to rotate the bidirectional threaded rod 22. Simultaneously, the bidirectional threaded rod 22 is threadedly connected to two rings 20, causing the two rings 20 to slide towards the opposite side on the bidirectional threaded rod 22. This, in turn, causes the two rings 20 to slide the two blades 15 towards the opposite side, thus adjusting the distance between adjacent blades 15. Finally, the knob 24 is stopped, completing the adjustment of the blade 15 position. Finally, cylinder 12 and motor 16 are activated, causing the output end of cylinder 12 to push frame 13 to slide downward on frame 11. At the same time, the output end of motor 16 drives rod 14 to rotate, which in turn drives blade 15 to rotate until blade 15 comes into contact with the monocrystalline silicon wafer material, thus slicing the monocrystalline silicon wafer material. When rod 14 rotates, it drives ring 21 to rotate. Then, ring 21 drives bidirectional threaded rod 22 and knob 24 to rotate with rod 14, without affecting the normal use of blade 15. After the rotation is completed, it does not affect the manual rotation of knob 24.

[0051] Specifically, the clamps for fixing the monocrystalline silicon wafers are threaded rods and clamping plates, which are existing technologies and therefore are not shown in the figure.

[0052] Optionally, a limiting rod is fixedly connected to the second ring 21, the limiting rod passing through the first ring 20, restricting the first ring 20 and the blade 15 to slide only left and right (direction reference). Figure 2 ).

[0053] Optionally, the frame 23 is provided with a groove 25 to prevent the frame 23 from contacting the patient's hand, thereby facilitating the rotation of the knob 24.

[0054] Optionally, multiple knobs 24 are provided, so that the operator can rotate the bidirectional threaded rod 22 by turning any one of the knobs 24 at both ends of the bidirectional threaded rod 22 to adjust the position of the ring body 20 and the blade 15.

[0055] Optionally, it includes: a connecting rod 32, rotatably connected to the housing 10; a plate 30, fixedly connected to the outside of the connecting rod 32; a frame 31, fixedly connected to the top of the plate 30, with the frame 11 fixedly installed on the top of the frame 31; and a motor 2 33, fixedly connected to the other end of the connecting rod 32.

[0056] When it is necessary to slice a cylindrical monocrystalline silicon rod, motor 2 33 is turned on, and the output end of motor 2 33 drives the plate 30 to rotate. At the same time, the frame 3 31 drives the frame 1 11 and the structure on the frame 1 11 to rotate. After the frame 3 31 rotates 90 degrees, the monocrystalline silicon rod is placed at the top center of the box 10. After the monocrystalline silicon rod passes through the two frames 3 31, the monocrystalline silicon rod is fixed with a clamp. Then, cylinder 12 and motor 1 16 are turned on to realize the slicing process of the monocrystalline silicon rod.

[0057] Optionally, the plate 30, the frame 31, and the connecting rod 32 are a group, and each frame 31 is equipped with the rod 14, so that the operator can simultaneously open multiple cylinders 12 and multiple motors 16 to achieve multiple slicing processes on the single crystal silicon rod at the same time.

[0058] Optionally, the plate 30 is an elliptical plate to prevent the plate 30 from protruding from one side of the box 10 when it is not in use, thereby improving practicality.

[0059] Optionally, the frame 31 is C-shaped to facilitate the passage of the single-crystal silicon rod through the frame 31.

[0060] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," and "some examples" indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0061] Furthermore, the technical solutions of the various embodiments can be combined with each other, but only if they are based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed in this application.

[0062] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A single-crystal silicon wafer slicing device, characterized in that, include: The box has a frame on top; The cylinder is fixedly connected to the top of the frame; Frame 2 is fixedly connected to the output end of the cylinder; The rod is rotatably connected to the second frame. The blade is slidably connected to the outside of the rod body; Motor 1 is located on one side of the frame 2, and the output end of motor 1 is fixedly connected to one end of the rod. Ring body one is fixedly connected to the inner side of the blade, and ring body one is slidably connected to the outer side of the rod body; Ring two is fixedly connected to the outside of the rod; A bidirectional threaded rod is rotatably connected to the second ring body; A through hole is formed on one of the blades, the bidirectional threaded rod passes through two of the blades and through the through hole, and the bidirectional threaded rod is threadedly connected to the other two blades; The knob is fixedly connected to one end of the ring body.

2. The single-crystal silicon wafer slicing apparatus according to claim 1, characterized in that, A limiting rod is fixedly connected to the second ring body, and the limiting rod passes through the first ring body.

3. The single-crystal silicon wafer slicing apparatus according to claim 1, characterized in that, The frame two It has a groove on top.

4. The single-crystal silicon wafer slicing apparatus according to claim 1, characterized in that, The knob is provided in multiple ways.

5. A single-crystal silicon wafer slicing apparatus according to claim 1, characterized in that, include: A connecting rod is rotatably connected to the housing. The plate body is fixedly connected to the outside of the connecting rod; Frame three is fixedly connected to the top of the plate; Motor 2 is fixedly connected to the other end of the connecting rod.

6. A single-crystal silicon wafer slicing apparatus according to claim 5, characterized in that, The plate, the frame three, and the connecting rod form a group, and each frame three is provided with the rod.

7. A single-crystal silicon wafer slicing apparatus according to claim 6, characterized in that, The plate is an elliptical plate.

8. A single-crystal silicon wafer slicing apparatus according to claim 6, characterized in that, The frame is C-shaped.

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