An electronic component testing apparatus

Abstract

The utility model discloses an electronic component testing arrangement relates to electronic component detection technical field, including the movable plate who is arranged on the compression plate top, the compression plate with movable plate between through four corners fixed with damping rod connection, the damping rod outside sleeve has spring no.

Description

Technical Field

[0001] This utility model relates to the field of electronic component testing technology, specifically to an electronic component testing device. Background Technology

[0002] Electronic components are the basic elements in electronic circuits. They are usually individually packaged and have two or more leads or metal contacts. In the production process of surface-mount electronic components, test sockets are usually used to test the DC resistance, inductance, parameters and other performance of the electronic components to determine their quality.

[0003] When using the electronic component test fixture, the operator needs to place the electronic surface mount component to be tested into the limiting groove of the substrate on the test fixture, and then press down the substrate to move the electronic surface mount component downwards so that it contacts the probe, and the electronic surface mount component can be tested.

[0004] The existing technology still has some problems: the existing testing equipment uses manual pressing of the substrate to make the electronic components contact the probes. This method will cause the operator's arm to get tired in the long run, increase the workload, and reduce the testing efficiency. At the same time, manual pressing of the substrate can easily lead to excessive pressure, which will damage the electronic components being tested and affect their use.

[0005] The information disclosed in this background section is intended only to enhance the understanding of the overall background of this utility model and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Utility Model Content

[0006] The technical problem to be solved by this utility model is to overcome the above-mentioned defects and provide an electronic component testing device.

[0007] To solve the above-mentioned technical problems, the technical solution provided by this utility model is as follows:

[0008] An electronic component testing device includes a base, a test board fixedly mounted on the upper center of the base, a plurality of evenly distributed probes fixedly connected to the upper end of the test board, the probes being electrically connected to the test board, a placement plate disposed above the test board, the placement plate having a plurality of through holes in the center for cooperating with the probes, a pressure plate disposed above the placement plate, a movable plate disposed above the pressure plate, the pressure plate and the movable plate being connected by damping rods fixed at four corners, a spring sleeved on the outer side of the damping rod, the upper and lower ends of the spring being fixedly connected to the pressure plate and the movable plate respectively, a silicone pad being fixedly connected to the lower end of the pressure plate; the movable plate moves downward by a driving structure, causing the pressure plate to press the placement plate downward, and the electronic component is subsequently tested by the probes, the driving structure being driven by a motor.

[0009] As an improvement, a fixed plate is provided above the movable plate, and the upper rear part of the base is connected to the fixed plate by a fixed connecting plate. Fixed cylinders are fixedly connected to both sides of the fixed plate, and the upper and lower ends of the fixed cylinders pass through the fixed plate. A movable rod is slidably connected inside the fixed cylinder, and the upper and lower ends of the movable rods extend through the fixed cylinders to their outside. The lower end of the movable rod is fixedly connected to the movable plate.

[0010] As an improvement, the drive structure includes a drive shaft fixedly connected to the upper end of the adjacent side of the two moving rods, a drive cylinder slidably sleeved on the drive shaft, an insert shaft fixedly connected to the rear end of the drive cylinder, and a drive rod connected to the rear bearing of the insert shaft.

[0011] As an improvement, a motor frame is fixedly connected to the upper end of the fixed plate behind the drive cylinder, the motor is fixedly connected to the rear end of the motor frame, and the output shaft of the motor is fixedly connected to the end of the drive shaft away from the insertion shaft.

[0012] As an improvement, each of the four corners of the placement plate is slidably connected to a fixing rod that is fixedly connected to the base. A second spring is sleeved on the outside of the fixing rod. The upper and lower ends of the second spring are fixedly connected to the placement plate and the base, respectively. The fixing rod is fixedly connected to the base.

[0013] As an improvement, the upper end of the placement plate is fixedly connected to a frame that matches the shape of the electronic component. The through hole is set inside the frame, and several snap-on slots are opened around the inner side of the frame to snap out the electronic component.

[0014] As an improvement, the probes and through holes are arranged in a matrix, with the same number and distribution position, and the diameter of the probes is slightly smaller than the diameter of the through holes.

[0015] The advantages of this utility model compared with the prior art are as follows: the drive structure is driven by a motor, which can realize the automatic pressing and lifting of the pressure plate. The operation is simple, reducing the time and labor intensity of manual operation and improving the testing efficiency. During the pressing process, the spring and damping rod play a buffering role to avoid applying excessive pressure to the electronic components and protect the electronic components from damage. Attached Figure Description

[0016] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses consistent with some aspects of this disclosure as detailed in the appended claims.

[0017] Figure 1 Three-dimensional illustration provided for embodiments of this utility model Figure 1 ;

[0018] Figure 2 Three-dimensional illustration provided for embodiments of this utility model Figure 2 ;

[0019] Figure 3 Provided for the embodiments of this utility model Figure 2 Enlarged view of area A in the middle;

[0020] Figure 4 Three-dimensional illustration provided for embodiments of this utility model Figure 3 ;

[0021] As shown in the figure: 1. Base; 2. Test plate; 3. Probe; 4. Placement plate; 5. Through hole; 6. Pressure plate; 7. Moving plate; 8. Damping rod; 9. Spring 1; 10. Motor; 11. Fixing plate; 12. Connecting plate; 13. Fixing cylinder; 14. Moving rod; 15. Drive shaft; 16. Drive cylinder; 17. Insert shaft; 18. Drive rod; 19. Motor frame; 20. Fixing rod; 21. Spring 2; 22. Frame; 23. Silicone pad. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Combined with appendix Figures 1-4 As shown, this utility model discloses an electronic component testing device, including a base 1, a test board 2 fixedly installed at the upper middle part of the base 1, a plurality of evenly distributed probes 3 fixedly connected to the upper end of the test board 2, the probes 3 being electrically connected to the test board 2, a placement plate 4 being provided above the test board 2, a plurality of through holes 5 cooperating with the probes 3 being opened in the middle of the placement plate 4, the probes 3 and the through holes 5 being arranged in a matrix, the number and distribution positions of the two being the same, the diameter of the probes 3 being slightly smaller than the diameter of the through holes 5, and a pressure plate 6 being provided above the placement plate 4.

[0024] Next, a movable plate 7 is positioned above the pressure plate 6. The pressure plate 6 and the movable plate 7 are connected by damping rods 8 fixed at the four corners. A spring 9 is sleeved on the outer side of the damping rod 8. The upper and lower ends of the spring 9 are fixedly connected to the pressure plate 6 and the movable plate 7, respectively. A silicone pad 23 is fixedly connected to the lower end of the pressure plate 6. A frame 22, conforming to the shape of the electronic component, is fixedly connected to the upper end of the placement plate 4. A through hole 5 is located within the frame 22. Several snap-fit ​​slots are formed around the inner perimeter of the frame 22 to snap out the electronic component. The frame 22 secures the electronic component, ensuring its proper placement. No displacement occurs during the test, thus ensuring accurate contact between probe 3 and electronic components and improving test accuracy. Each of the four corners of the placement plate 4 is slidably connected to a fixing rod 20 fixedly connected to the base 1. A spring 21 is sleeved on the outside of the fixing rod 20. The upper and lower ends of the spring 21 are fixedly connected to the placement plate 4 and the base 1, respectively. The fixing rod 20 is fixedly connected to the base 1. The moving plate 7 moves downward through the driving structure, so that the pressure plate 6 presses the placement plate 4 downward. The electronic components are then tested by probe 3. The driving structure is driven by motor 10.

[0025] Then, a fixed plate 11 is provided above the movable plate 7. The upper rear part of the base 1 is connected to the fixed plate 11 by a connecting plate 12. Fixed cylinders 13 are fixedly connected to both sides of the fixed plate 11. The upper and lower ends of the fixed cylinders 13 pass through the fixed plate 11. A movable rod 14 is slidably connected inside the fixed cylinder 13. The upper and lower ends of the movable rod 14 pass through the fixed cylinder 13 and extend to its outside. The lower end of the movable rod 14 is fixedly connected to the movable plate 7. The driving structure includes a drive shaft 15 fixedly connected to the upper end of the movable rods 14 on the adjacent side. A drive cylinder 16 is slidably sleeved on the drive shaft 15. A plug shaft 17 is fixedly connected to the rear end of the drive cylinder 16. A drive rod 18 is connected to the rear bearing of the plug shaft 17. A motor frame 19 is fixedly connected to the upper end of the fixed plate 11 behind the drive cylinder 16. A motor 10 is fixedly connected to the rear end of the motor frame 19. The output shaft of the motor 10 is fixedly connected to the end of the drive shaft 15 away from the plug shaft 17.

[0026] In practice, when testing electronic components, the electronic components are first placed within the frame 22 on the placement plate 4. The edges of the electronic components are limited by the inner side of the frame 22. Then, the motor 10 is started, and the output shaft of the motor 10 drives the drive shaft 15 to rotate. When the drive shaft 15 rotates, the drive cylinder 16 slides on the drive shaft 15. At the same time, the drive rod 18 is driven to move through the insertion shaft 17. The movement of the drive rod 18 causes the moving rod 14 to slide downward within the fixed cylinder 13, thereby driving the moving plate 7 to move downward. When the moving plate 7 moves downward, the pressure plate 6 is pushed downward through the damping rod 8. The silicone pad 23 at the lower end of the pressure plate 6 contacts the electronic components on the placement plate 4 and applies pressure, causing the placement plate 4 to move downward along the fixed rod 20. During the compression process, the spring 9 and the damping rod 8 are compressed to buffer the compression force and prevent damage to the electronic components during the compression process.

[0027] At this time, probe 3 contacts the electronic component through through hole 5. Since probe 3 is electrically connected to test board 2, test board 2 can perform performance testing on electronic component. After the test is completed, motor 10 is turned off and reversed. Moving plate 7 moves upward under the action of spring 9, which lifts pressure plate 6. Placing plate 4 is reset under the action of spring 21. The tested electronic component is taken out from frame 22 through the snap-on slot. There is no need for manual repeated pressing of pressure plate 6, which reduces manual fatigue and improves testing efficiency.

[0028] It should be noted that all electrical components mentioned in this article are connected to an external main controller and 220V AC mains power. The main controller can be a conventional known device such as a computer. The specific implementation of this disclosure omits detailed descriptions of known functions and components. To ensure device compatibility, the operating methods used are consistent with the parameters of commercially available instruments.

[0029] The present invention and its embodiments have been described above. This description is not restrictive, and the accompanying drawings are only one embodiment of the present invention; the actual structure is not limited thereto. In conclusion, if those skilled in the art are inspired by this description and design similar structures and embodiments without departing from the inventive spirit of the present invention, such designs should fall within the protection scope of the present invention.

Claims

1. An electronic component testing device, comprising a base (1), wherein a test plate (2) is fixedly mounted on the upper middle part of the base (1), and a plurality of evenly distributed probes (3) are fixedly connected to the upper end of the test plate (2), the probes (3) being electrically connected to the test plate (2), a placement plate (4) is disposed above the test plate (2), a plurality of through holes (5) cooperating with the probes (3) are opened in the middle of the placement plate (4), and a pressure plate (6) is disposed above the placement plate (4), characterized in that: A movable plate (7) is provided above the pressure plate (6). The pressure plate (6) and the movable plate (7) are connected by damping rods (8) fixed at the four corners. A spring (9) is sleeved on the outside of the damping rod (8). The upper and lower ends of the spring (9) are fixedly connected to the pressure plate (6) and the movable plate (7) respectively. A silicone pad (23) is fixedly connected to the lower end of the pressure plate (6). The moving plate (7) moves downward through the driving structure, causing the pressure plate (6) to press the placement plate (4) downward, and the electronic components are tested by the probe (3). The driving structure is driven by the motor (10).

2. The electronic component testing device according to claim 1, characterized in that: A fixed plate (11) is provided above the movable plate (7). The upper rear part of the base (1) is connected to the fixed plate (11) by a connecting plate (12). Fixed cylinders (13) are fixedly connected to both sides of the fixed plate (11). The upper and lower ends of the fixed cylinders (13) pass through the fixed plate (11). A movable rod (14) is slidably connected inside the fixed cylinder (13). The upper and lower ends of the movable rod (14) pass through the fixed cylinder (13) and extend to its outside. The lower end of the movable rod (14) is fixedly connected to the movable plate (7).

3. The electronic component testing device according to claim 2, characterized in that: The drive structure includes a drive shaft (15) fixedly connected to the upper end of the two movable rods (14) on the adjacent side. A drive cylinder (16) is slidably sleeved on the drive shaft (15). A plug shaft (17) is fixedly connected to the rear end of the drive cylinder (16). A drive rod (18) is connected to the rear bearing of the plug shaft (17).

4. The electronic component testing device according to claim 3, characterized in that: The fixed plate (11) is fixedly connected to the upper end of the drive cylinder (16) with a motor frame (19). The motor (10) is fixedly connected to the rear end of the motor frame (19). The output shaft of the motor (10) is fixedly connected to the end of the drive shaft (15) away from the insertion shaft (17).

5. The electronic component testing apparatus according to claim 1, characterized in that: The four corners of the placement plate (4) are slidably connected to the fixing rods (20) fixedly connected to the base (1). The fixing rods (20) are sleeved with springs (21). The upper and lower ends of the springs (21) are fixedly connected to the placement plate (4) and the base (1) respectively. The fixing rods (20) are fixedly connected to the base (1).

6. The electronic component testing apparatus according to claim 1, characterized in that: The upper end of the placement plate (4) is fixedly connected to a frame (22) that matches the shape of the electronic component. The through hole (5) is set inside the frame (22). Several snap-on slots are opened around the inner side of the frame (22) to snap out the electronic component.

7. The electronic component testing apparatus according to claim 1, characterized in that: The probes (3) and through holes (5) are arranged in a matrix, and their number and distribution positions are the same. The diameter of the probes (3) is slightly smaller than the diameter of the through holes (5).

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