Chassis cooling system

The heat dissipation grille system, designed with cross-flow fans and air guide plates, solves the problem of temperature rise after air flows over the motherboard, achieving a more efficient heat dissipation effect. The installation of the graphics card cooling device further accelerates heat dissipation.

CN224317986UActive Publication Date: 2026-06-02ZHUHAI POGE TECH CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
ZHUHAI POGE TECH CO LTD
Filing Date
2025-08-01
Publication Date
2026-06-02

AI Technical Summary

Technical Problem

In existing technologies, the temperature rises after air flows through the motherboard and its components, resulting in unsatisfactory heat exchange effects from heat pipes or liquid cooling technologies, which cannot effectively dissipate heat.

Method used

It adopts a cross-flow fan and air guide plate design to form an independent heat dissipation grid system. The cold air directly exchanges heat with the heat dissipation grid and is then discharged from the chassis. Combining Bernoulli's principle, negative pressure is used to accelerate airflow. The graphics card cooling device is installed on the air guide plate to accelerate heat dissipation.

Benefits of technology

The heat exchange efficiency of the heat dissipation grille has been improved, the airflow inside the chassis has been enhanced, the heat dissipation speed of the graphics card cooling device has been increased, and the overall heat dissipation effect has been improved.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN224317986U_ABST
    Figure CN224317986U_ABST
Patent Text Reader

Abstract

This application discloses a heat dissipation system for a chassis. The chassis includes a body with side panels. The heat dissipation system includes a cross-flow fan, a first air guide plate, a second air guide plate, an air inlet, and an air outlet. The first end of the first air guide plate extends to the top of the chassis, dividing the top of the chassis into an air inlet area and an air outlet area. The second end of the first air guide plate extends above the air outlet side of the cross-flow fan. The first end of the second air guide plate extends to the air outlet area, and the second end of the second air guide plate extends below the air outlet side of the cross-flow fan. A heat dissipation grille is installed at the air inlet. Cold air exchanges heat with the heat dissipation grille and is directly discharged from the chassis, improving the heat exchange efficiency of the heat dissipation grille and accelerating airflow within the chassis. Because the cross-section of the air inlet is larger than the cross-section of the air outlet, the airflow velocity at the outlet of the air outlet is faster, creating negative pressure. At least a portion of the air inside the chassis is attracted and quickly discharged from the chassis under the action of negative pressure.
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