Chassis cooling system
The heat dissipation grille system, designed with cross-flow fans and air guide plates, solves the problem of temperature rise after air flows over the motherboard, achieving a more efficient heat dissipation effect. The installation of the graphics card cooling device further accelerates heat dissipation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ZHUHAI POGE TECH CO LTD
- Filing Date
- 2025-08-01
- Publication Date
- 2026-06-02
AI Technical Summary
In existing technologies, the temperature rises after air flows through the motherboard and its components, resulting in unsatisfactory heat exchange effects from heat pipes or liquid cooling technologies, which cannot effectively dissipate heat.
It adopts a cross-flow fan and air guide plate design to form an independent heat dissipation grid system. The cold air directly exchanges heat with the heat dissipation grid and is then discharged from the chassis. Combining Bernoulli's principle, negative pressure is used to accelerate airflow. The graphics card cooling device is installed on the air guide plate to accelerate heat dissipation.
The heat exchange efficiency of the heat dissipation grille has been improved, the airflow inside the chassis has been enhanced, the heat dissipation speed of the graphics card cooling device has been increased, and the overall heat dissipation effect has been improved.
Smart Images

Figure CN224317986U_ABST