A dual-disk-position solid state disk expansion device
By employing a heat dissipation structure and sealing design made of aluminum alloy and copper alloy in the solid-state drive expansion device, the problem of poor heat dissipation is solved, resulting in a stable and long-life dual-bay solid-state drive expansion device.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HYUNDAI DIGITAL CO LTD
- Filing Date
- 2025-06-16
- Publication Date
- 2026-06-02
AI Technical Summary
Traditional dual-bay solid-state drive (SSD) expansion devices have poor heat dissipation, causing the SSD temperature to rise during read and write operations, triggering overheat protection, resulting in a sharp drop in performance, shortening device lifespan, and increasing the risk of data loss.
The device features a hollow box structure with internal mounting components and a fixing plate. The connector mates with the hard drive slot, and a heat sink is installed at the top through a heat dissipation slot. The heat sink is fixed to the box with bolts, and heat dissipation fins are installed at the top of the heat sink. Heat-conducting fins are installed inside the box, and the heat sink and heat-conducting fins are attached to each other. The combination of aluminum alloy and copper alloy materials improves heat dissipation efficiency, and isolation pads and sealing rings prevent dust and moisture from entering.
Effectively control solid-state drive temperature, maintain stable operation, extend device life, reduce the risk of data loss, and ensure data transfer rates and long-term stability of the device during high-load read and write tasks.
Smart Images
Figure CN224318155U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of solid-state drive technology, and more specifically, it relates to a dual-bay solid-state drive expansion device. Background Technology
[0002] Solid-state drive (SSD) expansion devices are hardware components that increase the storage capacity of electronic devices by connecting additional SSDs. Besides expanding capacity, they can also optimize data management and improve performance. Dual-bay SSD expansion devices, as an advanced form, support the simultaneous connection of two SSDs, effectively doubling the storage capacity and easily handling large data storage needs. In terms of performance, the parallel read / write mechanism of the two drives significantly improves data transfer speeds. However, traditional dual-bay SSD expansion devices suffer from poor heat dissipation, causing the SSD temperature to rise continuously during sustained read / write operations. Once the overheat protection mechanism is triggered, performance drops sharply. At the same time, high temperatures accelerate the aging process of the SSD controller chip and flash memory chips, shortening the device's lifespan and increasing the risk of data loss. Utility Model Content
[0003] To address the aforementioned technical problems, this utility model provides a dual-bay solid-state drive (SSD) expansion device. This addresses the technical issues in the prior art where traditional dual-bay SSD expansion devices have poor heat dissipation, leading to increased SSD temperature during continuous read / write operations, triggering overheat protection and causing a sharp drop in performance. Furthermore, high temperatures accelerate the aging of the controller chip and flash memory chips, shortening their lifespan and increasing the risk of data loss.
[0004] The purpose and function of this utility model's dual-bay solid-state drive expansion device are achieved through the following specific technical means:
[0005] A dual-bay solid-state drive (SSD) expansion device includes a hollow housing with a mounting component inside. A fixing plate is located on one side of the mounting component, contacting and connected to one side of the housing via screws. An assembly slot is formed on the fixing plate of the mounting component, and a connector is disposed within the assembly slot. Two sets of hard drive slots are also formed opposite each other on the mounting component within the housing. One side of the connector is engaged within the assembly slot, and the other side of the connector passes through the assembly slot and is disposed within the hard drive slot. A heat dissipation groove is formed through the top of the housing, and a heat dissipation plate is disposed within the heat dissipation groove and connected to the housing via bolts.
[0006] The above technical solution further includes that the connector is provided with two sets of first interfaces on the side of the housing corresponding to the two sets of hard disk slots, and fixing parts for fixing the hard disk are provided in the two sets of hard disk slots at the height of the first interfaces.
[0007] The above technical solution further includes that the connector is provided with multiple sets of second interfaces on the other side away from the two sets of first interfaces, and an indicator light is provided on the connector near the multiple sets of second interfaces.
[0008] The above technical solution further includes that multiple sets of heat dissipation fins are evenly arranged on the top of the heat dissipation plate; a heat-conducting plate is also provided inside the box, and the top of the heat-conducting plate is attached to the bottom of the heat dissipation plate.
[0009] The above technical solution further includes that the box body and the heat sink are both made of aluminum alloy, and the heat-conducting sheet is made of copper alloy.
[0010] The above technical solution further includes that an isolation pad is provided in the heat dissipation groove between the heat dissipation plate and the box body, and the top of the isolation pad is in contact with the heat dissipation plate.
[0011] The above technical solution further includes that the fixing plate is provided with an assembly groove on the side near the box body, and a rubber sealing ring is replaceably provided in the assembly groove.
[0012] Compared with the prior art, the present invention has the following beneficial effects:
[0013] 1. The enclosure and heatsink are made of aluminum alloy. A heatsink slot runs through the top of the enclosure, and the heatsink is embedded in the slot and secured to the enclosure with bolts. Multiple heatsink fins are located at the top of the heatsink, and copper alloy heat-conducting fins are installed inside the enclosure, with the tops of the fins contacting the bottom of the heatsink. When the SSD generates heat, it is transferred to the heatsink via the heat-conducting fins, where the heatsink fins expand the heat dissipation area and accelerate heat diffusion into the air. During continuous read / write operations, this cooling structure controls the SSD temperature, maintaining stable operation and ensuring high data transfer rates for heavy read / write tasks.
[0014] 2. An isolation pad is installed within the heat dissipation groove between the enclosure and the heat sink, with the top of the pad contacting the heat sink to form a physical barrier. An assembly slot is provided on the side of the mounting plate closest to the enclosure, where a replaceable rubber sealing ring is installed. This dual protective structure of the isolation pad and sealing ring prevents dust, moisture, and other impurities from the external environment from entering the enclosure. The combination of these two elements reduces the impact of external environmental factors on the solid-state drive (SSD), preventing accelerated aging of the controller chip and flash memory chips due to environmental factors, ensuring long-term stable operation of the SSD, and reducing the risk of data loss due to hardware aging. Attached Figure Description
[0015] Figure 1 This is a schematic diagram of the assembled structure of this utility model.
[0016] Figure 2 This is an exploded structural diagram of the present invention.
[0017] Figure 3 yes Figure 2 A magnified structural diagram of region a in the middle.
[0018] Figure 4 This is a structural schematic diagram of the mounting component of this utility model.
[0019] In the diagram, the correspondence between component names and drawing numbers is as follows:
[0020] 1. Housing; 2. Mounting component; 3. Connector; 4. Heat sink; 101. Fixing plate; 102. Hard drive bay; 103. Heat sink; 201. First interface; 202. Fixing component; 301. Second interface; 302. Indicator light; 401. Heat sink fins; 402. Heat conduction plate; 601. Isolation pad; 701. Sealing ring. Detailed Implementation
[0021] The embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate the technical solution of this utility model, but should not be used to limit the scope of protection of this utility model.
[0022] Example:
[0023] like Figures 1 to 4 As shown, this utility model provides a dual-bay solid-state drive expansion device, including a hollow housing 1. A mounting component 2 is installed inside the housing 1, and a fixing plate 101 is provided on one side of the mounting component 2. The fixing plate 101 contacts one side of the housing 1 and is connected by screws. An assembly slot is provided on the fixing plate 101 of the mounting component 2, and a connector 3 is provided within the assembly slot. Two sets of hard drive slots 102 are also provided opposite each other on the mounting component 2 inside the housing 1. One side of the connector 3 is engaged in the assembly slot, and the other side of the connector 3 passes through the assembly slot and is positioned within the hard drive slot 102. A heat dissipation groove 103 is also provided through the top of the housing 1, and a heat dissipation plate 4 is provided within the heat dissipation groove 103 and connected to the housing 1 by bolts. The housing 1 has a hollow structure to provide space for internal components. The mounting component 2 is installed inside the housing 1, and its fixing plate 101 is in close contact with the side of the housing 1 and is fixedly connected by screws. This connection method forms a stable frame structure, ensuring that the position of the mounting component 2 within the housing 1 will not shift. During the use of the device, it can prevent the mounting component 2 from shaking or shifting due to external forces such as vibration, maintain the relative position of the internal components, ensure the structural strength of the entire device during use, and avoid affecting the function of the device due to structural instability.
[0024] The mounting plate 101 of the mounting component 2 has an assembly slot. One side of the connector 3 is fitted into the assembly slot, and the other side extends through the assembly slot into the hard drive bay 102. This layout achieves precise positioning and installation of the connector 3 and the hard drive bay 102. When the solid-state drive is installed in the hard drive bay 102, it can reliably connect with the connector 3, ensuring a stable connection of the data transmission line. This avoids poor contact between the solid-state drive and the connector 3 due to inaccurate relative positioning of the connector 3 and the hard drive bay 102, which could lead to data transmission interruption or instability, thus ensuring normal data transmission within the device. The mounting component 2 inside the housing 1 has two sets of hard drive bays 102 arranged opposite each other, allowing for the simultaneous installation of two solid-state drives, realizing a dual-bay storage expansion function. Compared to a single-bay device, a dual-bay configuration directly doubles the device's storage space, meeting users' needs for large-capacity data storage. Furthermore, the two solid-state drives can achieve different functions through different combinations, providing users with a more flexible storage solution.
[0025] A heat dissipation slot 103 is formed through the top of the enclosure 1, and a heat sink 4 is installed inside the heat dissipation slot 103 and connected to the enclosure 1 by bolts. The heat sink 4 is tightly fixed to the enclosure 1, forming an effective heat dissipation channel. When the solid-state drive generates heat during operation, the heat can be conducted through the enclosure 1 to the heat sink 4, and then dissipated to the external environment. This prevents heat accumulation inside the device, maintains a stable internal operating temperature, prevents performance degradation of the solid-state drive due to excessive temperature, or damage to the internal hardware due to overheating, and ensures stable operation of the device over a long period of time.
[0026] like Figures 2 to 4 As shown, on the side of connector 3 closest to housing 1, two sets of first interfaces 201 are provided corresponding to the two sets of hard drive slots 102. Within the two sets of hard drive slots 102, fasteners 202 for securing the hard drives are provided at the height corresponding to the first interfaces 201. On the other side of connector 3 away from the two sets of first interfaces 201, multiple sets of second interfaces 301 are provided, and indicator lights 302 are also provided on the connector 3 closest to the multiple sets of second interfaces 301. The two sets of first interfaces 201 on the side of connector 3 closest to housing 1 correspond to the two sets of hard drive slots 102. The first interfaces 201 use SATA interfaces to adapt to SATA protocol solid-state drives, ensuring stable data transmission within the drive. The two sets of SATA interfaces achieve independent data paths for the two drive bays, ensuring that the solid-state drive installed in each hard drive slot 102 can accurately connect to the corresponding first interface 201. This one-to-one correspondence makes the data transmission path of the solid-state drive clear and independent, avoiding cross-interference of data transmission lines between the two hard drives, and ensuring the accuracy and stability of data transmission.
[0027] Within each of the two sets of hard drive slots 102, a fixing member 202 is installed at the height corresponding to the first interface 201. The fixing member 202 secures the solid-state drive (SSD) to a specific position within the hard drive slot 102, ensuring stable contact between the SSD interface and the first interface 201. This prevents the SSD from shifting due to device movement or vibration, and avoids data transmission interruptions or data loss caused by loose interfaces or poor contact. On the other side of the connector 3 away from the first interface 201, multiple sets of second interfaces 301 are provided. These second interfaces 301 are equipped with different types of USB interfaces, covering specifications such as USB-A and USB-C, and are compatible with various external devices such as laptops, desktops, and tablets. Users do not need additional adapters; they can connect the expansion device to external devices and complete data interaction simply by using the corresponding USB interface. At the same time, multiple USB interface types support different transmission rate requirements, meeting diverse scenarios from daily file copying to large data transfers.
[0028] An indicator light 302 is provided on the connector 3 near the second interface 301. The indicator light 302 visually displays the device's operating status through different on / off states and flashing frequencies. For example, if the indicator light 302 is lit, it means the device is powered on; if it is flashing, it means data transmission is in progress; if it is continuously off or flashing abnormally, it indicates a possible fault. This allows users to quickly determine the device's operating status and promptly identify and resolve problems.
[0029] like Figures 1 to 2 As shown, multiple sets of heat dissipation fins 401 are evenly arranged on the top of the heat sink 4; a heat-conducting plate 402 is also provided inside the housing 1, with the top of the heat-conducting plate 402 in contact with the bottom of the heat sink 4; an isolation pad 601 is also provided in the heat dissipation groove 103 between the heat sink 4 and the housing 1, with the top of the isolation pad 601 in contact with the heat sink 4. The multiple sets of heat dissipation fins 401 on the top of the heat sink 4 increase the contact area between the heat sink 4 and the air. After the heat generated by the solid-state drive is conducted to the heat sink 4, the heat dissipation fins 401 can accelerate the diffusion of heat to the surrounding air, improving heat dissipation efficiency. The multiple sets of heat dissipation fins 401 form a heat dissipation channel, promoting air circulation and carrying away heat; the heat-conducting plate 402 is installed inside the housing 1, with the top of the heat-conducting plate 402 in contact with the bottom of the heat sink 4, establishing a heat conduction path between the solid-state drive and the heat sink 4. The heat generated by the solid-state drive is transferred through the enclosure 1 to the heat conduction plate 402, and then quickly conducted by the heat conduction plate 402 to the heat sink 4, so that the heat is transferred more efficiently and the heat is reduced to accumulate inside the device.
[0030] An isolation pad 601 is installed within the heat dissipation groove 103 between the heat sink 4 and the housing 1. The top of the isolation pad 601 contacts the heat sink 4, preventing external dust, moisture, and other impurities from entering the housing 1 through the heat dissipation groove 103. This avoids dust accumulation affecting heat dissipation, prevents moisture from causing short circuits in internal electronic components, protects the solid-state drive and other components, and extends the device's lifespan. Simultaneously, the heat sink 4 is fixed to the housing 1 with bolts, and the isolation pad 601 acts as a buffer, preventing direct contact and friction between the heat sink 4 and the housing 1, and preventing the surfaces of the heat sink 4 and the housing 1 from rubbing against each other. During long-term use, if the heat sink 4 is in direct contact with the housing 1, frequent friction will lead to wear of the surface coating and loss of metal materials, affecting heat dissipation performance and structural strength. The isolation pad 601 blocks hard wear, maintains the surface integrity of the heat sink 4, ensures that the heat sink 4 can perform its heat dissipation function normally, and extends its lifespan.
[0031] Both the housing 1 and the heat sink 4 are made of aluminum alloy, while the heat-conducting plate 402 is made of copper alloy. The aluminum alloy construction of the housing 1 and heat sink 4 provides excellent thermal conductivity, allowing the housing 1 to quickly absorb the heat generated by the solid-state drive and transfer it to the heat sink 4. Additionally, the low density of aluminum alloy reduces the overall weight of the device, making it easy to carry. The copper alloy construction of the heat-conducting plate 402 has a higher thermal conductivity than aluminum alloy, enabling efficient heat transfer from the housing 1 to the heat sink 4. Together, these three components form an efficient heat dissipation path, allowing heat to be quickly dissipated to the external environment and maintaining a stable internal temperature for the device.
[0032] like Figures 3 to 4 As shown, the mounting plate 101 has an assembly groove on the side near the housing 1, and a replaceable rubber sealing ring 701 is installed in the assembly groove. The mounting groove on the side of the mounting plate 101 near the housing 1, with the rubber sealing ring 701 inside, forms a physical barrier through its replaceable design. The sealing ring 701 fills the gap between the mounting plate 101 and the housing 1, preventing external dust, moisture, and other impurities from entering the housing 1. Dust can adhere to the surface of components and affect heat dissipation, while moisture intrusion can cause short circuits in electronic components; the sealing ring 701 prevents such situations. The rubber material is elastic and can adapt to slight positional deviations during the assembly of the mounting plate 101 and the housing 1, maintaining a sealing effect. When the sealing ring 701 wears out or ages and loses its sealing performance, it can be removed from the assembly groove and replaced with a new sealing ring 701, continuously maintaining the device's sealing performance, protecting the internal solid-state drive and other components, and extending the device's lifespan.
[0033] The above description is merely an embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.
Claims
1. A dual-disk solid state disk expansion device comprising a box body (1) with a hollow structure, characterized in that: An installation component (2) is installed inside the box (1). A fixing plate (101) is also provided on one side of the installation component (2). The fixing plate (101) contacts one side of the box (1) and is connected by screws. An assembly slot is also provided on the fixing plate (101) of the installation component (2). A connector (3) is also provided in the assembly slot. Two sets of hard disk slots (102) are also provided opposite to each other on the installation component (2) inside the box (1). One side of the connector (3) is inserted into the assembly slot, and the other side of the connector (3) passes through the assembly slot and is placed in the hard disk slot (102). A heat dissipation slot (103) is also provided through the top of the box (1). A heat dissipation plate (4) is provided in the heat dissipation slot (103), and the heat dissipation plate (4) is connected to the box (1) by bolts.
2. The dual-bay solid-state drive expansion device according to claim 1, characterized in that: The connector (3) is provided with two sets of first interfaces (201) on the side of the housing (1) corresponding to the two sets of hard disk slots (102), and the two sets of hard disk slots (102) are provided with fasteners (202) for fixing the hard disks at the height of the first interfaces (201).
3. The dual-bay solid-state drive expansion device according to claim 2, characterized in that: On the other side of the connector (3) away from the two sets of first interfaces (201), there are also a number of second interfaces (301), and an indicator light (302) is provided on the connector (3) near the number of second interfaces (301).
4. The dual-bay solid-state drive expansion device according to claim 1, characterized in that: The top of the heat sink (4) is uniformly provided with multiple sets of heat dissipation fins (401); the box body (1) is also provided with a heat-conducting plate (402), the top of the heat-conducting plate (402) is attached to the bottom of the heat sink (4).
5. A dual-bay solid-state drive expansion device according to claim 4, characterized in that: The box body (1) and the heat sink (4) are both made of aluminum alloy, and the heat-conducting sheet (402) is made of copper alloy.
6. A dual-bay solid-state drive expansion device according to claim 1, characterized in that: An isolation pad (601) is also provided in the heat dissipation groove (103) between the heat dissipation plate (4) and the box body (1), and the top of the isolation pad (601) is in contact with the heat dissipation plate (4).
7. A dual-bay solid-state drive expansion device according to claim 1, characterized in that: The fixing plate (101) is provided with an assembly groove on the side near the box body (1), and a rubber sealing ring (701) is replaceably provided in the assembly groove.