Lamp bead and light emitting device

Abstract

This application belongs to the field of lighting device technology and discloses a lamp bead and a light-emitting device. The lamp bead includes: a packaging bracket with lead circuitry; a control chip including multiple first electrical connection portions; multiple first fixed connection structures electrically connected to the multiple first electrical connection portions and the lead circuitry, with the first fixed connection structures contacting both the first electrical connection portions and the lead circuitry; a light-emitting diode (LED) electrically connected to the control chip via the lead circuitry; and the LED including multiple second electrical connection portions; and multiple second fixed connection structures electrically connected to the multiple second electrical connection portions and the lead circuitry, with the second fixed connection structures contacting both the second electrical connection portions and the lead circuitry. This application can solve the technical problem of low lamp bead production efficiency.

Description

Technical Field

[0001] This application belongs to the field of lighting device technology, specifically relating to a lamp bead and a light-emitting device. Background Technology

[0002] LED chips consist of a package bracket and a control chip and an LED connected to the package bracket. Traditional packaging methods involve fixing the control chip and LED onto the package bracket, then bonding wires between the control chip and the package bracket, and between the LED and the package bracket, to electrically connect the control chip, LED, and package bracket. This method has low production efficiency. Utility Model Content

[0003] The purpose of this application is to provide an LED chip and a light-emitting device to solve the technical problem of low LED chip production efficiency in the prior art.

[0004] To achieve the above objectives, an embodiment of the first aspect of this application provides a light chip, comprising: a packaging bracket having lead circuitry on it; a control chip including a plurality of first electrical connection portions; a plurality of first fixed connection structures electrically connected to the plurality of first electrical connection portions and the lead circuitry, wherein the first fixed connection structures are in contact with the first electrical connection portions and the lead circuitry; a light-emitting diode electrically connected to the control chip via the lead circuitry; the light-emitting diode including a plurality of second electrical connection portions; and a plurality of second fixed connection structures electrically connected to the plurality of second electrical connection portions and the lead circuitry, wherein the second fixed connection structures are in contact with the second electrical connection portions and the lead circuitry.

[0005] In some embodiments, the lead circuit includes a plurality of first pads and a plurality of second pads. The plurality of first pads are electrically connected to a plurality of first fixed connection structures. The area of ​​the first pad is larger than the area of ​​the first electrical connection portion. The first fixed connection structure includes a first protrusion disposed on the control chip. The plurality of second pads are electrically connected to a plurality of second fixed connection structures. The area of ​​the second pad is larger than the area of ​​the second electrical connection portion. The second fixed connection structure includes a second protrusion disposed on the light-emitting diode.

[0006] In some embodiments, the first protrusion is connected to the first pad via a first welding structure; and / or, the second protrusion is connected to the second pad via a second welding structure.

[0007] In some embodiments, the area of ​​the first protrusion projected onto a plane perpendicular to the thickness direction of the control chip is 1600 μm. 2 -4900um 2 .

[0008] In some embodiments, the lead circuit further includes a signal input lead group, a power supply lead group, a ground lead, and a connection lead group; the control chip includes a signal input terminal, a power supply terminal, a ground terminal, and a first signal output terminal, the signal input terminal is electrically connected to the signal input lead group, the power supply terminal is electrically connected to the power supply lead, and the ground terminal is electrically connected to the ground lead; the positive electrode of the light-emitting diode is electrically connected to the power supply lead group, and the negative electrode of the light-emitting diode is electrically connected to the first signal output terminal through the connection lead group.

[0009] In some embodiments, the power lead assembly includes a first power lead, and the power terminal and the positive terminal of the light-emitting diode are electrically connected to the first power lead.

[0010] In some embodiments, there are two signal input terminals, namely a main signal input terminal and a backup signal input terminal; the signal input lead group includes two signal input leads, which are electrically connected to the main signal input terminal and the backup signal input terminal, respectively.

[0011] In some embodiments, multiple light-emitting diodes are provided, and multiple first signal output terminals are provided; the connecting lead group includes multiple connecting leads, and the two ends of each connecting lead are electrically connected to the corresponding light-emitting diode and the corresponding first signal output terminal, respectively, and the multiple connecting leads are of equal length and parallel to each other.

[0012] In some embodiments, the control chip further includes a second signal output terminal; the lead circuit further includes a signal output lead electrically connected to the second signal output terminal.

[0013] An embodiment of the second aspect of this application also provides a light-emitting device, including a plurality of lamp beads according to any one of the first aspect embodiments, wherein the plurality of lamp beads are electrically connected to each other.

[0014] The beneficial effects of the LED chip and light-emitting device provided in this application are as follows: The control chip is connected to the lead circuit through a first fixed connection structure, which not only electrically connects the control chip to the lead circuit but also fixes the control chip on the package bracket. The light-emitting diode is connected to the package bracket through a second fixed connection structure, which not only electrically connects the control chip to the lead circuit but also fixes the control chip on the package bracket. By simultaneously fixing and electrically connecting the package bracket, control chip, and light-emitting diode, the LED chip achieves high production efficiency. This application solves the technical problem of low production efficiency for LED chips. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the structure of an existing LED chip;

[0017] Figure 2 Schematic diagram of the structure of the lamp bead provided in some embodiments of this application Figure 1 ;

[0018] Figure 3 for Figure 2 Schematic diagram of the structure of the packaging bracket;

[0019] Figure 4 Schematic diagram of the structure of the control chip connected to the first protrusion provided in some embodiments of this application Figure 1 ;

[0020] Figure 5 for Figure 2 Structural block diagram of the central LED bead;

[0021] Figure 6 Schematic diagram of the structure of the lamp bead provided in some embodiments of this application Figure 2 ;

[0022] Figure 7 for Figure 6 Schematic diagram of the structure of the packaging bracket;

[0023] Figure 8 Schematic diagram of the structure of the control chip connected to the first protrusion provided in some embodiments of this application Figure 2 ;

[0024] Figure 9 for Figure 6 Structural block diagram of the central LED bead;

[0025] Figure 10 Schematic diagram of the structure of the lamp bead provided in some embodiments of this application Figure 3 ;

[0026] Figure 11 Method flow for manufacturing the first protrusion provided in some embodiments of this application Figure 1 ;

[0027] Figure 12 This is a schematic diagram of the structure connecting the metal layer and the control chip provided in some embodiments of this application;

[0028] Figure 13 This is a schematic diagram of the structure of a mask covering a metal layer provided in some embodiments of this application;

[0029] Figure 14 This is a schematic diagram of the structure for connecting photoresist and metal layer according to some embodiments of this application;

[0030] Figure 15A schematic diagram of the structure of the control chip, the first protrusion, and the photoresist connection provided in some embodiments of this application;

[0031] Figure 16 This is a schematic diagram showing the connection between the first protrusion and the first electrical connection part in the control chip.

[0032] Figure 17 Method flow for manufacturing the first protrusion provided in some embodiments of this application Figure 2 ;

[0033] Figure 18 A schematic diagram of a thin film covering a control chip, provided in some embodiments of this application;

[0034] Figure 19 This is a schematic diagram of the structure of the control chip, thin film and metal layer connection provided in some embodiments of this application.

[0035] The following are the labeling elements in the figure:

[0036] 100. LED beads;

[0037] 10. Package bracket; 11. Support body; 12. Lead circuit; 121. Signal input lead group; 1211. Main signal input lead; 1212. Backup signal input lead; 122. Power lead group; 1221. First power lead; 1222. Second power lead; 123. Ground lead; 124. Connecting lead group; 1241. First connecting lead; 1242. Second connecting lead; 1243. Third connecting lead; 125. Signal output lead; 126. First pad; 127. Second pad;

[0038] 20. Control chip; 21. Wafer; 22. Signal input terminal; 221. Main signal input terminal; 222. Backup signal input terminal; 23. Power supply terminal; 24. Ground terminal; 25. First signal output terminal; 26. Second signal output terminal; 27. First electrical connection part;

[0039] 30. Light-emitting diode; 31. Diode body; 32. Second electrical connection part;

[0040] 40. First protrusion;

[0041] 201. Metal layer; 202. Mask; 203. Photoresist; 204. Thin film;

[0042] 300 LED color-changing light beads; 301 alloy wire. Detailed Implementation

[0043] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0044] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0045] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0046] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0047] Light-emitting diodes (LEDs) have advantages such as high efficiency, long lifespan, small size, and low power consumption, and are widely used in indoor and outdoor white light lighting, screen displays, backlights, and other fields. LED RGB lighting chips, which incorporate LEDs, are mainly used to create multi-color, full-color, and other lighting effects.

[0048] Please refer to Figure 1 Each LED color-changing light bead 300 contains a control chip and light-emitting diodes such as red, green, and blue lights. The control chip and light-emitting diodes are encapsulated by a packaging bracket and resin to form the LED color-changing light bead 300. The encapsulated LED color-changing light bead 300 is then connected to an external circuit board through exposed metal pins.

[0049] Traditional packaging methods connect the control chip and LED to the package bracket via metal wire bonding. Because the control chip and LED used in LED RGB LED beads (300 series) are very small, and their metal pins are even smaller, traditional wire bonding requires a high-precision wire bonding machine, which is the most expensive piece of equipment on the entire traditional LED RGB LED bead (300 series) production line, resulting in high production costs. Furthermore, after fixing the control chip and LED to the package bracket, each LED RGB LED bead (300 series) typically requires 9-11 alloy wires (301), and these must be bonded sequentially, one bead at a time. Therefore, the wire bonding machine is the least efficient piece of equipment on the entire traditional LED RGB LED bead (300 series) production line. The alloy wires (301) used are typically 15-20µm diameter silver alloy wires, with the total length of all wire arcs reaching 5000µm-15000µm. Therefore, the traditional internal wire bonding method for LED RGB LED beads is costly, complex, and inefficient. At the same time, due to the large mechanical stress in wire bonding, it is easy to cause a series of problems such as cracking the control chip, insufficient wire bonding push and pull force, or wire breakage and short circuit.

[0050] To solve the above-mentioned technical problems, this application provides an LED bead 100, which connects the control chip 20 and the package bracket 10 through a protruding structure, and connects the light-emitting diode 30 and the package bracket 10 through the protruding structure. The control chip 20 and the light-emitting diode 30 are fixed on the package bracket 10 and electrically connected at the same time, without the need for wire bonding, which can improve production efficiency, reduce costs, and prevent damage to the control chip 20.

[0051] An embodiment of the first aspect of this application provides an LED chip 100 for use in LED color light strips, LED guardrail tubes, LED exterior lighting, LED scene lighting, illuminated letters, LED displays, and ambient lighting for various electronic products.

[0052] Please refer to Figure 2 The LED chip 100 includes a package bracket 10, a control chip 20, multiple first fixed connection structures, a light-emitting diode (LED) 30, and multiple second fixed connection structures. The package bracket 10 has a lead circuit 12. The control chip 20 includes multiple first electrical connection portions 27. The multiple first fixed connection structures are electrically connected to the multiple first electrical connection portions 27 and the lead circuit 12, respectively, and the first fixed connection structures are in contact with both the first electrical connection portions 27 and the lead circuit 12. The LED 30 is electrically connected to the control chip 20 through the lead circuit 12; the LED 30 includes multiple second electrical connection portions 32. The multiple second fixed connection structures are electrically connected to the multiple second electrical connection portions 32 and the lead circuit 12, respectively, and the second fixed connection structures are in contact with both the second electrical connection portions 32 and the lead circuit 12.

[0053] The package bracket 10 can support the control chip 20 and the light-emitting diode 30. The package bracket 10 can also be electrically connected and fixedly connected to external devices of the lamp bead 100.

[0054] The lead circuit 12 is used for electrical connection with external devices of the LED chip 100. For example, the package bracket 10 also includes a support body 11 on which the lead circuit 12 is disposed. The support body 11 can support the lead circuit 12, the control chip 20, and the LED 30. Optionally, the package bracket 10 can be a circuit board, such as a printed circuit board or a flexible circuit board, allowing for a more compact lead circuit 12 and a smaller package bracket 10.

[0055] The control chip 20 can control the light-emitting state of the light-emitting diode 30, including working states such as emitting light, stopping emitting light, flashing light, and light brightness.

[0056] The first electrical connection portion 27 refers to the lead-out portion on the control chip 20 that is electrically connected to the package holder 10. For example, the control chip 20 also includes a wafer 21, on which the first electrical connection portion 27 is disposed.

[0057] Since the lead circuit 12 does not protrude from the outer surface of the support body 11, and the first electrical connection part 27 does not protrude from the outer surface of the wafer 21, it is difficult for the lead circuit 12 and the first electrical connection part 27 to directly contact each other to form an electrical connection.

[0058] The first fixed connection structure is a conductor and is not easily deformed. It not only conducts electricity but also provides support for the control chip 20. The first electrical connection part 27 is electrically connected to the lead circuit 12 through the first fixed connection structure. The first electrical connection part 27, through the first fixed connection structure and the lead circuit 12, can also be electrically connected to external devices of the lamp bead 100. Optionally, the first fixed connection structure is a metal conductor with good conductivity. Optionally, the first fixed connection structure can be a metal such as copper, silver, or gold, which has good conductivity. Optionally, the first fixed connection structure can also be an alloy including copper, silver, or gold, which has good conductivity.

[0059] For example, in the thickness direction of the control chip 20, a first fixing structure is connected between the first electrical connection portion 27 and the lead circuit 12. Multiple first electrical connection portions 27 are respectively fixedly connected to the lead circuit 12 through multiple first fixing connection structures. The multiple first electrical connection portions 27 are respectively in contact with and fixed to the multiple first fixing connection structures, and one end of each of the multiple first fixing connection structures facing away from the first electrical connection portion 27 is respectively in contact with and fixed to the lead circuit 12.

[0060] The light-emitting diode 30 and the control chip 20 are electrically connected to the lead circuit 12, so that the light-emitting diode 30 and the control chip 20 are electrically connected.

[0061] For example, the light-emitting diode 30 also includes a diode body 31, and a second electrical connection portion 32 is disposed on the diode body 31. The second electrical connection portion 32 is not protruding from the outer surface of the diode body 31, therefore, the lead circuit 12 and the second electrical connection portion 32 are difficult to directly contact to form an electrical connection.

[0062] The second fixed connection structure is a conductor and is not easily deformed. It not only conducts electricity but also provides support for the light-emitting diode 30. Multiple second electrical connection parts 32 are electrically connected to the lead circuit 12 through these second fixed connection structures. The second electrical connection parts 32, through the second fixed connection structures and the lead circuit 12, can be electrically connected to external devices of the LED bead 100. Optionally, the second fixed connection structure is a metallic conductor with good conductivity. Optionally, the second fixed connection structure can be made of metals such as copper, silver, or gold, which also have good conductivity. Optionally, the second fixed connection structure can also be an alloy including copper, silver, or gold, which also has good conductivity.

[0063] For example, in the thickness direction of the control chip 20, a first fixing structure is connected between the second electrical connection portion 32 and the lead circuit 12. Multiple second electrical connection portions 32 are respectively fixedly connected to the lead circuit 12 through multiple second fixing connection structures. The multiple second electrical connection portions 32 are respectively in contact with and fixed to the multiple second fixing connection structures, and one end of the multiple second fixing connection structures facing away from the second electrical connection portion 32 is in contact with and fixed to the lead circuit 12.

[0064] For example, when manufacturing the LED bead 100, the first fixed connection structure is first fixed to the first electrical connection part 27, and the second fixed connection structure is fixed to the second electrical connection part 32. Then, the control chip 20 with the first fixed connection structure is fixed to the lead circuit 12, and the light-emitting diode 30 with the second fixed connection structure is fixed to the lead circuit 12. The package bracket 10, the control chip 20, and the light-emitting diode 30 are fixed together and form an electrical connection.

[0065] The beneficial effects of this application embodiment are as follows: The control chip 20 is connected to the lead circuit 12 through the first fixed connection structure, which not only electrically connects the control chip 20 to the lead circuit 12, but also fixes the control chip 20 on the packaging bracket 10. The light-emitting diode 30 is connected to the packaging bracket 10 through the second fixed connection structure, which not only electrically connects the control chip 20 to the lead circuit 12, but also fixes the control chip 20 on the packaging bracket 10. By fixing the packaging bracket 10, the control chip 20, and the light-emitting diode 30 while simultaneously achieving electrical connection, the production efficiency of the LED bead 100 is high. This application embodiment solves the technical problem of low production efficiency of the LED bead 100. Since a wire bonding machine is not required, a series of problems such as cracking the control chip 20, insufficient wire bonding force, or wire breakage and short circuits caused by wire bonding can be avoided, resulting in high reliability of the LED bead 100.

[0066] In some embodiments, please refer to Figure 3 and Figure 4 The lead circuit 12 includes a plurality of first pads 126 and a plurality of second pads 127. The plurality of first pads 126 are electrically connected to a plurality of first fixed connection structures. The area of ​​the first pads 126 is larger than the area of ​​the first electrical connection portion 27. The first fixed connection structure includes a first protrusion 40 disposed on the control chip 20. The plurality of second pads 127 are electrically connected to a plurality of second fixed connection structures. The area of ​​the second pads 127 is larger than the area of ​​the second electrical connection portion 32. The second fixed connection structure includes a second protrusion disposed on the light-emitting diode 30.

[0067] The first pad 126 is the part of the lead circuit 12 that is connected to the first electrical connection part 27, and the second pad 127 is the part of the lead circuit 12 that is connected to the second electrical connection part 32.

[0068] The length and width of the package bracket 10 are greater than those of the control chip 20, therefore the area of ​​the first pad 126 is greater than the area of ​​the first electrical connection portion 27. For the first pad 126 and the first electrical connection portion 27, on the projection plane perpendicular to the arrangement direction of the control chip 20 and the package bracket 10, the projected area of ​​the first pad 126 is greater than the projected area of ​​the first electrical connection portion 27.

[0069] The first protrusion 40 is disposed on the control chip 20, meaning that the first protrusion 40 is fixed on the first electrical connection portion 27 of the control chip 20 before being connected to the package bracket 10; the first protrusion 40 serves as a connection terminal on the control chip 20. Optionally, the thickness of the first protrusion 40 can be 10um-30um. The first protrusion 40 has a small thickness and can protrude from the control chip 20, enabling stable contact with the lead circuit 12; for example, the thickness of the first protrusion 40 can be 10um, 20um, or 30um, etc. Optionally, the first protrusion 40 can be a multi-layer metal structure, enabling the thickness of the multi-layer metal first protrusion 40 to reach a preset value. The thickness direction of the first protrusion 40 is consistent with the thickness direction of the control chip 20.

[0070] On the projection surface of the vertical control chip 20 and the package bracket 10, the projected area of ​​the first protrusion 40 is less than or equal to the projected area of ​​the first electrical connection portion 27, and the projected area of ​​the first protrusion 40 is less than the projected area of ​​the first pad 126.

[0071] During the process of setting the first protrusion 40 on the control chip 20, multiple first protrusions 40 are simultaneously formed on the control chip 20 at the same workstation. During the process of connecting the first protrusion 40 to the first pad 126, it is not possible to connect multiple first protrusions 40 to the first pad 126 one by one; instead, the control chip 20 with multiple first protrusions 40 is connected to the package bracket 10. Since multiple first protrusions 40 on the control chip 20 need to be connected to multiple first pads 126 simultaneously, and multiple first protrusions 40 need to be aligned with multiple first pads 126 respectively, the positioning of the first protrusions 40 and the multiple first pads 126 is quite difficult. Therefore, on the projection plane perpendicular to the arrangement direction of the control chip 20 and the package bracket 10, the projected area of ​​the first protrusion 40 is smaller than the projected area of ​​the first pad 126. Thus, the first protrusion 40 only needs to be aligned with a portion of the first pad 126 to be accurately positioned on the first pad 126, reducing the difficulty of positioning multiple first protrusions 40 and multiple first pads 126.

[0072] The length and width of the package bracket 10 are greater than the length and width of the light-emitting diode 30, therefore the area of ​​the second pad 127 is greater than the area of ​​the second electrical connection portion 32. For the second pad 127 and the second electrical connection portion 32, on the projection plane perpendicular to the arrangement direction of the control chip 20 and the light-emitting diode 30, the projected area of ​​the second pad 127 is greater than the projected area of ​​the second electrical connection portion 32.

[0073] The second protrusion is provided on the light-emitting diode 30, meaning that the second protrusion is fixed to the second electrical connection portion 32 of the light-emitting diode 30 before being connected to the package bracket 10. On the projection plane perpendicular to the arrangement direction of the light-emitting diode 30 and the package bracket 10, the projected area of ​​the second protrusion is less than or equal to the projected area of ​​the second electrical connection portion 32, that is, the projected area of ​​the second protrusion is less than the projected area of ​​the second pad 127.

[0074] During the process of setting the second protrusion on the LED 30, multiple second protrusions are simultaneously formed on the LED 30 at the same station. During the process of connecting the second protrusion to the second pad 127, it is not possible to connect the multiple second protrusions to the second pad 127 one by one; instead, the LED 30 with multiple second protrusions is connected to the package support 10. Since the multiple second protrusions on the LED 30 need to be connected to the multiple second pads 127 simultaneously, and the multiple second protrusions need to be aligned with the multiple second pads 127 respectively, the positioning of the multiple second protrusions and the multiple second pads 127 is quite difficult. Therefore, on the projection plane perpendicular to the arrangement direction of the LED 30 and the package support 10, the projected area of ​​the second protrusion is smaller than the projected area of ​​the second pad 127. Thus, the second protrusion only needs to be aligned with a portion of the second pad 127 to be accurately positioned on the second pad 127, reducing the difficulty of positioning the multiple second protrusions and the multiple second pads 127.

[0075] When manufacturing the LED bead 100, firstly, the first protrusion 40 is fixed to the first electrical connection portion 27, and the second protrusion is fixed to the second electrical connection portion 32. Then, the first protrusion 40 on the control chip 20 is fixed to the first pad 126 of the package bracket 10; the second protrusion on the light-emitting diode 30 is fixed to the second pad 127 of the package bracket 10. The package bracket 10, the control chip 20, and the light-emitting diode 30 are fixed together and form an electrical connection.

[0076] The beneficial effects of this embodiment are as follows: The first protrusion 40 is disposed on the control chip 20, and the area of ​​the first protrusion 40 is smaller than the area of ​​the first pad 126. Therefore, when the control chip 20 with the first protrusion 40 is connected to the first pad 126, the first protrusion 40 only needs to be aligned with a portion of the first pad 126 to be accurately positioned on the first pad 126. This allows multiple first protrusions 40 to be accurately positioned on multiple first pads 126 simultaneously, ensuring stable conduction between the control chip 20 and the lead circuit 12. The second protrusion is disposed on the light-emitting diode 30, and the area of ​​the second protrusion is smaller than the area of ​​the second pad 127. Therefore, when the light-emitting diode 30 with the second protrusion is connected to the second pad 127, the second protrusion only needs to be aligned with a portion of the second pad 127 to be accurately positioned on the second pad 127. This allows multiple second protrusions to be accurately positioned on multiple second pads 127 simultaneously, ensuring stable conduction between the light-emitting diode 30 and the lead circuit 12.

[0077] In other embodiments, the first fixed connection structure includes a third protrusion disposed on the first pad 126, the end of the third protrusion facing away from the first pad 126 being electrically connected to the first electrical connection portion 27. The second fixed connection structure includes a fourth protrusion disposed on the second pad 127, the end of the fourth protrusion facing away from the second pad 127 being electrically connected to the second electrical connection portion 32.

[0078] When manufacturing the LED chip 100, the third protrusion is first fixed to the first pad 126, and the fourth protrusion is fixed to the second pad 127. Then, the first electrical connection portion 27 of the control chip 20 is fixed to the third protrusion, and the second electrical connection portion 32 of the light-emitting diode 30 is fixed to the fourth protrusion. The package bracket 10, the control chip 20, and the light-emitting diode 30 are fixed together and form an electrical connection.

[0079] In other embodiments, the first fixed connection structure includes a third protrusion disposed on the first pad 126. One end of the third protrusion facing away from the first pad 126 is fixed to one end of the first protrusion 40 facing away from the first electrical connection portion 27, and the third protrusion is electrically connected to the first protrusion 40.

[0080] The second fixed connection structure includes a fourth protrusion disposed on the second pad 127. One end of the fourth protrusion facing away from the second pad 127 is fixed to one end of the second protrusion facing away from the second electrical connection portion 32, and the fourth protrusion is electrically connected to the second protrusion.

[0081] When manufacturing the LED bead 100, the first protrusion 40 is fixed to the first electrical connection portion 27, and the second protrusion is fixed to the second electrical connection portion 32; the third protrusion is fixed to the first solder pad 126, and the fourth protrusion is fixed to the second solder pad 127. Then, the first protrusion 40 on the control chip 20 is fixed to the third protrusion, and the second protrusion on the light-emitting diode 30 is fixed to the fourth protrusion. The package bracket 10, the control chip 20, and the light-emitting diode 30 are fixed together and form an electrical connection.

[0082] In some embodiments, please refer to Figures 2 to 4 The first protrusion 40 is connected to the first pad 126 through the first welding structure. In other words, the first protrusion 40 is welded to the package bracket 10. The control chip 20 with the first protrusion 40 can be welded to the package bracket 10 by surface mounting, which has high production efficiency.

[0083] Optionally, the first welding structure includes solder and solder paste, etc.

[0084] In other embodiments, please refer to Figures 2 to 4 The first protrusion 40 can also be fixed to the first pad 126 by the first adhesive structure. Optionally, the first adhesive structure can be conductive adhesive, etc.

[0085] In some embodiments, please refer to Figures 2 to 4 The second protrusion is connected to the second pad 127 through the second welding structure. In other words, the second protrusion is welded to the second pad 127. The light-emitting diode 30 with the second protrusion can be welded to the package bracket 10 by surface mounting, which has high production efficiency.

[0086] Optionally, the second welding structure includes solder and solder paste, etc.

[0087] In other embodiments, please refer to Figures 2 to 4 The second protrusion can also be fixed to the second pad 127 by the second adhesive structure.

[0088] In some embodiments, please refer to Figures 2 to 4 The first protrusion 40 is connected to the first pad 126 through the first welding structure, and the second protrusion is connected to the second pad 127 through the second welding structure.

[0089] In some embodiments, please refer to Figures 2 to 4 The area of ​​the first protrusion 40 projected onto the plane perpendicular to the thickness direction of the control chip 20 is 1600 μm. 2 -4900um 2 .

[0090] On a plane perpendicular to the thickness direction of the control chip 20, if the projected area of ​​the first protrusion 40 is less than 1600 μm...2 If the contact area between the first protrusion 40 and the first pad 126 is small, the connection will be weak; if the projected area of ​​the first protrusion 40 is greater than 4900um 2 Therefore, the first protrusion 40 occupies a large area on the control chip 20, and the overall volume of the control chip 20 is large.

[0091] Optionally, the projected area of ​​the first protrusion 40 on the plane perpendicular to the thickness direction of the control chip 20 can be 1600 μm. 2 The first protrusion 40 occupies a small area on the control chip 20, resulting in a small overall volume of the control chip 20. For example, the orthographic projection of the first protrusion 40 on a plane perpendicular to the thickness direction of the control chip 20 can be 40µm × 40µm.

[0092] Optionally, the projected area of ​​the first protrusion 40 on the plane perpendicular to the thickness direction of the control chip 20 can be 4900 μm. 2 The first protrusion 40 has a larger contact area with the first pad 126, resulting in a more secure connection between the control chip 20 and the package bracket 10. For example, the orthographic projection of the first protrusion 40 on a plane perpendicular to the thickness direction of the control chip 20 can be 70µm × 70µm.

[0093] Optionally, the projected area of ​​the first protrusion 40 on the plane perpendicular to the thickness direction of the control chip 20 can also be 2500µm. 2 3600um 2 For example, on a plane perpendicular to the thickness direction of the control chip 20, the orthographic projection of the first protrusion 40 can be 50um × 50um.

[0094] The beneficial effect of this application embodiment is that: on the plane in the thickness direction of the vertical control chip 20, the orthogonal projection area of ​​the first protrusion 40 is limited to the above range, which can not only make the connection between the control chip 20 and the packaging bracket 10 firm, but also control the control chip 20 to be in a smaller volume.

[0095] In some embodiments, please refer to Figure 2 , Figure 3 and Figure 5 The lead circuit 12 further includes a signal input lead group 121, a power supply lead group 122, a ground lead 123, and a connecting lead group 124. The control chip 20 includes a signal input terminal 22, a power supply terminal 23, a ground terminal 24, and a first signal output terminal 25. The signal input terminal 22 is electrically connected to the signal input lead group 121, the power supply terminal 23 is electrically connected to the power supply lead, and the ground terminal 24 is electrically connected to the ground lead 123. The positive terminal of the light-emitting diode 30 is electrically connected to the power supply lead group 122, and the negative terminal of the light-emitting diode 30 is electrically connected to the first signal output terminal 25 through the connecting lead group 124.

[0096] The signal input lead assembly 121 is used to electrically connect an external signal input device of the LED bead 100 to the signal input terminal 22, so that the input signal is transmitted to the signal input terminal 22, and the control chip 20 controls the LED 30 to work according to the input signal. Optionally, the signal input device can be a controller, etc.

[0097] The power lead group 122 is used to connect the external power supply of the lamp bead 100 to the power supply terminal 23 and the positive terminal of the light-emitting diode 30 respectively, so that the power supply can supply power to the control chip 20 and the light-emitting diode 30.

[0098] The grounding lead 123 is used to electrically connect the grounding terminal 24 to the circuit board outside the lamp bead 100, so that the lamp bead is grounded and the circuit of the control chip 20 and the light-emitting diode 30 forms a loop.

[0099] The connecting lead group 124 electrically connects the first signal output terminal 25 to the negative terminal of the light-emitting diode 30. The control chip 20 can control the state of the light-emitting diode 30 by controlling the current of the first signal output terminal 25.

[0100] The signal input terminal 22, power supply terminal 23, ground terminal 24, and first signal output terminal 25 each include a first electrical connection portion 27. These terminals are electrically connected to the signal input lead group 121, power supply lead group 122, ground lead 123, and connecting lead group 124 respectively via a first fixed connection structure. The positive and negative terminals of the light-emitting diode 30 each include a second electrical connection portion 32. These terminals are electrically connected to the power supply lead group 122 and connecting lead group 124 respectively via a second fixed connection structure.

[0101] Optionally, the ends of the signal input lead group 121, power lead group 122, and ground lead 123 that are away from the control chip 20 and the light-emitting diode 30 are located at the edge of the main body of the package bracket 10, so as to facilitate the connection of external devices to the lamp bead 100.

[0102] The beneficial effects of this application embodiment are that the signal input lead group 121, power lead group 122, ground lead 123 and connection lead group 124 in the lead circuit 12 facilitate the connection of external devices to the lamp bead 100, thereby facilitating the electrical connection of the control chip 20 and the diode to external devices of the lamp bead 100.

[0103] In other embodiments, the lead circuit 12 may include an input lead group, a ground lead 123, and a connecting lead group 124, but does not include a power lead group 122. In use, wires are connected between the power supply and the power supply terminal 23 and the positive terminal of the light-emitting diode 30, respectively.

[0104] In some embodiments, please refer to Figure 2 and Figure 5 The power lead assembly 122 includes a first power lead 1221, and the power terminal 23 and the positive terminal of the light-emitting diode 30 are electrically connected to the first power lead 1221.

[0105] The first power lead 1221 can connect the control chip 20 and the light-emitting diode 30 to the power supply respectively, and the control chip 20 and the light-emitting diode 30 can share a power supply.

[0106] The beneficial effects of this embodiment are as follows: using a first power lead 1221, the power terminal 23 and the positive terminal of the light-emitting diode 30 can be connected to an external power source of the lamp bead 100 respectively, and the lead circuit 12 has a relatively simple structure. In use, the lamp bead 100 is connected to a power source, and the connection speed is relatively fast.

[0107] In other embodiments, please refer to Figure 10 The power lead assembly 122 includes a first power lead 1221 and a second power lead 1222. The power terminal 23 and the positive terminal of the LED 30 are electrically connected to the first power lead 1221 and the second power lead 1222, respectively. The first power lead 1221 and the second power lead 1222 are used to connect two power supplies. The two power supplies can provide different voltages to the control chip 20 and the LED 30, respectively. Moreover, the power load connected to the control chip 20 is smaller, and the control signal generated by the control chip 20 is more stable, which can stably control the light emission state of the LED 30.

[0108] In some embodiments, please refer to Figures 6 to 9 The system has two signal input terminals 22, namely a main signal input terminal 221 and a backup signal input terminal 222. The signal input lead group 121 includes two signal input leads, which are electrically connected to the main signal input terminal 221 and the backup signal input terminal 222, respectively.

[0109] The main signal output terminal can receive input signals via the signal input lead, and the backup signal input terminal 222 can receive input signals via another signal input lead. Please refer to [reference needed]. Figure 6 and Figure 9 The two signal input leads electrically connected to the main signal input terminal 221 and the backup signal input terminal 222 are the main signal input lead 1211 and the backup signal input lead 1212, respectively.

[0110] In use, either the main signal input terminal 221 or the backup signal input terminal 222 is used to receive input signals. The main signal input terminal 221 is preferred for receiving input signals.

[0111] The beneficial effects of this application embodiment are that both the main signal input terminal 221 and the backup signal input terminal 222 can receive input signals through the signal input lead. After the main signal input terminal 221 is damaged, the backup signal input terminal 222 can be used to receive input signals, which increases the reliability of the lamp bead 100.

[0112] In some embodiments, please refer to Figure 6 , Figure 7 and Figure 9 Multiple light-emitting diodes 30 are provided, and multiple first signal output terminals 25 are provided; the connecting lead group 124 includes multiple connecting leads, and the two ends of each connecting lead are electrically connected to the corresponding light-emitting diode 30 and the corresponding first signal output terminal 25, respectively. The multiple connecting leads are of equal length and parallel to each other.

[0113] Each LED 30 corresponds to a first signal output terminal 25 that controls the LED 30, and each LED 30 is connected to a first signal output terminal 25 that controls the LED 30 through a connecting lead.

[0114] Multiple connecting leads are of equal length and parallel to each other. In other words, along the length of the connecting leads, the overall size of the multiple connecting leads is equal to the size of a single connecting lead.

[0115] Multiple first signal output terminals 25, connected to multiple connection leads, are arranged in a straight line. Optionally, the multiple first signal output terminals 25 are located on the same edge of the control chip 20 near the light-emitting diodes 30, and the distance between the multiple first signal output terminals 25 and the multiple light-emitting diodes 30 is relatively close to facilitate electrical connection between the first signal output terminals 25 and the multiple light-emitting diodes 30.

[0116] Optionally, multiple LEDs 30 can be used to emit light of different colors, and the overall color of the LED bead 100 can be adjusted by regulating the brightness of each LED 30. Optionally, multiple LEDs 30 can also be used to emit light of the same color, and adjusting the brightness of multiple LEDs 30 can increase the overall brightness adjustment range of the LED bead 100. Optionally, two, three, or five LEDs can be used, etc. For examples, please refer to [reference needed]. Figure 1 , Figure 5 , Figure 6 and Figure 9 There are three light-emitting diodes 30, which are used to emit red light, blue light and green light respectively; the three connecting leads connected to the three light-emitting diodes 30 are the first connecting lead 1241, the second connecting lead 1242 and the third connecting lead 1243 respectively.

[0117] The beneficial effects of this application embodiment are as follows: setting multiple light-emitting diodes 30 allows for adjustment of the brightness of each light-emitting diode 30, which in turn allows for adjustment of the overall color of the lamp bead 100, thereby increasing the overall brightness adjustment range of the lamp bead 100. Since multiple connecting leads are of equal length and parallel to each other, the overall size of the multiple connecting leads is equal to the size of a single connecting lead. In the length direction of the connecting leads, the overall space occupied by the multiple connecting leads on the packaging bracket 10 is smaller, resulting in a more compact overall structure for the packaging bracket 10 and allowing for a smaller volume.

[0118] In some embodiments, please refer to Figure 2 , Figure 3 and Figure 5 The control chip 20 also includes a second signal output terminal 26; the lead circuit 12 also includes a signal output lead 125 electrically connected to the second signal output terminal 26.

[0119] The signal output lead 125 is used to electrically connect the second signal output terminal 26 to the signal receiving device outside the lamp bead 100. The second signal output terminal 26 is used to transmit the input signal received by the signal input terminal 22 to other signal receiving devices outside the lamp bead 100 through the signal output lead 125, so as to facilitate the control of the lamp bead 100 to work together with other signal receiving devices.

[0120] For example, please refer to Figure 3 The signal input lead group 121, the ground lead 123, the signal output lead 125, and the power supply lead group 122 are arranged in a clockwise order.

[0121] The second signal output terminal 26 includes a first electrical connection portion 27, and the second signal output terminal 26 is connected to the signal output lead 125 through a first fixed connection structure.

[0122] In some embodiments, please refer to Figure 8 The control chip 20 is a cuboid, and eight first protrusions 40 are provided on the control chip 20. The eight first protrusions 40 are divided into two rows, and the two rows of first protrusions 40 are spaced apart along the width direction of the control chip 20. Each row of first protrusions 40 is arranged along the length direction of the control chip 20.

[0123] In some embodiments, please refer to Figure 3 and Figure 7 The lead circuit 12 on the packaging bracket 10 is a traced line. The traced line is a conductive connection line structure formed by etching. The traced line is used to realize the electrical connection between the ends. The lead circuit 12 has high production efficiency and is stably connected to the support body 11.

[0124] In some embodiments, the LED chip 100 further includes a package, which, together with the package holder 10, forms a package space. The control chip 20 and the light-emitting diode 30 are located within the package space. A portion of the signal input lead group 121, a portion of the ground lead 123, a portion of the signal output lead 125, and a portion of the power lead group 122 are disposed outside the package space to facilitate connection of external devices to the LED chip 100. The package protects the control chip 20 and the light-emitting diode 30.

[0125] Optionally, the encapsulation body can be made of resin, insulating adhesive, etc., which can make the connection between the light-emitting diode 30, the control chip 20, and the encapsulation bracket 10 more secure. Optionally, the outer packaging of the encapsulation body can be provided as a shell to further enhance protection. Optionally, other functional components can also be provided on the outer packaging of the encapsulation body.

[0126] In some embodiments, please refer to Figures 2 to 5 The LED chip 100 includes a package bracket 10, a control chip 20, multiple first fixed connection structures, a light-emitting diode 30, and multiple second fixed connection structures. The package bracket 10 has a lead circuit 12. The control chip 20 includes multiple first electrical connection portions 27. The multiple first fixed connection structures are electrically connected to the multiple first electrical connection portions 27 and the lead circuit 12, respectively, and are in contact with both the first electrical connection portions 27 and the lead circuit 12. The lead circuit 12 includes multiple first pads 126 and multiple second pads 127. The multiple first pads 126 are electrically connected to the multiple first fixed connection structures, and the area of ​​the first pads 126 is larger than the area of ​​the first electrical connection portions 27. The first fixed connection structure includes a first protrusion 40 disposed on the control chip 20.

[0127] The light-emitting diode 30 is electrically connected to the control chip 20 via the lead circuit 12; the light-emitting diode 30 includes a plurality of second electrical connection portions 32. A plurality of second fixed connection structures are electrically connected to the plurality of second electrical connection portions 32 and the lead circuit 12, respectively, and the second fixed connection structures are in contact with both the second electrical connection portions 32 and the lead circuit 12. A plurality of second pads 127 are electrically connected to the plurality of second fixed connection structures, the area of ​​the second pads 127 being larger than the area of ​​the second electrical connection portions 32, and the second fixed connection structure includes a second protrusion disposed on the light-emitting diode 30.

[0128] The lead circuit 12 also includes a signal input lead group 121, a power supply lead group 122, a ground lead 123, and multiple connecting leads. The control chip 20 includes a signal input terminal 22, a power supply terminal 23, a ground terminal 24, and multiple first signal output terminals 25. The signal input terminal 22 is electrically connected to the signal input lead group 121, the power supply terminal 23 is electrically connected to the power supply lead, and the ground terminal 24 is electrically connected to the ground lead 123. The positive terminal of the light-emitting diode 30 is electrically connected to the power supply lead group 122, and the negative terminal of the light-emitting diode 30 is electrically connected to the first signal output terminal 25 through the connecting lead group 124. Multiple light-emitting diodes 30 are provided, and the two ends of each connecting lead are electrically connected to the corresponding light-emitting diode 30 and the corresponding first signal output terminal 25, respectively. The multiple connecting leads are of equal length and parallel to each other.

[0129] In some embodiments, please refer to Figure 11 The manufacturing method of the first protrusion 40 includes the following steps:

[0130] S1, please refer to Figure 12 A metal layer 201 is grown on the side of the wafer 21 of the control chip 20 that has the first electrical connection portion 27. Optionally, the metal layer 201 can be grown using a metal deposition method. Optionally, the thickness of the metal layer 201 is 10um-30um. Optionally, the thickness of the metal layer 201 is 10um, 20um, or 30um, etc. Optionally, the metal layer 201 can be a metal such as copper, silver, or gold, or an alloy including copper, silver, or gold, and has good electrical conductivity.

[0131] S2, overlay mask 202; please refer to... Figure 13 A mask 202 is used to cover the side of the metal layer 201 that is away from the wafer 21. The mask 202 has a through hole at the position opposite to the first electrical connection portion 27 along the thickness direction of the metal layer 201, that is, the mask 202 does not cover the metal layer 201 on the first electrical connection portion 27.

[0132] S3, apply photoresist 203; please refer to... Figure 14 Photoresist 203 is applied to the metal layer 201 not covered by mask 202, and then mask 202 is removed, leaving photoresist 203 on the metal layer 201 corresponding to the first electrical connection portion 27.

[0133] S4, etch the metal layer 201 to form the first protrusion 40; please refer to... Figure 15 During the etching process of the metal layer 201, the metal layer 201 outside the first electrical connection portion 27 is etched away. Since the metal layer 201 corresponding to the first electrical connection portion 27 is provided with photoresist 203, the metal layer 201 on the first electrical connection portion 27 is retained, and the metal layer 201 forms a first protrusion 40 on the first electrical connection portion 27.

[0134] S5, please refer to Figure 16 Clean and remove the photoresist 203 from the surface of the metal layer 201.

[0135] The first protrusion 40 is fabricated by etching, which allows for more precise control over its length, width, and thickness. This makes the first protrusion 40 less prone to short-circuiting with other devices, resulting in better reliability. The etching method also allows for smaller dimensions of the first protrusion 40, resulting in a smaller distance between adjacent protrusions and a smaller overall size of the control chip 20.

[0136] In some embodiments, please refer to Figure 17 The manufacturing method of the first protrusion 40 includes the following steps:

[0137] S1, Covering film 204; Please refer to... Figure 18 An opaque thin film 204 is covered on the side of the wafer 21 of the control chip 20 that has the first electrical connection portion 27.

[0138] S2, create an opening in the thin film 204; please refer to... Figure 18 An opening is made in the film 204 along its own thickness direction, directly opposite the first electrical connection portion 27, to expose the first electrical connection portion 27.

[0139] S3, please refer to Figure 19 A metal layer 201 is electroplated on the wafer 21 covered with the thin film 204. Optionally, the thickness of the metal layer 201 is 10um-30um. Optionally, the thickness of the metal layer 201 is 10um, 20um, or 30um, etc. Optionally, the metal layer 201 can be a metal such as copper, silver, or gold, or an alloy including copper, silver, or gold, and has good electrical conductivity.

[0140] S4, After electroplating is complete, the thin film 204 is removed, forming the first protrusion 40; please refer to... Figure 16 While removing the film 204, the metal layer 201 on the film 204 is removed, while the metal layer 201 on the first electrical connection portion 27 is retained and forms the first protrusion 40.

[0141] Compared to mask 202, thin film 204 can be set to a larger area, capable of covering multiple wafers 21 at once, resulting in higher efficiency in fabricating the first bump 40. Moreover, this method involves fewer steps, is simpler and more convenient to operate, has relatively lower costs, and also facilitates the recycling of the metal layer 201 on thin film 204.

[0142] The second aspect of this application also provides a light-emitting device, which includes a plurality of lamp beads 100 according to any one of the first aspect embodiments, and the plurality of lamp beads 100 are electrically connected to each other.

[0143] Optionally, the signal input lead group 121 and signal output lead 125 of one LED 100 can be electrically connected to the signal output lead 125 of an adjacent LED 100 and the signal input lead group 121 of another adjacent LED 100, so that the input signal is transmitted sequentially along the arrangement direction of the multiple LEDs 100, and the LEDs 100 emit light in the same state.

[0144] Optionally, multiple LEDs 100 can be connected to a single power source, allowing for simultaneous power supply or power cut-off of multiple LEDs 100.

[0145] The beneficial effects of the embodiments of this application are as follows: the light-emitting device includes the lamp bead 100 in the first aspect embodiment, the light-emitting device has high production efficiency, and has all the effects of the lamp bead 100.

[0146] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A type of LED bead, characterized in that, include: A packaging bracket, wherein the packaging bracket is provided with lead circuitry; The control chip includes a plurality of first electrical connection portions; Multiple first fixed connection structures are electrically connected to multiple first electrical connection portions and the lead circuit, and the first fixed connection structures are in contact with the first electrical connection portions and the lead circuit; The light-emitting diode is electrically connected to the control chip via the lead circuit; the light-emitting diode includes multiple second electrical connection portions. Multiple second fixed connection structures are electrically connected to multiple second electrical connection portions and the lead circuit, respectively, and the second fixed connection structures are in contact with the second electrical connection portions and the lead circuit.

2. The LED bead as described in claim 1, characterized in that, The lead circuit includes a plurality of first pads and a plurality of second pads. The plurality of first pads are electrically connected to a plurality of first fixed connection structures respectively. The area of ​​the first pad is larger than the area of ​​the first electrical connection portion. The first fixed connection structure includes a first protrusion disposed on the control chip. Multiple second pads are electrically connected to multiple second fixed connection structures respectively. The area of ​​the second pad is larger than the area of ​​the second electrical connection portion. The second fixed connection structure includes a second protrusion disposed on the light-emitting diode.

3. The LED bead as described in claim 2, characterized in that, The first protrusion is connected to the first pad via a first welding structure; and / or, The second protrusion is connected to the second pad via a second welding structure.

4. The LED bead as described in claim 2, characterized in that, The area of ​​the first protrusion projected onto a plane perpendicular to the thickness direction of the control chip is 1600 μm. 2 -4900um 2 .

5. The lamp bead as described in any one of claims 1-4, characterized in that, The lead circuit further includes a signal input lead group, a power supply lead group, a ground lead, and a connecting lead group; the control chip includes a signal input terminal, a power supply terminal, a ground terminal, and a first signal output terminal. The signal input terminal is electrically connected to the signal input lead group, the power supply terminal is electrically connected to the power supply lead, and the ground terminal is electrically connected to the ground lead; the positive terminal of the light-emitting diode is electrically connected to the power supply lead group, and the negative terminal of the light-emitting diode is electrically connected to the first signal output terminal through the connecting lead group.

6. The LED bead as described in claim 5, characterized in that, The power lead assembly includes a first power lead, and the power terminal and the positive terminal of the light-emitting diode are respectively electrically connected to the first power lead.

7. The LED bead as described in claim 5, characterized in that, The signal input terminal is provided with two terminals, namely a main signal input terminal and a backup signal input terminal; the signal input lead group includes two signal input leads, which are electrically connected to the main signal input terminal and the backup signal input terminal, respectively.

8. The LED bead as described in claim 5, characterized in that, The light-emitting diodes are provided in multiple ways, and the first signal output terminals are provided in multiple ways; the connecting lead group includes multiple connecting leads, and the two ends of each connecting lead are electrically connected to the corresponding light-emitting diode and the corresponding first signal output terminal, respectively. The multiple connecting leads are of equal length and are parallel to each other.

9. The LED bead as described in claim 5, characterized in that, The control chip also includes a second signal output terminal; the lead circuit also includes a signal output lead electrically connected to the second signal output terminal.

10. A light-emitting device, characterized in that, It includes a plurality of LEDs as described in any one of claims 1-9, and the plurality of LEDs are electrically connected to each other.

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