Double counterflow heat dissipation case
By designing a dual-convection heat dissipation casing, utilizing bidirectional airflow and a multi-layer heat sink structure, the problems of uneven internal temperature and poor heat dissipation were solved, achieving a more uniform temperature distribution and a more efficient heat dissipation effect.
CN224328389UActive Publication Date: 2026-06-05MEDELA HARDWARE (DONGGUAN) CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- MEDELA HARDWARE (DONGGUAN) CO LTD
- Filing Date
- 2025-06-09
- Publication Date
- 2026-06-05
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Figure CN224328389U_ABST
Abstract
The utility model relates to a technical field of casing, concretely is a double counter current heat dissipation casing, including casing and side plate, side plate detachable installation at one side of casing, still include second heat dissipation mechanism and two first heat dissipation mechanism, second heat dissipation mechanism installs at the inner chamber top of casing, two first heat dissipation mechanism is misaligned and set up on the two side walls of casing, and every first heat dissipation mechanism all includes first air outlet, first heat absorption subassembly, second heat dissipation mechanism includes second air outlet, second heat absorption subassembly, a plurality of second through -hole and a plurality of second heat dissipation fan, through setting up two misaligned first heat dissipation mechanism, when first heat dissipation fan works, the cold air flow of outside can enter the inside of casing from two directions, and directly acts on computer working element on support, forms double counter current heat dissipation with the heat that computer working element on emits, to be able to take away the heat on computer working element surface, realizes heat dissipation.
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