A heat dissipation assembly for a small laminated PCB board

Abstract

The utility model discloses a small -size laminated PCB's heat dissipation subassembly, including laminated PCB, installation base and heat dissipation insert. The installation base is equipped with the insertion blind hole and the locating insertion rod, the laminated PCB is internally provided with the through -drilling, and is fixed with the locating insertion rod through the locating mounting hole. The heat dissipation insert includes the annular base of metal material and the heat dissipation wire, and the annular base is equipped with the sliding slot in the circumference, and the slidable arc baffle is connected through the spring in the sliding slot. When installing, the inclined baffle is extruded in the inner wall of drilling, and the arc baffle is guided to contract to the center, and the arc baffle is tightly attached to the inner wall of drilling after spring reset, and forms the efficient heat conduction path. The heat is transferred to the arc baffle through the etching copper foil, and then is led out through the heat dissipation wire of annular base and high -thermal conductivity material. The design is through the elastic contact and the structure optimization, and the locating insertion rod and the insertion blind hole ensure the installation stability simultaneously, and is applicable to small -size high density electronic equipment.

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